9435P
Abstract: SSG9435P
Text: SSG9435P P-Ch Enhancement Mode Power MOSFET -5.7 A, -30 V, RDS ON 49 m Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free DESCRIPTION These miniature surface mount MOSFETs utilize a high cell density trench process to
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SSG9435P
07-Jul-2010
9435P
SSG9435P
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lin bus example C codes
Abstract: errata stm8 STM8S20xxx pm0044 STM8S208MB errata sheet STM8S207C6 i2c berr stm8 STM8 CPU programming manual STM8S207R8 STM8S207S6
Text: STM8S20xxx Errata sheet STM8S performance line device limitations Silicon identification This errata sheet applies to revisions X and Y/6 of the STMicroelectronics STM8S performance line products. A full list of part numbers is shown in Table 1. The products can be identified see Table 2 by:
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STM8S20xxx
STM8S207xx
STM8S207MB,
STM8S207M8,
STM8S207RB,
STM8S207R8,
STM8S207R6,
STM8S207CB,
STM8S207C8,
STM8S207C6,
lin bus example C codes
errata stm8
STM8S20xxx
pm0044
STM8S208MB errata sheet
STM8S207C6
i2c berr stm8
STM8 CPU programming manual
STM8S207R8
STM8S207S6
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 3 2 20 LOC BY - DIM C REF D 1 MATERIAL: HOUSING: LCP, COLOR: 2 CONTACTS: BRASS. FINISH: 2.54µm MIN MATTE TIN OVER NICKEL ENTIRE POST . 3 HOLDDOWN: COPPER ALLOY. FINISH: 2.54µm MIN MATTE TIN OVER NICKEL .
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ECR-13-008007
17SEP2013
07JUL2010
ECR-10-013359
20FEB2009
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Untitled
Abstract: No abstract text available
Text: SMG2301P -2.6 A, -20 V, RDS ON 0.130 P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free SC-59 DESCRIPTION The miniature surface mount MOSFETs utilize a high cell density trench process
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SMG2301P
SC-59
SC-59
07-Jul-2010
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 3 2 20 LOC BY - DIM C REF D 1 MATERIAL: HOUSING: LCP, COLOR: 2 CONTACTS: BRASS. FINISH: 2.54µm MIN MATTE TIN OVER NICKEL ENTIRE POST . 3 HOLDDOWN: COPPER ALLOY. FINISH: 2.54µm MIN MATTE TIN OVER NICKEL.
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ECR-13-008007
17SEP2013
07JUL2010
ECR-10-013359
19FEB2009
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Untitled
Abstract: No abstract text available
Text: L6924D Battery charger system with integrated power switch for Li-Ion/Li-Polymer Features • Fully integrated solution, with a power MOSFET, reverse blocking diode, sense resistor, and thermal protection ■ Ideal for coke and graphite anode single-cell Li-Ion packs
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L6924D
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SMG2339P
Abstract: MosFET
Text: SMG2339P -3.6 A, -30 V, RDS ON 0.057 P-Channel Enhancement MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free SC-59 DESCRIPTION The miniature surface mount MOSFETs utilize a high cell density process
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SMG2339P
SC-59
07-Jul-2010
SMG2339P
MosFET
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Untitled
Abstract: No abstract text available
Text: 2 THIS £L DRAWING IS UNPUBLISHED. C O P Y R I G H T 20 BY RELEASED TYCO ELECTRONICS CORPORATION. FOR ALL PUBLICATION R 1G H T S 20 LOC CM RESERVED. DIST R E V ISIONS oo LTR DESCRIPTION DATE R E V I S E D P E R E C R - 10 - 0 I 3 3 5 9 A A MATERIAL: HOUSING:
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COPYRIGHT20
07JUL2010
54jjm
2002/95/EC
I9FEB2009
19EEB2009
3IMAR2000
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bucher
Abstract: No abstract text available
Text: 2 THIS £L DRAWING IS UNPUBLISHED. C O P Y R I G H T 20 BY RELEASED TYCO ELECTRONICS CORPORATION. ALL FOR PUBLICATION R 1G H T S 20 LOC DIST R E V ISIONS 00 CM RESERVED. LTR DESCRIPTION REVISED A MATERIAL: HOUSING: LCP, CONTACTS : BRASS. FINISH: 2 . 5 4 jjm M I N
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COPYRIGHT20
07JUL2010
2002/95/EC
20FEB2009
20EEB2009
3IMAR2000
bucher
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