SOT890-1 |
|
NXP Semiconductors
|
Plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm |
|
Original |
PDF
|
SOT891 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT891 |
|
Original |
PDF
|
SOT891 |
|
NXP Semiconductors
|
Plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm |
|
Original |
PDF
|
SOT89_135 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 135 |
|
Original |
PDF
|
SOT893-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm |
|
Original |
PDF
|
SOT89-3EV-VREG |
|
Microchip Technology
|
Evaluation Boards - Linear Voltage Regulators (LDOs), Programmers, Development Systems, BOARD EVAL SOT89-3 VOLTAGE REG |
|
Original |
PDF
|
SOT-89-3L |
|
Unknown
|
|
|
Scan |
PDF
|
SOT894-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm |
|
Original |
PDF
|
SOT895-1 |
|
NXP Semiconductors
|
Plastic flanged cavity package; 2 mounting slots; 2 leads |
|
Original |
PDF
|
SOT895a |
|
NXP Semiconductors
|
Plastic flanged cavity package; 2 mounting slots; 2 leads |
|
Original |
PDF
|
SOT896B |
|
NXP Semiconductors
|
Plastic earless flanged cavity package; 2 leads |
|
Original |
PDF
|
SOT898-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; no leads; 48 terminals; body 7 x 7 x 1 mm |
|
Original |
PDF
|
SOT899-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm |
|
Original |
PDF
|
SOT89 Package |
|
Zetex Semiconductors
|
Package Dimensions |
|
Original |
PDF
|