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    1.2 MICRON CMOS Search Results

    1.2 MICRON CMOS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    MG80C186XL-20/R Rochester Electronics LLC Microprocessor, CMOS Visit Rochester Electronics LLC Buy
    MD87C51-16/B Rochester Electronics LLC Microcontroller, CMOS Visit Rochester Electronics LLC Buy
    A80C286-12 Rochester Electronics LLC Microprocessor, CMOS Visit Rochester Electronics LLC Buy

    1.2 MICRON CMOS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    1.2 Micron CMOS Process Family

    Abstract: 1.2 micron cmos P-MOSFET metal oxide in capacitor vertical PNP metal resistor 0.8 Micron CMOS Process Family 0.03 um CMOS technology
    Text: 1.2 Micron CMOS Process Family  June 1995 Features Process Parameters • Double Poly / Double Metal • 2.4 µm Poly and Metal I Pitch • 5.5 Volts Maximum Operating Voltage • Twin-tub • • 1.2µm 5volts Units Metal I pitch width/space 1.4 / 1.0


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    CMOS Process Family

    Abstract: 1.5um cmos process family
    Text: 1.5 Micron CMOS Process Family  February 1996 Features Technology Outline • • • • • • • • LOVMOS Processes 2.7~3.6 Volts Low Voltage Option 1.2 Volts Very Low Voltage Option 5.5 Volts Maximum Operating Voltage Double Poly / Double Metal


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    1.2 micron cmos

    Abstract: 1.2 Micron CMOS Process Family 12-micron CMOS Process Family
    Text: 1.2 Micron CMOS Process Family  February 1996 Features • • • • • • Process Parameters Double Poly / Double Metal 2.4 µm Poly and Metal I Pitch 5.5 Volts Maximum Operating Voltage Twin-tub process ProToDuctionTM Option for prototypes Standard Cell Library


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    1.2 Micron CMOS Process Family

    Abstract: No abstract text available
    Text: 1.2 Micron CMOS Process Family Process parameters Features • Double Poly / Double Metal, • 2.4 µm Poly and Metal I Pitch, • 5.5 Volts Maximum Operating Voltage, • Twin-tub process on P-type or N-type wafers, • ProToDuctionTM Option for low cost prototypes,


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    ER142503.6V

    Abstract: ER14250-VB3.6V
    Text: CMOS- CSI 1.2 micron Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE Family Custom Driver Device MCD00002 Lot # 66210891 Package WSOIC Vcc 5.6V Qty 115 Time Point Failures Act Act Act Total Hrs Fails Hrs Fails Hrs Fails Dev. Hrs 168 500 1000 0 115000


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    MCD00002 MIC2202 MIC2202BMM 3A18196 3A10032MNF 3A10034MNE MIC2203 MIC2203BMM ER142503.6V ER14250-VB3.6V PDF

    1.2 Micron CMOS Process Family

    Abstract: FTI-12 P-MOSFET 4800 mosfet mosfet 4800
    Text: 1.2 Micron CMOS Process Family Process parameters Features • Double Poly / Double Metal, • 2.4 µm Poly and Metal I Pitch, • 5.5 Volts Maximum Operating Voltage, • Twin-tub process on P-type or N-type wafers, • ProToDuctionTM Option for low cost prototypes,


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    Untitled

    Abstract: No abstract text available
    Text: ADC-208A ® 8-Bit, 20MSPS CMOS Flash A/D ADC-208 Compatible PRODUCT OVERVIEW The ADC-208A utilizes an advanced VLSI 1.2 micron CMOS in providing 20MHz sampling rates at 8-bits. The flexibility of the design architecture and process delivers latch-up free operation


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    ADC-208A 20MSPS ADC-208 ADC-208A 20MHz 10MHz AD24-pin PDF

    lm324 adc flash converter

    Abstract: HP2811 LM-3241 ADC-208ALC ADC-208ALM ADC-208AMC ADC-208AMM HA-5033 LM324 adc208alm
    Text: ADC-208A ® 8-Bit, 20MSPS CMOS Flash A/D ADC-208 Compatible PRODUCT OVERVIEW The ADC-208A utilizes an advanced VLSI 1.2 micron CMOS in providing 20MHz sampling rates at 8-bits. The flexibility of the design architecture and process delivers latch-up free operation


