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    Abstract: No abstract text available
    Text: Reportable Substances in Components Package Type : Component Weight : MLF 2X2mm Sawn Document No : Lead #: 8 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die


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    PDF MLF22D-8LD-GRN-RS-1 020405HC02