000M073 Search Results

SU2369

Abstract: SU2080 2N4085 SU2365 2N3922 2N4084
Text: ra@ y T r N -C H A N N E L D U AL JU N C T IO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 038" (0.965mm) Die Size. Pad Sue: It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.