02JUL14 Search Results

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Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: F-214 Rev 02JUL14 EPLSP–019–2000 (0,80 mm) .0315" I/O SYSTEM EPLSP SERIES RUGGED LATCHING HIGH SPEED SYSTEM FEATURES • • • • Rugged external cable Small form factor Low profile latching Metal-to-metal two-piece contact system • High mating cycles	Original	F-214 02JUL14)	PDF
Untitled Abstract: No abstract text available Text: F-214 Rev 02JUL14 DCC–04–03.00–G–PF–03–1 DCC–04–03.00–G–PF–02–1 (2,00 mm) .0787" DCC SERIES HIGH SPEED PRESS-FIT TO BOARD SPECIFICATIONSi For complete specifications and recommended PCB layouts see www.samtec.com?DCC Supports and surpasses PCIe	Original	F-214 02JUL14)	PDF
Untitled Abstract: No abstract text available Text: UH4PBC-M3/HM3, UH4PCC-M3/HM3, UH4PDC-M3/HM3 www.vishay.com Vishay General Semiconductor High Current Density Surface Mount Ultrafast Rectifiers FEATURES eSMP Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement	Original	J-STD-020, AEC-Q101 O-277A 100electronic 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12	PDF
Untitled Abstract: No abstract text available Text: VS-GA200TH60S www.vishay.com Vishay Semiconductors Molding Type Module IGBT, 2-in-1 Package, 600 V and 200 A FEATURES • High short circuit capability • 10 s short circuit capability • VCE on with positive temperature coefficient • Maximum junction temperature 150 °C	Original	VS-GA200TH60S 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12	PDF