A 0540
Abstract: QFE120SC SF-QFE120SC-L-01
Text: Surface mountable QFP emulator foot; leadless version, sized to fit on 120 position 0.4mm. pitch land pattern. Ironwood Spec: QFE120SC. 0.4mm Typ. 0.600" 0.600" 0.018" 0.050" 0.250" 0.063" A compatible target board land dimensions A< 0.540" B> 0.660" B Substrate: FR4/G10, 0.0625"±0.007" thick.
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QFE120SC.
FR4/G10,
SF-QFE120SC-L-01
SF-QFE120SC-L-01
Date8/15/97
A 0540
QFE120SC
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IC51-2564-1668
Abstract: a 1668 LS-QFE256SA-Z-01 socket Yamaichi ic51 qfp IC51
Text: 0.075" X 0.008" SMT pad Top View 0.4mm typ. 1 Bottom View 0.075" 0.352" 1.215" 0.4mm pitch 1.920" 1.920" 1.272" 1.452" Side View 1.652" 0.122" 0.250" 1.852" 0.018" dia. typ. 2 Description: Land socket 256 position QFP surface mount pads to 256 position male terminal pins Yamaichi ZIF socket footprint, IC51-2564-1668 .
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IC51-2564-1668)
LS-QFE256SA-Z-01
LS-QFE256SA-Z-iew
LS-QFE256SA-Z-01
Fr4/G10
finish10µ
IC51-2564-1668
a 1668
socket Yamaichi ic51 qfp
IC51
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B1448
Abstract: A1702 ipc 620 BOX21151 SF-QFE80SD-L-01F
Text: RoHS COMPLIANT 15.7mm [0.620"] top and bottom pad width only see side view for side pad width 15.7mm [0.620"] 13.7mm SQR. [0.540"] 0.4mm typ. [0.017"] Top View 0.050" pitch typ. 0.5mm dia. typ. [0.018"] 2 6.4mm±0.254mm [0.250"±0.010"] Side View 1 0.4mm [0.016"]
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254mm
SF-QFE80SD-L-01F
BOX21151
B1448
A1702
ipc 620
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ICP-120-2
Abstract: No abstract text available
Text: IC149 Series SMT QFP/TQFP - 120 Pins (30x30) 0.4mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):
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IC149
30x30)
100Veff
700Veff
IC149
ICP-120-2
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YAMAICHI ic357
Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:
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10mA/20mV
Dep51-820-2
KS-9376
YAMAICHI ic357
IC51-1284-1702
IC51-0644-1972
IC357-0484-078
IC357
ic51-1284-1702-2
IC500-1444-002P-2
YAMAICHI ic500
IC51-2084-1052-36
IC500-1004-004
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IC51-1284-1433
Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:
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10mA/20mV
IC51-0644-820-4
IC51-820-2
KS-9376
IC51-1284-1433
IC51-807
IC51-0484-806
IC51-1444-1354-7
IC51-0644-1240
IC51-2564-1668-6
OT 306
IC51-128
IC217-2404-007
cxd 158
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cxd 158
Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:
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10mA/20mV
cxd 158
ot 239
IC51-128
OT 306
IC51-2564-1668-6
IC51-0444-467
IC51-1764
socket Yamaichi ic234
IC51-1764-1505-10
IC217-1444-003
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QFP 128 lead .5mm
Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series
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12P2M
13P5M
14P6M
16P8M
14P4M
16P6M
17P9M
18P10M
13P3M
17P7M
QFP 128 lead .5mm
csp192
144 QFP body size
qfp 0.4mm
8P-10P
p4m 16
15 ball CSP
648P
qfp 0.8mm
12P4M
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CA-QFE128SD-M-S-01
Abstract: No abstract text available
Text: 17.78mm [0.700"] 0.4mm Pitch 17.78mm [0.700"] Top View 0.23mm [0.009"] typ. 13.46mm [0.530"] 17.02mm [0.670"] 1 Side View 6.35mm [0.250"] 4.76mm [0.188"] 3 2 13.21mm [0.520"] female interface UGA12/128A 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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UGA12/128A)
FR4/G10
CA-QFE128SD-M-S-01
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PA-QFE128SD-P-S-01
Abstract: QFE128SD
Text: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .
