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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Reportable Substances in Components Package Type : TSSOP 8 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 083011HC04 Content in % 48.235% 42.133%	Original	PDF	TSSOP-8LD-GRN-RS-12 083011HC04

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : TSSOP 8 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 083011HC04 Content in % 48.235% 42.133%

Original

PDF

TSSOP-8LD-GRN-RS-12 083011HC04