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    ADC-208A 20MSPS ADC-208 ADC-208A 20MHz ADC-208A. IC-208ALC lm324 adc flash converter HP2811 LM-3241 ADC-208ALC ADC-208ALM ADC-208AMC ADC-208AMM HA-5033 LM324 adc208alm PDF

    vco 27MHz

    Abstract: PLL VCO 27MHz phase sequence detector phone tap
    Text: 0.13um, 12-145 MHz Phase Locke d Loop FEATURES • Industry Standard 0.13 Micron CMOS ■ Digital Logic Process; 1.2/3.3 volts ■ Digital Controlled Output Frequency — up to 145 MHz with a Symmetric Duty Cycle ■ Embedded VCO Frequency Range: 216 MHz, locked to 27


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    lm324 adc flash converter

    Abstract: ADC-208AME
    Text: ADC-208A ® 8-Bit, 20MSPS CMOS Flash A/D ADC-208 Compatible PRODUCT OVERVIEW The ADC-208A utilizes an advanced VLSI 1.2 micron CMOS in providing 20MHz sampling rates at 8-bits. The flexibility of the design architecture and process delivers latch-up free operation


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    ADC-208A 20MSPS ADC-208 ADC-208A 20MHz ADC-208A. 10MHz lm324 adc flash converter ADC-208AME PDF

    Untitled

    Abstract: No abstract text available
    Text: ADC-208A ® 8-Bit, 20MSPS CMOS Flash A/D ADC-208 Compatible PRODUCT OVERVIEW The ADC-208A utilizes an advanced VLSI 1.2 micron CMOS in providing 20MHz sampling rates at 8-bits. The flexibility of the design architecture and process delivers latch-up free operation


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    ADC-208A 20MSPS ADC-208 ADC-208A 20MHz ADC-208A. ADC-208AMM-QL PDF

    hp2811

    Abstract: hp2811 diode LM324 16 PIN DETAILS lm324 adc flash converter adc-208a datel Delay Lines murata ADC-208ALC ADC-208ALM ADC-208AMC ADC-208AMM
    Text: www.murata-ps.com ADC-208A 8-Bit, 20MSPS CMOS Flash A/D ADC-208 Compatible PRODUCT OVERVIEW The ADC-208A utilizes an advanced VLSI 1.2 micron CMOS in providing 20MHz sampling rates at 8-bits. The flexibility of the design architecture and process delivers latch-up free operation


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    ADC-208A 20MSPS ADC-208 ADC-208A 20MHz ADC-208A. hp2811 hp2811 diode LM324 16 PIN DETAILS lm324 adc flash converter adc-208a datel Delay Lines murata ADC-208ALC ADC-208ALM ADC-208AMC ADC-208AMM PDF

    PD65000

    Abstract: 8748 NEC CMOS-5 NEC nec 8748 94Q3 NEC CMOS-4
    Text: SEC CMOS-5 1.2-MICRON CMOS GATE ARRAYS NEC Electronics Inc. PRELIM INARY Description The CM O S-5 gate arrays are low -pow er, high-speed integrated circu its fea tu ring 1.2-m icron silicon -ga te CMOS technology. The basic cell on the gate array chip consists o f six transistors, three p-channel and


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    PD65000 000to NECEL-000837 8748 NEC CMOS-5 NEC nec 8748 94Q3 NEC CMOS-4 PDF

    HS-26CT32MS

    Abstract: No abstract text available
    Text: HS-26CT32MS ÊE HÄSKSS Radiation Hardened Quad Differential Line Receiver December 1992 Pinouts Features HS1-26CT32MSR 16 PIN CERAMIC DUAL-IN-LINE CASE OUTLINE 02, CONFIGURATION 3 TOP VIEW • 1.2 Micron Radiation Hardened CMOS • Total DoseUp to 300KRAD SI


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    HS-26CT32MS HS1-26CT32MSR 300KRAD 1x10s RS-422 138mW 84mils 3290nm) 110nm HS-26CT32MS PDF

    26CT32RH

    Abstract: No abstract text available
    Text: HS-26CT32RH S Radiation Hardened Quad Differential Line Receiver March 1995 Features Pinouts • 1.2 Micron Radiation Hardened CMOS -Total Dose Up to 300K RAD Si HS1-26CT32RH 16 LEAD CERAMIC SIDEBRAZE DIP CASE OUTLINE D2, CONFIGURATION C TOP VIEW • Latchup Free


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    HS-26CT32RH HS1-26CT32RH RS-422 138mW 038mm) 43Q2E71 26CT32RH PDF

    26C31

    Abstract: Harris top marking
    Text: HS-26C31RH Semiconductor Radiation Hardened Quad Differential Line Driver November 1995 Features Pinouts • 1.2 Micron Radiation Hardened CMOS 16 Lead Ceramic Dual-in-Line Metal Seal Package SBDIP Mil-Std-1835 CDIP2-T16 TOP VIEW - Total Dose Up to 300K RAD(Si)