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FR4/G10
finish10µ
QFE128SD)
14x14
PA-QFE128SD-P-S-01
QFE128SD
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qfp 0.4mm
Abstract: SC-82AB
Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-10-21 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm
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O-220
O-220F
778mm
OT-89
SC-82AB
SC-88A
OT-23
qfp 0.4mm
SC-82AB
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SC-82AB
Abstract: No abstract text available
Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2010-05-06 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm
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O-220
O-220F
778mm
OT-89
SC-82AB
SC-88A
OT-23
GX27mm
SC-82AB
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SC-82AB
Abstract: No abstract text available
Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2009-05-25 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm
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O-220
O-220F
778mm
SC-82AB
SC-88A
OT-23
O-252
OT-89
SC-82AB
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CU-106A
Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT
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100405-1
Abstract: TQPACK100SD Eletech Electronics AXS4643R195C AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046
Text: Appendix A Reference Dimensional Drawing for Common 64-pin 0.8mm-pitch QFP Foot Pattern Package type name Manufacturer's name and package classification 64P6N-A Renesas MCU package type name IC61-0644-052 IC61-0644-053 Yamaichi Electronics Co., Ltd. IC socket type name
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64-pin
64P6N-A
IC61-0644-052
IC61-0644-053
IC61-0644-088
AXS4643R195C
AXS4643R195C
TQPACK080SD
TQPACK080SB
100405-1
TQPACK100SD
Eletech Electronics
AXS4803M19
IC61-0644-052
IC61-0644-053
IC61-080-079
IC61-080-081
IC61-0804-046
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78K3
Abstract: uPD78365A uPD78355 uPD78368A uPD784025
Text: 1/2 16 BIT MICROCONTROLLERS 78K3 AND 78K4 SERIES • A DIVERSE RANGE OF 16 BIT MICROCONTROLLERS • UP TO 256K OF MASK PROGRAMABLE ROM AND 12.5K OF RAM • SEVERAL MICROCONTROLLERS HAVE MULTIPLE ADC CHANNELS AND 2 DAC CHANNELS • AVAILABLE IN QFP PACKAGES FOR OPERATION AS LOW AS 1.8V
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PD78310A
64QFP
PD78312A
PD78320
74QFP6
PD78322
PD783235
64QFPG
78K3
uPD78365A
uPD78355
uPD78368A
uPD784025
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MB2147-01
Abstract: F2MC-16
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71021-2E F2MC-16 FAMILY EMULATOR QFP-100P PROBE HEADER MB2147-580 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100P *1 probe header MB2147-580 for the F2MC *2 -16 family emulator. The QFP-100P probe header is used by the probe header to connect the F2MC-16L/LX emulator
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SS01-71021-2E
F2MC-16
QFP-100P
MB2147-580
QFP-100P
MB2147-580)
F2MC-16L/LX
MB2147-01)
MB2147-01
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Untitled
Abstract: No abstract text available
Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble
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100x10
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Untitled
Abstract: No abstract text available
Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble
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100x10
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pitch 0.4mm BGA
Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology
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100x10
100x10-6/k
pitch 0.4mm BGA
BGA and QFP Package mounting
0.4mm pitch BGA
AI2O3
QFP lead pitch 0.3mm
QFP 0.2mm pitch
QFP 0.3mm pitch
Noble resistor
hybrid ic sc ka
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0.3mm pitch BGA
Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm
Text: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available
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Spreadspg189-328
Spreadspg189-328
100x10-6/K
0.3mm pitch BGA
pitch 0.4mm BGA
QFP 0.3mm pitch
0.4mm pitch BGA
BGA and QFP Package mounting
KOA Chip Resistors Packaging
BGA and QFP Package
paste resistor thick film
hybrid ic sc ka
qfp 0.4mm
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Untitled
Abstract: No abstract text available
Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite
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QFP64
QFP80
QFP100
BQFP100
TQFP100
QFP120
TQFP120
BQFP132
QFP160
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Untitled
Abstract: No abstract text available
Text: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite
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QFP64
QFP80
QFP100
BQFP100
TQFP120
BQFP132
25mils
QFP160
QFP184
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Untitled
Abstract: No abstract text available
Text: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact
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