0.3MM PITCH BGA Search Results

0.3MM PITCH BGA Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

0.3MM PITCH BGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
0.3mm pitch BGA Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20 Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1	Original	BGA292D 396mm 508mm 635mm FR4/G10 20X20 488mm SF-BGA292D-B-11 0.3mm pitch BGA micro pitch BGA 1mm pitch BGA BGA 20x20	PDF
0.3mm pitch BGA Abstract: 34X34 1mm pitch BGA SF-BGA680B-B-11 Text: C D Ø 0.0156" 2x (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 33mm X Top View (reference only) 1mm [0.039"] pitch typ. 0.508 mm [0.020"] dia pads 0.3mm [0.012"] dia. 2 8.69mm [0.342"] 6.85mm [0.270"] 0.5mm 0.5mm 33mm B 1	Original	FR4/G10 34X34 SF-BGA680B-B-11 SF-BGA-680B-B-11 0.3mm pitch BGA 34X34 1mm pitch BGA	PDF
0.3mm pitch BGA Abstract: SF-BGA180C-B-11 Text: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2	Original	FR4/G10 16x16 SF-BGA180C-B-11 0.3mm pitch BGA	PDF
0.3mm pitch BGA Abstract: SF-BGA416E-B-11 pitch 0.3mm BGA 27mmx27mm Text: C Ø 0.0156" 2x (Tooling Hole) D 0.5mm See BGA pattern code to the right for actual pattern layout Y 0.5mm 25mm 1mm typ. X Top View (reference only) 3.74mm [0.147"] 0.508 mm [0.020"] dia pads 0.5mm 0.5mm 2 0.3mm [0.012"] dia. 25mm 5.32mm [0.210"] B 1 3 Side View	Original	FR4/G10 26X26 SF-BGA416E-B-11 0.3mm pitch BGA pitch 0.3mm BGA 27mmx27mm	PDF
eh 11757 Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin Text: Daisy Chain Samples Application Note -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG	Original		PDF
QFP lead pitch 0.3mm Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package Text: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration	Original	Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package	PDF
0.3mm pitch csp package Abstract: 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112 Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 0.3mm pitch csp package 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112	PDF
AN-1112 Abstract: 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national	PDF
pitch 0.4mm BGA Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology	Original	100x10 100x10-6/k pitch 0.4mm BGA BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka	PDF
Untitled Abstract: No abstract text available Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble	Original	100x10	PDF
Untitled Abstract: No abstract text available Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble	Original	100x10	PDF
0.3mm pitch BGA Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm Text: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available	Original	Spreadspg189-328 Spreadspg189-328 100x10-6/K 0.3mm pitch BGA pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm	PDF
ALIVH Abstract: 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 ALIVH 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT	PDF
FR4 substrate Abstract: No abstract text available Text: fBGA96T.5-DC144 TM BALLS PITCH 96 0.5mm SIZE MATRIX ROWS MAT’L CENTER TEL 1-714-898-3830 info@topline.tv 8mm SQ 14 x 14 BALL VIEW 2 none Flex Polyimide BOTTOM SIDE TOP X-RAY VIEW 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1 2 3 A B C D E C D E F G F G H J K L M	Original	fBGA96T 5-DC144 FR4 substrate	PDF

