Auto Fuse
Abstract: C0010 C0040302Z 075S 1800-S c0035
Text: www.elecsound.cn Elecsound Electronics Company Limited Auto Fuse Small Functional Characteristics Testing Blow Time current Min Max 110% 100hours / 135% 0.75s 1800s 200% 0.15s 5s 350% 0.08s 0.25s Min Current Voltage Parts No. Email: jasmine@elecsound.cn Rating
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100hours
1800s
C0003301Z
C0004301Z
C0005301Z
C7500301Z
C0010301Z
C0015301Z
C0020301Z
C0025301Z
Auto Fuse
C0010
C0040302Z
075S
1800-S
c0035
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6.2V Zener Diode
Abstract: 12v zener diode voltage reference Zener Chip MB4214 VR 100K FF12 FR 151 diode diode zener 3c2 MB421
Text: To Top / Lineup / Index FUJITSU SEMICONDUCTOR DATA SHEET DS04-29106-2E ASSP TIMER MB4214 LONG PERIOD TIMER The Fujitsu MB4214 is designed for a long period timer. It contains oscillator, divider 13 stages of flip-flop , output circuit, power supply circuit and comparator (2-ch).
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DS04-29106-2E
MB4214
MB4214
500ms
100hours
ZIP-17P-M01
F9703
6.2V Zener Diode
12v zener diode
voltage reference
Zener Chip
VR 100K
FF12
FR 151 diode
diode zener 3c2
MB421
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9160FVM RESULT n pn pcs (pcs) － 22 100℃(5min) / 0℃ (5min) 10cycles 22 Tstg min (30min) / Tstg max (30min) 100cycles 22 Steady State Operating Life Test Apply the specified voltage at Topr max 1000hours 22 High Temperature Storage
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BD9160FVM
10cycles
30min)
100cycles
1000hours
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resonator SMD MARKING CODE X D
Abstract: LD109 RW109
Text: REV. ECO REVISIONS DESCRIPTION - DATE Initial Release APPROVED 10/9/2003 RW SPECIFICATIONS OUTLINE DRAWING Part Number XX.X denotes freq. in MHz Frequency Tolerance at 25°C Frequency Stability at - 20°C to +80°C AWSZT-XX.XMWS 8.00 MHz - 13.0 MHz AWSZT-XX.XMWD
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BA2901
Abstract: No abstract text available
Text: Reliability Test Result DEVICE: BA2901 Family RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C
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BA2901
10sec
30min)
100cycles
1000hours
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BD9701CP-V5
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9701CP-V5 RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat(*2)
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BD9701CP-V5
10sec
10cycles
30min)
100cycles
1000hours
BD9701CP-V5
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VSON008X2030
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BR93H□□-W Series RESULT ITEM METHOD CONDITION n pcs pn(pcs) － 77 x 3 Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)
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BR93H-W
10sec
10cycles
30min)
1000cycles
1000hours
VSON008X2030
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BU52013HFV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU52013HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BU52013HFV
10cycles
30min)
100cycles
1000hours
1000ho
BU52013HFV
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bd9842
Abstract: bd98 BD9842FV
Text: Reliability Test Result DEVICE : BD9842FV RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)
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BD9842FV
10sec
10cycles
30min)
100cycles
1000hours
1000hou
bd9842
bd98
BD9842FV
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BA2903S Family RESULT ITEM METHOD n pn pcs (pcs) − 22 x 3 10sec 22 x 3 CONDITION Resistance to Soldering Heat (#1) Soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (#1) Soak into solder tub 260±3℃
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BA2903S
10sec
30min)
100cycles
1000hours
1000ho
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9192GUL RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BD9192GUL
10cycles
30min)
100cycles
1000hours
1000hour
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BU52003GUL
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BU52003GUL RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)
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BU52003GUL
10cycles
30min)
100cycles
1000hours
1000ho
BU52003GUL
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BD9134MUV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9134MUV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)
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BD9134MUV
10cycles
30min)
100cycles
1000hours
BD9134MUV
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BR34E02FVT-W
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BR34E02FVT-W RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)
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BR34E02FVT-W
10sec
10cycles
30min)
100cycles
1000hours
BR34E02FVT-W
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BR24C21F
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BR24C21F RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)
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BR24C21F
10sec
10cycles
30min)
100cycles
1000hours
BR24C21F
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BA10339
Abstract: No abstract text available
Text: Reliability Test Result DEVICE: BA10339 Family RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C
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BA10339
10sec
30min)
100cycles
1000hours
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9007F RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat(*2)
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BD9007F
10sec
10cycles
30min)
100cycles
1000hours
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BD9300F
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9300F RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)
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BD9300F
10sec
10cycles
30min)
100cycles
1000hours
1000hour
BD9300F
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD2206G RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)
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BD2206G
10sec
10cycles
30min)
100cycles
1000hours
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BA□□DD0 Series, BA□□DD0W Series RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C
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10sec
30min)
100cycles
1000hours
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BD9111NV
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD9111NV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)
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BD9111NV
10cycles
30min)
100cycles
1000hours
BD9111NV
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ROHM Electronics
Abstract: BD6524HFV
Text: Reliability Test Result DEVICE : BD6524HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock (*1) 100℃(5min) / 0℃ (5min)
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BD6524HFV
10cycles
30min)
100cycles
1000hours
ROHM Electronics
BD6524HFV
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Untitled
Abstract: No abstract text available
Text: Reliability Test Result DEVICE : BD□□KA5 Series, BD□□KA5W Series RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C
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10sec
30min)
100cycles
1000hours
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AL-10MR-D
Abstract: AL-20MR-A Mitsubishi Logic Controller AL-6MR-A AL-10MT-D Software AL-20MR-A mitsubishi AL-10MR-D software mitsubishi AL-10MR-A AL-10MR-A mitsubishi AL-10MR-D program SMS BASED DC MOTOR SPEED CONTROLLER
Text: a The Mitsubishi Alpha Controller A new concept in control solutions, designed for simplicity. Overview Do you need control? Do you Have a building services process to automate? Welcome to the a series controller from Mitsubishi, The Tiny Giant. The a has been designed to provide
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100hours
AL-10MR-D
AL-20MR-A
Mitsubishi Logic Controller AL-6MR-A
AL-10MT-D
Software AL-20MR-A
mitsubishi AL-10MR-D software
mitsubishi AL-10MR-A
AL-10MR-A
mitsubishi AL-10MR-D program
SMS BASED DC MOTOR SPEED CONTROLLER
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