0201 footprint
Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290W
Text: MA4E2501-1290 Series SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Rev. V1 Features A • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits , No Wirebonds
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MA4E2501-1290
600x300um)
MA4E2501L-1290
0201 footprint
MA4E2501L-1290W
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0201 footprint
Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T MA4E2501L-1290W
Text: SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits, No Wirebonds Required • Rugged HMIC Construction with Polyimide
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600x300um)
MA4E2501-1290
MA4E2501L-1290
MA4E2501L-1290
MA4E2501L-1290W
0201 footprint
MA4E2501-1290
MA4E2501L-1290T
MA4E2501L-1290W
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0201 footprint
Abstract: p12mm
Text: CM1242-07CP 1-Channel Ultra Small 0201 Package ESD Protection Device in 0201 Description http://onsemi.com The CM1242−07CP is a 2−bump ESD protection device in 0201 form factor. It is fully compliant with IEC 61000−4−2. The CM1242−07CP is also RoHS II compliant and has a pure tin finish.
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CM1242-07CP
IEC61000-4-2
567AV
CM1242-07CP/D
0201 footprint
p12mm
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Untitled
Abstract: No abstract text available
Text: MA4E2501L-1290 SURMOUNT Low Barrier 0201 Silicon Schottky Diode Rev. V2 Features • Extremely Low Parasitic Capacitance and Inductance. • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits. No Wire bonds Required. • Rugged HMIC Construction with Polyimide
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MA4E2501L-1290
600x300um)
MA4E2501L-1290
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Untitled
Abstract: No abstract text available
Text: CM1242-07CP 1-Channel Ultra Small 0201 Package ESD Protection Device in 0201 Description http://onsemi.com The CM1242−07CP is a 2−bump ESD protection device in 0201 form factor. It is fully compliant with IEC 61000−4−2. The CM1242−07CP is also RoHS II compliant and has a pure tin finish.
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CM1242-07CP
CM1242â
IEC61000â
567AV
07CP/D
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Untitled
Abstract: No abstract text available
Text: BAT30F4 Small signal Schottky diodes Datasheet − production data Features • Very low conduction losses • Negligible switching losses • 0201 package • Low capacitance diode Description 0201 package Figure 1. Pin configuration and marking The BAT30 series uses 30 V Schottky barrier
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BAT30F4
BAT30
DocID025
DocID025780
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phycomp capacitors X7R
Abstract: 0201 capacitor footprint
Text: DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS NP0/X7R/Y5V Product Specification – Mar. 22, 2004 V.1 size 0201 Phycomp Product specification Surface-mount ceramic multilayer capacitors FEATURES NP0/X7R/Y5V size 0201 QUICK REFERENCE DATA • High capacitance per unit volume
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CCA045
phycomp capacitors X7R
0201 capacitor footprint
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phycomp capacitors X7R
Abstract: Phycomp 0201 capacitor 0201 capacitor footprint 0201 land pattern Phycomp
Text: DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS NP0 and X7R Product Specification – Aug 1, 2003 V.8 size 0201 Phycomp Product specification Surface-mount ceramic multilayer capacitors FEATURES NP0 and X7R size 0201 QUICK REFERENCE DATA • High capacitance per unit volume
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Chip Beads
Abstract: BK0603HS 28F0121-0SR hz0805e601r-00
Text: 0201 Ferrite Chip Beads Innovative Technology for a Connected World Laird Technologies has broadened its Ferrite Chip Bead product offering by adding the smaller EIA 0201 Metric 0603 version to the existing EIA 0402 ~ 3312 (Metric 1005 ~ 8531) product family. The smaller
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ASTM-B-809-95
Abstract: No abstract text available
Text: DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 Product specification – April 01, 2015 V.3 RoHS compliant & Halogen free Product specification Chip Resistor Surface Mount AF 2 9 0201 to 2512
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AF0201
AF2512
ASTM-B-809-95
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RJ0603FRE0756R
Abstract: No abstract text available
Text: DATA SHEET THIN FILM CHIP RESISTORS General purpose RJ series Pb Free 1%, TC50 Product specification – May 30, 2005 V.1 sizes 0201/0402/0603/0805/ 1206/1210/2010/2512 Product specification Chip Resistor Surface Mount RJ 2 10 0201 to 2512 (Pb Free) SERIES
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RJ0201
RJ2512
RJ0603FRE0756R
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RJ0603
Abstract: RJ1206 rj25 RJ0805 TC50
Text: DATA SHEET THIN FILM CHIP RESISTORS General purpose RJ series Pb Free 1%, TC50 Product specification – May 30, 2005 V.1 sizes 0201/0402/0603/0805/ 1206/1210/2010/2512 Product specification Chip Resistor Surface Mount RJ SERIES 2 9 0201 to 2512 (Pb Free)
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RJ0201
RJ2512
1206onditioning
RJ0603
RJ1206
rj25
RJ0805
TC50
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CM1242-33CP
Abstract: No abstract text available
Text: CM1242-33CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−33CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−33CP is also RoHS II compliant and has a pure tin finish.