15X15 Abstract: PA-QFE160SD-P-S-01 0.3mm pitch BGA Text: 1.500" 0.670" 0.530" 0.100" 0.30mm 1.500" 0.530" 0.670" 0.006" 1 3 0.123" 0.250" -01W version 3 level, 0.025" Sqr. WW pin 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"	Original	FR4/G10 15X15 SB-PGA15/160B-01 PA-QFE160SD-P-S-01 0.3mm pitch BGA	PDF
ES29LV160DB-90TG Abstract: si 462 laser diode ES29LV160D 12wg ES29LV160DT Text: EE SS II - Preliminary - Excel Semiconductor inc. ES29LV160D 16Mbit 2M x 8/1M x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory - Preliminary Draft - GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC	Original	ES29LV160D 16Mbit 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV160DT ES29LV160DB 48-pin 48-ball ES29LV160DB-90TG si 462 laser diode ES29LV160D 12wg	PDF
FR4 substrate board Abstract: 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA PB-BGA48D-Z-01 1J23 Text: 7.62mm [0.300"] Top View 33.02mm [1.300"] * This height varies depending on the screw position. 3 5 2 5mm [0.197"]* 9.97mm [0.393"] 6 Side View 7.92mm 4 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . Substrate: 3.60mm ±0.18mm [0.142" ±0.007"]	Original	FR4/G10 PB-BGA48D-Z-01 FR4 substrate board 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA 1J23	PDF
ES29LV800EB-70TG Abstract: es29lv800et-70tg ES29LV800ET-70WC ES29LV800 ES29LV800E ES29LV800ET-70TGI ES29LV800EB-70TGI ES29LV800ET70TG ES29LV800EB Text: EE SS II Excel Semiconductor inc. ES29LV800E 8Mbit 1M x 8/512K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations	Original	ES29LV800E 8/512K 125oC 16Kbyte 32Kbyte 64Kbyte 15sectors ES29LV800ET ES29LV800EB 48-pin ES29LV800EB-70TG es29lv800et-70tg ES29LV800ET-70WC ES29LV800 ES29LV800E ES29LV800ET-70TGI ES29LV800EB-70TGI ES29LV800ET70TG	PDF
PCB design for very fine pitch csp package Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers	Original		PDF
ES29LV400EB-70TGI Abstract: ES29LV400EB-70TG ES29LV400E BB 555 ES29LV400EB Text: EE SS II Excel Semiconductor inc. ES29LV400E 4Mbit 512Kx 8/256K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations	Original	ES29LV400E 512Kx 8/256K 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV400ET ES29LV400EB 48-pin ES29LV400EB-70TGI ES29LV400EB-70TG ES29LV400E BB 555	PDF
ES29LV800DB-90TG Abstract: ES29LV800 ES29LV800DB-12TG ES29LV800D ES29LV800DB-70WG ES29lv800dt-70 000000X ES29LV800DB-70WGI ES29LV800DB-70TG ES29LV800DB-70TC Text: EE SS II Excel Semiconductor inc. ES29LV800D 8Mbit 1M x 8/512K x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations	Original	ES29LV800D 8/512K 125oC 16Kbyte 32Kbyte 64Kbyte 15sectors ES29LV800DT ES29LV800DB 48-pin ES29LV800DB-90TG ES29LV800 ES29LV800DB-12TG ES29LV800D ES29LV800DB-70WG ES29lv800dt-70 000000X ES29LV800DB-70WGI ES29LV800DB-70TG ES29LV800DB-70TC	PDF
SG-BGA-6046 Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.	Original	025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033	PDF
S71NS512r Abstract: A22-A16 PSRAM S71NS512RD0 JEP95 S71NS-R S71NS256RD0 pSRAM_39 Text: S71NS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 512 Mb 32 Mb x 16-bit / 256 Mb (16 Mb x 16-bit) Flash, 128 Mb (8 Mb x 16-bit) / 128Mb (4 Mb x 16-bit) pSRAM S71NS-R Memory Subsystem Solutions Cover Sheet	Original	S71NS-R 16-bit) 128Mb S71NS512r A22-A16 PSRAM S71NS512RD0 JEP95 S71NS256RD0 pSRAM_39	PDF
ES29LV160D Abstract: es29lv160dt-70rtci ES29LV160DT-70RTG ES29LV160DT-70RTC Text: EE SS II Excel Semiconductor inc. ES29LV160D 16Mbit 2M x 8/1M x 16 CMOS 3.0 Volt-only, Boot Sector Flash Memory GENERAL FEATURES • Minimum 100,000 program/erase cycles per sector • 20 Year data retention at 125oC • Single power supply operation - 2.7V -3.6V for read, program and erase operations	Original	ES29LV160D 16Mbit 125oC 16Kbyte 32Kbyte 64Kbyte ES29LV160DT ES29LV160DB 48-pin 48-ball ES29LV160D es29lv160dt-70rtci ES29LV160DT-70RTG ES29LV160DT-70RTC	PDF

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0.3MM PITCH BGA Search Results

0.3MM PITCH BGA Result Highlights (5)

0.3MM PITCH BGA Datasheets Context Search

0.3mm pitch BGA

0.3mm pitch BGA

0.3mm pitch BGA

0.3mm pitch BGA

eh 11757

QFP lead pitch 0.3mm

0.3mm pitch csp package

AN-1112

pitch 0.4mm BGA

Untitled

Untitled

0.3mm pitch BGA

ALIVH

FR4 substrate

15X15

ES29LV160DB-90TG

FR4 substrate board

ES29LV800EB-70TG

PCB design for very fine pitch csp package

ES29LV400EB-70TGI

ES29LV800DB-90TG

SG-BGA-6046

S71NS512r

ES29LV160D