| SOT1030-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm |
|
Original |
PDF
|
| SOT1031-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm |
|
Original |
PDF
|
| SOT1031-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm |
|
Original |
PDF
|
| SOT1033-1 |
|
NXP Semiconductors
|
HWQFN56R: plastic thermal enhanced very very thin quad flat package |
|
Original |
PDF
|
| SOT1034-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 736 balls |
|
Original |
PDF
|
| SOT1035-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 736 balls; heatsink |
|
Original |
PDF
|
| SOT1036-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm |
|
Original |
PDF
|
| SOT1039-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1039-1 |
|
Original |
PDF
|
| SOT1039-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.5 mm |
|
Original |
PDF
|
| SOT1039-1_115 |
|
NXP Semiconductors
|
Standard product orientation 12NC ending 115 |
|
Original |
PDF
|
| SOT1039-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals |
|
Original |
PDF
|
| SOT1039-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1039-2 |
|
Original |
PDF
|
