tsmc cmos 0.13 um
Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
Text: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank
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tsmc cmos 0.13 um
Abstract: "embedded dram" tsmc
Text: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank
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tristate buffer cmos
Abstract: TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um
Text: SoC-RAMTM PL Memory Core 0.18µm 4.97Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank
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97Mbit
tristate buffer cmos
TSMC 0.18 um CMOS
"embedded dram" tsmc
tsmc cmos 0.13 um
TSMC 0.18um
tsmc cmos 0.13
MOSAID Technologies
TSMC cmos 0.18um
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ISSI
Abstract: TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM
Text: Memory Based Solutions ISSI ¨ Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ¨ Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990
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ISSI198
ISSI
TSMC embedded Flash
TSMC Flash memory 0.18
motorola tsmc flash
Integrated Silicon Solution Inc
"embedded dram" tsmc
memory issi
tsmc 0.18 flash
TSMC embedded EEPROM
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TSMC embedded Flash
Abstract: TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc
Text: Over Ten Years of High-Performance Memories ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ® Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990
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ISSI198
TSMC embedded Flash
TSMC Flash memory 0.18
ISSI
Integrated Silicon Solution Inc
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roadmap ISSI
Abstract: IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI
Text: Memory Based Solutions ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI_498 04/09/98 ® Integrated Silicon Solution, Inc. Memory Based Solutions ISSI Milestones • • • • • • • Incorporated - 1988 First Foundry Partnership TSMC - 1990
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IS22C020
IS22C040
IS22C041
IS22C042
IS82C600
roadmap ISSI
IS61C1024
IS61C64AH
IS61C64B
IS62C64
IS89C52
IS25M080A5T2R
IS80C32
flash memory 5v 16M-bit 48 TSOP
ISSI
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EV-48004A
Abstract: gt-64011-p GT-32011 GT-64111 DLink ADSL GT-64010A GT-64120 R4640 GT48006A GT-48006-P
Text: *$/,/ 2 7(&+12/2*< *$ / , / (2 7(&+ 1 2 /2 * < 6+257 250 &$7$/2* 6SULQJ 6<67(0 &21752//(56 IRU 5,6& 352&(66256 6:,7&+(' (7+(51(7 &21752//(56 5(027( $&&(66 &21752//(56 Notices Copyright 1998 Galileo Technology, Inc. All Rights Reserved. GalNet , GalaxyTM, Galileo Technology, Galileo and the Galileo logo are
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S-163
EV-48004A
gt-64011-p
GT-32011
GT-64111
DLink ADSL
GT-64010A
GT-64120
R4640
GT48006A
GT-48006-P
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EZchip NP3
Abstract: MIPS34k
Text: NPA-0 Access Netw ork Processor w ith I ntegrated Traffic Management and Host CPU Core Product Brief Package / Process / Pow er Highlights Single-chip, programmable, wire-speed network processor with 5-Gigabit aggregate throughput Flexible processing with programmable packet parsing,
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MEF15
23x23
EZchip NP3
MIPS34k
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ARCHITECTURE OF ARM 7 TDMA
Abstract: hard driver ic oki packaging video phone H263 audio adc dac H.263 encoder chip g.723.1 codec chip TSMC Flash IP
Text: Semiconductor Business With a Customer Perspective - SPA As A Solution for System on Chip - May 4, 1998 Katsumasa Shinozuka Senior Managing Director Oki Electric Industry Co., Ltd. 1 Outline 1. Industry Paradigm Shift • IT Industry Evolution • Diversified Customer Needs
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SHDSL chips
Abstract: elektronik DDR "embedded dram" tsmc
Text: glossar Glossar 3G Kurz für ‘dritte Generation’. Wird für Mobiltelefonverbindungen verwendet, die den heutigen Standard hinsichtlich Geschwindigkeit, Kapazität und technischer Ausgereiftheit des Datentransports bei weitem übertreffen. ADSL ‘Asymmetric Digital Subscriber Line’ asymmetrische digitale Anschlussleitung .
