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    8ETU04

    Abstract: FD090U04A5B MIL-HDBK-263 S1025
    Text: I - 0523J rev.A FD090U04A5B FRED Die in Wafer Form z z 400V VF = 1.3V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage


    Original     		PDF 0523J FD090U04A5B 12-Mar-07 8ETU04 FD090U04A5B MIL-HDBK-263 S1025

    8ETU04

    Abstract: No abstract text available
    Text: I - 0523J rev.A FD090U04A5B FRED Die in Wafer Form z z 400V VF = 1.3V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage


    Original     		PDF 0523J FD090U04A5B 8ETU04