083011HC04 Search Results

Untitled

Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : TSSOP 8 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 083011HC04 Content in % 48.235% 42.133%