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EZchip NP3
Abstract: GPON ONT block diagram
Text: NPA-1/ NPA-2/ NPA-3 Access Netw ork Processors w ith I ntegrated Traffic Management Product Brief Highlights Target Applications Single-chip, programmable, wire-speed network processor with 10-Gigabit aggregate throughput Line card, service card and pizza
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10-Gigabit
EZchip NP3
GPON ONT block diagram
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car speed control using bluetooth advantages and
Abstract: microprocessors used in car ABS microprocessors used in car ARM922T EPXA10 IDB1394 telematics control unit
Text: Automotive Solutions October 2002 Altera: Driving Innovation Electronic systems are crucial to product differentiation in the automotive market. Consumers are demanding advanced vehicle safety systems and information services, compelling automakers to add more complex and innovative electronic
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ARM922T
car speed control using bluetooth advantages and
microprocessors used in car ABS
microprocessors used in car
EPXA10
IDB1394
telematics control unit
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80186xl
Abstract: c80186 C80186XL 16X16 80C186XL C80187 "embedded dram" tsmc i8259a TSMC embedded Flash TSMC Flash IP
Text: Control Unit: − 9-level deep and 1-byte wide C80186XL 80186XL-Compliant Chip Replacement 16-bit Microcontroller Core instruction queue − Independent instruction ex- ecution stages allow instructions to overlap Arithmetic Logic Unit: − 16-bit arithmetic and logical
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C80186XL
80186XL-Compliant
16-bit
16-bit
80C186XL
80186XL
80c86
80c186
c80186
C80186XL
16X16
C80187
"embedded dram" tsmc
i8259a
TSMC embedded Flash
TSMC Flash IP
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TSMC Flash memory 0.18
Abstract: tsmc 0.18 flash 80186EC 8259A c80186 intel FPGA 80C186EC 16X16 80C186EC C80187 TSMC Flash IP
Text: Control Unit: − 9-level deep and 1-byte wide instruction queue C80186EC 80186EC-Compliant Chip Replacement 16-bit Microcontroller Core − Independent instruction ex- ecution stages allow instructions to overlap Arithmetic Logic Unit: − 16-bit arithmetic and logical
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C80186EC
80186EC-Compliant
16-bit
16-bit
80C186EC
80186EC
80c86
80c186
TSMC Flash memory 0.18
tsmc 0.18 flash
8259A
c80186
intel FPGA 80C186EC
16X16
C80187
TSMC Flash IP
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cmos tsmc 0.18
Abstract: TSMC embedded Flash TSMC Flash memory 0.18 tsmc eeprom i8052 tsmc 0.18 flash ISSI i8051 internal structure tsmc cmos 0.35 0.35 tsmc cmos
Text: C A P A B I L I T I E S Partners in Progress. for Memory Based Solutions. ISSI Integrated Silicon Solution, Inc. ISSI ® Integrated Silicon Solution, Inc. Partners in Progress. for Memory Based Solutions. Introduction Partnerships Excellence by Design
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45-90ns
cmos tsmc 0.18
TSMC embedded Flash
TSMC Flash memory 0.18
tsmc eeprom
i8052
tsmc 0.18 flash
ISSI
i8051 internal structure
tsmc cmos 0.35
0.35 tsmc cmos
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ARM1136 JF-S
Abstract: micrologic 0138E ARM1136JF-S CM946E-S free circuit diagram of motherboard types of motherboard CM966E-S ARM1136JF-S pin configuration ARM966E-S
Text: Integrator /CM926EJ-S, CM946E-S, CM966E-S, CM1026EJ-S, and CM1136JF-S HBI-0087: CM926EJ-S, CM1026EJ-S, and CM1136JF-S HBI-0066: CM946E-S and CM966E-S User Guide Copyright 2000-2005 ARM Limited. All rights reserved. ARM DUI 0138E Integrator/CM926EJ-S, CM946E-S, CM966E-S, CM1026EJ-S,
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/CM926EJ-S,
CM946E-S,
CM966E-S,
CM1026EJ-S,
CM1136JF-S
HBI-0087:
CM926EJ-S,
CM1136JF-S
HBI-0066:
ARM1136 JF-S
micrologic
0138E
ARM1136JF-S
CM946E-S
