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    Abstract: No abstract text available
    Text: Reportable Substances in Components Package Type : TSSOP 28 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 083011HC06 Content in % 57.294%


    Original     		TSSOP-28LD-PBY-RS-3 083011HC06 PDF