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    Text: R ecom m ended P .C .B Layout 1 2 .8 0 2.00 |T] NOTE: 0 2 0 1 22M R Q 08 D D 2 3 Z U 1 1. Selective plating ’S 1 ,-0 5 u " Min. gold in c o n ta ct a re a / 1 00 u" Min. Tin in solder area. 'S 2 ,-G o ld fla sh in c o n ta c t a r e a / 1 00 u" Min. Tin in solder area.


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    C2680H 008SX23ZU PDF