free circuit diagram of motherboard
types of motherboard
CM966E-S
ARM1136JF-S pin configuration
ARM966E-S
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saf7730
Abstract: saf7730 audio wind energy simulink matlab turbo codes matlab simulation program Philips SAF7730 64 point FFT radix-4 VHDL documentation CW4512 DMC550 SP1403 saf77
Text: THE LIST OF RESOURCES SUPPORTING DIGITALSIGNAL PROCESSING CONTINUES TO EXPAND. CHECK OUT THE LATEST ADDITIONS. By Robert Cravotta, Technical Editor www.edn.com Welcome to the 2004 edition of the EDN DSP directory. Despite some companies dropping out of the DSP market, whether due to
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EJTAG Tiny Tools CPLD
Abstract: TSMC eDRAM ATML U 932 compaq presario ATML 932 Trident plus broadcom Siemens lg Ni1000 temperature sensor Photobit PB-100 irf 3502 SUN HOLD MD-5
Text: SEMICONDUCTOR TIMES FEBRUARY 1999 FEBRUARY 1999 / 1 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope LTX announced that Accelerix has purchased and taken delivery of a Delta STE, configurable to 512 digital channels, mixed signal instruments and the memory test option. Accelerix, a fabless
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TSMC 40nm
Abstract: ep330 microprocessor 80286 internal architecture cots fpga radiation fpga radiation COTS manufacturer list cots radiation radar sensor specification vhdl source code for 8086 microprocessor working of 80286 I386
Text: White Paper Military Benefits of the Managed Risk Process at 40 nm Introduction Every successive technology node in the silicon manufacturing process timeline presents new and significant technical challenges. Historically, these challenges have been addressed head-on with the knowledge that
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power amplifier ic ta2040
Abstract: Nokia 6100 LCD TA2040 Transceiver Broadcom 3G RF interfacing 8051 with bluetooth modem Tripath TA2040 AMPLIFIER pixelworks L7205 tft interface with 8051 trw radar ac
Text: SEMICONDUCTOR TIMES JULY 2000 / 1 JULY 2000 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope Bay Microsystems Bay Microsystems was recently founded to develop chips. What kind? The company wouldn’t disclose any details to us. One rumor is “high-speed interfaces” whatever
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Trends And Opportunities In Semiconductor Licensing
Abstract: FinFET
Text: Semiconductor Licensing Trends Trends And Opportunities In Semiconductor Licensing By Stefan Tamme, Stephen Schott, Dogan Gunes, Jeffrey Wallace, Richard Boadway, Frank Razavi, and Marc Pépin Summary The following article examines the impact of current business, technology, and international trends
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Untitled
Abstract: No abstract text available
Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe
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Z86018
Abstract: No abstract text available
Text: P r elim in a r y P r o d u c t S pecificatio n Z86018 d a ta P a th C o n t r o l l e r FEATURES • Sequencer Data can Come From the Internal RAM Based Sequencer, or From the Buffer Memory, Allowing for Different Data Each Time a Sequencer Instruction is Executed
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Z86018
100-Pin
88-Bit
16-Bit
10/nw
Z86018
Z8601840ASC
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Untitled
Abstract: No abstract text available
Text: P r e l im in a r y P r o d u c t S p e c if ic a t io n < £ 2 iL 0 S Z86018 DATA PATH CONTROLLER FEATURES • Low Profile 100-Pin Plastic VQFP ■ Sequencer Data can Come From the Internal RAM Based Sequencer, or From the Buffer Memory, Allowing for Different Data Each Time a Sequencer Instruction
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Z86018
100-Pin
88-Bit
D0341S4
Z8601840ASC
Z86018,
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