SOT110-1 |
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NXP Semiconductors
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Plastic single in-line medium power package with fin; 9 leads |
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Original |
PDF
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SOT1107-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 296 balls |
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Original |
PDF
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SOT1108-1 |
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NXP Semiconductors
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metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm |
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Original |
PDF
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SOT1110A |
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NXP Semiconductors
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Flanged LDMOST ceramic package; 2 mounting holes; 8 leads |
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Original |
PDF
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SOT1113-1_118 |
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NXP Semiconductors
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HVQFN44; reel pack; SMD; 13"; standard product orientation; Orderable part number ending, 118 or J; Orderable code (12NC) ending 118 |
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Original |
PDF
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SOT1114-1 |
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NXP Semiconductors
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Plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm |
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Original |
PDF
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SOT1115 |
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NXP Semiconductors
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extremely thin small outline package; no leads; 6 terminals |
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Original |
PDF
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SOT1115_132 |
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NXP Semiconductors
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Reversed product orientation 12NC ending 132 |
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Original |
PDF
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SOT1116 |
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NXP Semiconductors
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extremely thin small outline package; no leads; 8 terminals |
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Original |
PDF
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SOT1118 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1118 |
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Original |
PDF
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SOT1118 |
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NXP Semiconductors
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Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm |
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Original |
PDF
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SOT1118_115 |
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NXP Semiconductors
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DFN2020-6; reel pack; standard orientation; 12NC ending 115 |
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Original |
PDF
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SOT1119-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 432 balls; heatsink |
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Original |
PDF
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SOT1120A |
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NXP Semiconductors
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Flanged LDMOST ceramic package; 2 mounting holes; 6 leads |
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Original |
PDF
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SOT1120B |
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NXP Semiconductors
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earless flanged LDMOST ceramic package; 6 leads |
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Original |
PDF
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SOT1121A |
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NXP Semiconductors
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Flanged LDMOST ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT1121B |
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NXP Semiconductors
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earless flanged ceramic package; 4 leads |
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Original |
PDF
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SOT1121C |
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NXP Semiconductors
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earless flanged ceramic package; 4 leads |
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Original |
PDF
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SOT1122 |
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NXP Semiconductors
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Footprint for reflow soldering SOT1122 |
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Original |
PDF
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SOT1122 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 3 terminals |
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Original |
PDF
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