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    HS-26C31RH Mil-Std-1835 CDIP2-T16 1x109 RS-422 05A/cm 110nmx100nm 26C31 Harris top marking PDF

    Untitled

    Abstract: No abstract text available
    Text: HS-26CT31RH S MAfSSf? Radiation Hardened Quad Differential Line Driver March1995 Features Pinouts HS1-26CT31RH 16 LEAD CERAMIC SIDEBRAZE DIP CASE OUTUNE D2, CONFIGURATION C TOP VIEW • 1.2 Micron Radiation Hardened CMOS - Total Dose Up to 300K RAD Si • Latchup Free


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    HS-26CT31RH Mrch1995 HS1-26CT31RH RS-422 038mm) PDF

    inmos static ram

    Abstract: No abstract text available
    Text: IMS1820M CMOS High Performance 64K x 4 Static RAM MIL-STD-883C imos Advance Information / /' / FEATURES DESCRIPTION • INMOS'Very High Speed CMOS • Advanced Process -1.2 Micron Design Rules • 64K x 4 Bit Organization • 30, 35 and 45 ns Address Access Times


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    IMS1820M MIL-STD-883C 300-mil 64Kx4 inmos static ram PDF

    Untitled

    Abstract: No abstract text available
    Text: IMS1800M CMOS High Performance 256K x 1 Static RAM MIL-STD-883C mos Advance Information DESCRIPTION FEATURES • INMOS' Very High Speed CMOS • Advanced Process -1.2 Micron Design Rules • 256K x 1 Bit Organization • 30, 35 and 45 ns Address Access Times


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    IMS1800M MIL-STD-883C 300-mil 256Kx1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary IIIÌMÌIII AffHSl September 1989 OPEN ASIC DATASHEET MAF GATE ARRAY SERIES 1.2 MICRON CMOS FEATURES . . . . . . HIGH LOAD DRIVE CAPABILITY EXCEEDING 35 mA • GATE COUNTS : 250 AND 800 . WIDE PACKAGE RANGE . EXCELLENT FOR FUSE PROGRAMMABLE ARRAYS AND BIPOLAR LOGIC REPLACE­


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: 3 HS-65647RH Radiation Hardened December1992 8K x 8 SOS CMOS Static RAM Functional Diagram Features • 1.2 Micron Radiation Hardened SOS CMOS - Total Dose 3 x 10s RAD SI - Transient Upset >1 x 1011 RAD (Siys - Single Event Upset < 1 x 10'12 Errors/Bit-Day


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    r1992 HS-65647RH 100mA 313x291 PDF

    Untitled

    Abstract: No abstract text available
    Text: HS-26CT31MS H A R R IS SEMICONDUCTOR Radiation Hardened Quad Differential Line Driver Decem ber 1992 Pinouts Features HS1-26CT31MSR 16 PIN CERAMIC DUAL-IN-LINE CASE OUTLINE D2, CONFIGURATION 3 TOP VIEW • 1.2 Micron Radiation Hardened CMOS - Total Dose Up to 300K RAD SI


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    HS-26CT31MS HS1-26CT31MSR RS-422 2140nm x3290nm) HS-26C32MS PDF

    Untitled

    Abstract: No abstract text available
    Text: SYSTEMS SLA8000 Series June 1988 VERY HIGH SPEED CHANNELLESS CMOS GATE ARRAYS D escription The SLA8000 Series consists of a group of seven very high-speed, sea-of-gates CMOS gate arrays. The series is fabricated utilizing our state-of-the-art 1.2 micron sili­


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    SLA8000 SLA827S PDF

    transistor B324

    Abstract: transistor B324 pin out B324 transistor off grid inverter schematics full subtractor circuit nand gates ALI 3105 i203 transistor B304 transistor mxe3
    Text: H o n eyw ell 4551872 HO NE Y WE LL / SS HC20000 ELEK, M IL 03E 00236 D Preliminary HIGH-PERFORMANCE CMOS GATE ARRAY FEATURES • Performance Optimized Series of 1.2-Micron CMOS Gate Arrays 1Proven VLSI Design System VDS Toolkit •Boundary and Internal Scan


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    HC20000 transistor B324 transistor B324 pin out B324 transistor off grid inverter schematics full subtractor circuit nand gates ALI 3105 i203 transistor B304 transistor mxe3 PDF