1mm pitch BGA socket
Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)
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MIL-STD202,
1mm pitch BGA socket
thermal shock standard
papst 3412
25M1
Muffin
Thermal Resistance Calculation TO
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PDF
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TEXTOOL
Abstract: land pattern BGA 0,50 3M 2380
Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm
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Original
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TS-9100-06
TEXTOOL
land pattern BGA 0,50
3M 2380
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PDF
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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Original
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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PDF
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AS4DDR32M72PBG
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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Original
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
AS4DDR32M72PBG
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PDF
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Untitled
Abstract: No abstract text available
Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply
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Original
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AS4DDR32M72PBG1
32Mx72
333Mbps
23mm-1
208-PBGA
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch
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W3H64M64E-XSBX
667Mbs
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PDF
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W3H64M64E
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch
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Original
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W3H64M64E-XSBX
667Mbs
W3H64M64E
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PDF
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18CO
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 64 • 1.0mm pitch
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W3H64M64E-XSBX
18CO
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PDF
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84 FBGA
Abstract: IPC17 FBGA-84
Text: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 72 • 1.0mm pitch
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W3H64M72E-XSBX
W3H64M72E-XSBXF
W3H64M72E-XSBXF
SN63Pb37
SAC305
84 FBGA
IPC17
FBGA-84
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PDF
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CEE 32
Abstract: W3H32M64E-XSBX
Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Mb/s Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch Commercial, Industrial and Military Temperature
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Original
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W3H32M64E-XSBX
W3H32M64E-XSBX
32M64.
CEE 32
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PDF
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Wells-CTI
Abstract: 8109-064-1E-0X 8113B064A1E-0X wells-cti 672 811725 wells 28919X 8722a 8127-676-1E-0X 811514
Text: Burn-In Test Sockets Series 8100 VABGA Sockets • • • • • • • Open top, Vertically Actuated Ball Grid Array Accommodates 1.0mm pitch package Proven, low force, high pressure “spoon” contacts Contacts are independent of one another Two points of contact per solder ball
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Original
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22x14)
Wells-CTI
8109-064-1E-0X
8113B064A1E-0X
wells-cti 672
811725
wells
28919X
8722a
8127-676-1E-0X
811514
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PDF
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84 FBGA
Abstract: W3H64M72E-XSBX fbga84 ccd400
Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 72 • 1.0mm pitch Weight: W3H64M72E-XSBX - 2.5 grams typical
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Original
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W3H64M72E-XSBX
W3H64M72E-XSBX
84 FBGA
fbga84
ccd400
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PDF
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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PDF
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Untitled
Abstract: No abstract text available
Text: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)
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PDF
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pitch 0.75mm BGA
Abstract: No abstract text available
Text: Ball Grid Array BGA Adapters 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Standard Adapter (A) Now Available In 0.75mm Pitch • Mates with Standard Socket (S)
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Original
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wit75
pitch 0.75mm BGA
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PDF
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BGA reflow guide
Abstract: pitch 0.75mm BGA 1024 ball bga
Text: Ball Grid Array BGA Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Adapters Standard Adapter (A): Extraction Slot Adapter (AX):
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PDF
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eutectic 157
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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PDF
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE
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Original
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PDF
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Untitled
Abstract: No abstract text available
Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter
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Original
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C36000)
ASTM-B-16
63Sn/37Pb
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PDF
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Untitled
Abstract: No abstract text available
Text: Press Releases CYPRESS INTRODUCES DUAL-PORTS IN BGA PACKAGES 7.2 Gbps FLEx36 Housed in Manufacturing-Friendly 1.0-mm Lead Pitch BGA SAN JOSE, Calif., November 5, 1999 - Cypress Semiconductor Corp. NYSE:CY today announced that the four members of the FLEx36 family of x36 dual-port SRAMs will be offered in 172-ball, 15 mm x
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FLEx36
172-ball,
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PDF
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Untitled
Abstract: No abstract text available
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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63Sn/37Pb
BGA-TECH04
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PDF
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diode b6 k 450
Abstract: CTS RESISTOR NETWORK F-120 RT1400B6 RT1401B6 RT1402B6 RT1403B6 RT1404B6 RT1405B6 SSTL-2
Text: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high
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RT1404B6
RT1402B6
RT1404B7
RT1402B7
200ppm/
diode b6 k 450
CTS RESISTOR NETWORK
F-120
RT1400B6
RT1401B6
RT1402B6
RT1403B6
RT1404B6
RT1405B6
SSTL-2
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PDF
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Untitled
Abstract: No abstract text available
Text: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high
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RT1404
RT1402
RT1404B6
RT1402B6
RT1404B7
RT1402B7
200ppm/
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PDF
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bail
Abstract: No abstract text available
Text: I ADVANCED Ball Grid Array BGA Sockets » INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://www.advintcorp.com Standard S ocket (S):
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OCR Scan
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63Sn/37Pb,
bail
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PDF
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