SiA400DJ-GE3
Abstract: 10-MAY-11
Text: SiA400DJ-GE3_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. R-C values for the electrical circuit in the Foster/tank and Cauer/filter configurations are included. When implemented in P-SPICE,
|
Original
|
PDF
|
SiA400DJ-GE3
AN609,
8080u
6722m
5362m
4000m
4466u
9423u
1505m
3521m
10-MAY-11
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
21-SEP-11
10-MAY-11
16-SEP-10
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
J-STD-020D
21-SEP-11
10-MAY-11
30-SEP-10
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
S84C
Abstract: No abstract text available
Text: New Product SS8P3C, SS8P4C Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifier FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
AEC-Q101
J-STD-020,
O-277A
2002/95/EC
2002/96/EC
2011/65/EU
2002/95/EC.
2011/65/EU.
12-Mar-12
S84C
|
Untitled
Abstract: No abstract text available
Text: New Product SS8P3C, SS8P4C Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifier FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
J-STD-020,
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
2002/95/EC.
2011/65/EU.
JS709A
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
Untitled
Abstract: No abstract text available
Text: New Product SS8P3C, SS8P4C Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifier FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
J-STD-020,
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
11-Mar-11
|
Untitled
Abstract: No abstract text available
Text: SQ2325ES_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. R-C values for the electrical circuit in the Foster/tank and Cauer/filter configurations are included. When implemented in P-SPICE,
|
Original
|
PDF
|
SQ2325ES
AN609,
6560u
0366u
8254m
0633m
2805m
1978m
2210u
10-May-11
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
01-APR-14
12-AUG-13
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
09-NOV-11
21-SEP-11
10-MAY-11
04-AUG-10
|
Untitled
Abstract: No abstract text available
Text: CPL Vishay Dale Wirewound Resistors, Commercial Power, Axial Lead, Low Value FEATURES • High power to size ratio • Low inductance, less than 5 nH • Ceramic cases are available with circuit board stand-offs designated with a -3 model ending • Superior surge capability
|
Original
|
PDF
|
2002/95/EC
CPL03
CPL03.
CPL05
CPL05.
CPL07
CPL07.
CPL10
CPL10.
CPL15
|
Untitled
Abstract: No abstract text available
Text: P. 70, P. 100, P. 140, P. 200 Vishay Draloric RF Power Plate Capacitors with Contoured Rim, Class 1 Ceramic FEATURES • Low losses • High reliability • Wide range of capacitance values APPLICATIONS • Induction and dielectric heating • Antenna units
|
Original
|
PDF
|
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
|
Fast Recovery Bridge
Abstract: 10-MAY-11
Text: SA60BA60 Vishay Semiconductors Single Phase Fast Recovery Bridge Power Modules , 60 A FEATURES • Fast recovery time characteristic • Electrically isolated base plate • Simplified mechanical designs, rapid assembly • UL pending • Excellent power/volume ratio
|
Original
|
PDF
|
SA60BA60
OT-227
2002/95/EC
OT-227
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
Fast Recovery Bridge
10-MAY-11
|
|
|
69214-1
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
02-APR-10
69214-1
|
USB 3.0
Abstract: No abstract text available
Text: 1 2 3 4 5 15.48 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE Nickel CONTACT AREA Pd-Ni + Gold SOLDER TAIL AREA Matt Tin SHIELDING: BRASS MATT TIN PLATED
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
USB 3.0
|
Untitled
Abstract: No abstract text available
Text: New Product SS10P3C, SS10P4C Vishay General Semiconductor High Current Density Surface Mount Schottky Barrier Rectifiers FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
SS10P3C,
SS10P4C
J-STD-020
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
11-Mar-11
|
SS6P4C
Abstract: No abstract text available
Text: New Product SS6P4C Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifier FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
J-STD-020
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
2011/65/EU
2002/95/EC.
2011/65/EU.
SS6P4C
|
VS-SA61BA60
Abstract: No abstract text available
Text: Not Available for New Designs, Use VS-SA61BA60 SA60BA60 Vishay Semiconductors Single Phase Fast Recovery Bridge Power Modules , 60 A FEATURES • Fast recovery time characteristic • Electrically isolated base plate • Simplified mechanical designs, rapid assembly
|
Original
|
PDF
|
VS-SA61BA60
SA60BA60
OT-227
2002/95/EC
OT-227
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
VS-SA61BA60
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
Untitled
Abstract: No abstract text available
Text: New Product SS8P3C, SS8P4C Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifier FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
J-STD-020,
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
2011/65/EU
2002/95/EC.
2011/65/EU.
12-Mar-12
|
Untitled
Abstract: No abstract text available
Text: New Product SS10P2CL, SS10P3CL Vishay General Semiconductor High Current Density Surface Mount Dual Common-Cathode Schottky Rectifiers FEATURES eSMP TM Series • Very low profile - typical height of 1.1 mm • Ideal for automated placement K • Low forward voltage drop, low power losses
|
Original
|
PDF
|
SS10P2CL,
SS10P3CL
J-STD-020,
AEC-Q101
2002/95/EC
2002/96/EC
O-277A
2011/65/EU
2002/95/EC.
|
Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni CONTACT AREA 0.76 µm Gold SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
|
Original
|
PDF
|
UL94-V0
2002/95/EC
30Vac
100Vac/min
|
5-6450130-6
Abstract: hh5p 9-6450130-0 2ACP
Text: 7 8 THIS DR AWI NG IS UNPUBLISHED. COPYRIGHT BY RELEASED 1. A L L FOR PUBLICATION RIGHTS LOC ES «SERVED. DI S T REVISIONS 00 LTR L5 DESCRIPTION DATE DWN APVD 10MAY11 RK HMR REVISED PER ECO-11-005033 DIM. L ± . 0 I 0 r D - Il D II Il D II Il D II 1 1 D
|
OCR Scan
|
PDF
|
ECO-11-005033
10MAY11
14FEB05
I4FEB05
5-6450130-6
hh5p
9-6450130-0
2ACP
|