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CM1242-33CP
CM1242-33CP
567AV
000/Tape
CM1242-33CP/D
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06x03
Abstract: No abstract text available
Text: CM1242-33CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−33CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−33CP is also RoHS II compliant and has a pure tin finish.
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CM1242-33CP
CM1242-33CP
567AV
000/Tape
CM1242-33CP/D
06x03
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p12mm
Abstract: CM1242-07CP
Text: CM1242-07CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−07CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−07CP is also RoHS II compliant and has a pure tin finish.
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CM1242-07CP
CM1242-07CP
567AV
000/Tape
CM1242-07CP/D
p12mm
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Untitled
Abstract: No abstract text available
Text: CM1242-07CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−07CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−07CP is also RoHS II compliant and has a pure tin finish.
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CM1242-07CP
CM1242-07CP
567AV
000/Tape
CM1242-07CP/D
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Untitled
Abstract: No abstract text available
Text: CM1242-33CP 1-Channel ESD Protection Device in 0201 CSP Description The CM1242−33CP is a 2−bump ESD protection device in 0201 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM1242−33CP is also RoHS II compliant and has a pure tin finish.
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CM1242-33CP
CM1242â
567AV
000/Tape
33CP/D
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PIN diode SPICE model skyworks
Abstract: 590006 SMS7630-093
Text: DATA SHEET SMS7630-093: 0201 Surface Mount Silicon Schottky Zero Bias Detector Diode Applications S ensitive detector circuits l S ampling circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package E xtremely low barrier
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SMS7630-093:
SMS7630-093
PIN diode SPICE model skyworks
590006
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Untitled
Abstract: No abstract text available
Text: Preliminary DATA SHEET SMS7630-093: 0201 Surface Mount Silicon Schottky Zero Bias Detector Diode Applications S ensitive detector circuits l S ampling circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package E xtremely low barrier
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SMS7630-093:
SMS7630-093
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Untitled
Abstract: No abstract text available
Text: Preliminary DATA SHEET SMS7630-093: 0201 Surface Mount Silicon Schottky Zero Bias Detector Diode Applications S ensitive detector circuits l S ampling circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package E xtremely low barrier
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SMS7630-093:
SMS7630-093
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Untitled
Abstract: No abstract text available
Text: Preliminary DATA SHEET SMS7621-096: 0201 Surface Mount Low Barrier Silicon Schottky Diode Applications S ensitive detector circuits l S ampling circuits l M ixer circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package
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SMS7621-096:
SMS7621-096
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Untitled
Abstract: No abstract text available
Text: Preliminary DATA SHEET SMS7621-096: 0201 Surface Mount Low Barrier Silicon Schottky Diode Applications S ensitive detector circuits l S ampling circuits l M ixer circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package
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SMS7621-096:
SMS7621-096
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PIN diode SPICE model skyworks
Abstract: No abstract text available
Text: DATA SHEET SMS7621-096: 0201 Surface Mount Low Barrier Silicon Schottky Diode Applications S ensitive detector circuits l S ampling circuits l M ixer circuits l Features l l l l l L ow profile, ultraminiature 0201 surface mount package L ow barrier height
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SMS7621-096:
SMS7621-096
PIN diode SPICE model skyworks
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0201 footprint
Abstract: LLV0603FB LLV0603-FB LLV0603-FB1N0S LLV0603-FB1N2S LLV0603-FB1N5S LLV0603-FB1N8S LLV0603-FB2N2S LLV0603-FB2N7S LLV0603-FB3N3S
Text: LLV0603FB Series MULTILAYER CERAMIC CHIP INDUCTOR DESCRIPTION The LLV0603-FB Series is a multilayer ceramic chip inductor in an EIA standard 0201 footprint with very high self-resonant frequency characteristics and no requirements for magnetic polarity orientation.
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LLV0603FB
LLV0603-FB
0-22nH
100MHz
800MHz
1800MHz)
250ppm/
CF-280-LV0603FB
R-LOG0204A
0201 footprint
LLV0603-FB1N0S
LLV0603-FB1N2S
LLV0603-FB1N5S
LLV0603-FB1N8S
LLV0603-FB2N2S
LLV0603-FB2N7S
LLV0603-FB3N3S
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