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    10X10 QFN Search Results

    10X10 QFN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    10X10 QFN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PF412

    Abstract: STM8S105K STM8S105XX 5201H STM8S
    Text: STM8S105xx Access line, 16 MHz STM8S 8-bit MCU, up to 32 Kbytes Flash, integrated EEPROM,10-bit ADC, timers, UART, SPI, I²C Preliminary Data Features Core • ■ 16 MHz advanced STM8 core with Harvard architecture and 3-stage pipeline LQFP48 7x7 LQFP44 10x10


    Original     		PDF STM8S105xx 10-bit LQFP48 LQFP44 10x10 LQFP32 VFQFN32 PF412 STM8S105K STM8S105XX 5201H STM8S

    QFN 10*10 88

    Abstract: 10x10 qfn qfn 88 10x10 88 qfn qfn 68 10x10
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


    Original     		PDF 10X10 QFN 10*10 88 10x10 qfn qfn 88 10x10 88 qfn qfn 68 10x10

    em78p372nso14j

    Abstract: em78p372 EM78P259ND18J EM78P259NS EM78P153SP EM78P372N EM78P153SN EM78P374 IC51-0644-1972 EM78F661NA
    Text: UWTR EM78 series USB writer UWTR v1.05.09 support body list 1 Support body sort by Body : (The Red line is update for v1.05.09) IC body Supporting Devices Package Type Package UWTR ADPNum UWTR SMD socket number Textool Part number EM78F541N EM78F541NAD16


    Original     		PDF EM78F541N EM78F541NAD16 DIP16 300mil UWTR-ADP037 EM78F541NASO16A 150mil UWTR-SO16/14-150 OTS-16-1 em78p372nso14j em78p372 EM78P259ND18J EM78P259NS EM78P153SP EM78P372N EM78P153SN EM78P374 IC51-0644-1972 EM78F661NA

    PWM example sTM8l

    Abstract: STM8L151 ufdfpn8 footprint STM8AF6223 STM8AF62 STM8L101 stm8l152 STM8AF5288 stm8l151F2 STM8AF5268
    Text: STM8 product families STMicroelectronics 8‑bit microcontrollers www.st.com/mcu STM8 8‑bit microcontrollers The STM8 is a platform of technologies, IPs and tools which forms the basis of STMicroelectronics’ comprehensive family of 8‑bit microcontrollers. These cover a wide range of applications from low‑power and


    Original     		PDF BRSTM80610 PWM example sTM8l STM8L151 ufdfpn8 footprint STM8AF6223 STM8AF62 STM8L101 stm8l152 STM8AF5288 stm8l151F2 STM8AF5268

    DMP8 pcb pattern

    Abstract: examples LQFP144 QFN12-11 QFP32 QFP100-U1 QFP80 BCC32 QFN28 QFN28-N1
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF PCSP32-GD BCC24 BCC32 BCC36 DMP8 pcb pattern examples LQFP144 QFN12-11 QFP32 QFP100-U1 QFP80 BCC32 QFN28 QFN28-N1

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    B7 SOT-89

    Abstract: DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF EQFN14-D7 QFN12-11 QFN16-21 QFN16-44 QFN24-T2 QFN24-34 QFN28-N2 QFN48-Q1 PCSP14-C3 PCSP16-E4 B7 SOT-89 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2

    ST7FAUDIO

    Abstract: st7faudioar9 VN1160 VNH5180 L4969URD VNH3SP30-E st VN1160 l5150 VB027SP6 ST7FAUDIO-AR9
    Text: Car body solutions Selection guide May 2008 STMicroelectronics - May 2008 - Printed in Italy - All rights reserved The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies. All other names are the property of their respective owners.


    Original     		PDF SGCAR0508 ST7FAUDIO st7faudioar9 VN1160 VNH5180 L4969URD VNH3SP30-E st VN1160 l5150 VB027SP6 ST7FAUDIO-AR9

    jtag programmer ST92F124

    Abstract: 12vdc to 240vac inverter circuit ST7MIDI-EMU31 lcd 2x16 8051 STR73X CAN DK3200 Evaluation Board STR72x ST7265X SO20 package BGA and QFP Package 14x14
    Text: 8, 16 and 32-bit microcontrollers Product and tool selection guide March 2006 www.st.com/mcu Current 8, 16 and 32-bit microcontroller families Timer functions Data Prog. RAM 2 A/D EP bytes (bytes) E PROM inputs 12 or 16-bit 8-bit FAST (IC/OC/ (IC/OC/ ROM


    Original     		PDF 32-bit 16-bit 4x12-bit STR712FR0 STR715FR0 STR711FR1 jtag programmer ST92F124 12vdc to 240vac inverter circuit ST7MIDI-EMU31 lcd 2x16 8051 STR73X CAN DK3200 Evaluation Board STR72x ST7265X SO20 package BGA and QFP Package 14x14

    EFM32

    Abstract: EFM32G210F128-QFN32 QFN64 9x9 4X24 lcd lcd 4x24 LCD 4x40 QFN64 EFM32G890F128-BGA112 EFM32G880F128-QFP100 Reflex Monitor
    Text: in i um no 4x mou on in c re ased b re s p ti av s y s e n erg tu ing er t t a f y e p o w er c u tim e M m to ti v e s on ea o iqu au ac E n e rg y M m al Un w od Sub U lt r µA ARM Cortex-M3 es 32-bit lif e 4x longer battery lifetime with EFM32 microcontrollers


    Original     		PDF 32-bit EFM32 32-bit 1G-EFM32 EFM32G210F128-QFN32 QFN64 9x9 4X24 lcd lcd 4x24 LCD 4x40 QFN64 EFM32G890F128-BGA112 EFM32G880F128-QFP100 Reflex Monitor

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


    Original     		PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    QFN28 4x4 socket

    Abstract: QFN28 4x4 QFN32 7x7 socket LQFP64 QFN32 7x7 0.65 QFN28 QFN32 QFN32 5x5 package QFN28 socket QFP32
    Text: STMicroelectronics : Application & Tools About ST Products Applications Support Buy News & Events ST Worldwide Contact Us my.ST Login search ST ST Home | Microcontrollers STice connection accessories search part number For emulation, when ordering a STice system #1 in the


    Original     		PDF SuppoTICESYS007 CF/FP60 AD/QFP48B-A04 AS/QFP48BA LQFP32 CB-CF/FP60 CB-AD/QP32BA03 CBAS/QP32BC LQFP48 CB-STICES001 QFN28 4x4 socket QFN28 4x4 QFN32 7x7 socket LQFP64 QFN32 7x7 0.65 QFN28 QFN32 QFN32 5x5 package QFN28 socket QFP32

    qfn32

    Abstract: qfn64 footprint lcd 4x24 EFM32TG108F32 capacitive touch slider EFM32 QFN64 9x9 EFM32TG840F32 EFM32TG110F32-QFN24 4X40 LCD
    Text: i no 4x m ou in c re energymicro.com 80° C 75% Humidity on re s p ti v a s s energy ased ba Industrial/Home Automation 001122 kWh in g f y r e tt e o tu p o w er c tim e in um to ti v e u s n ea lo iqu au ac E n e rg y M m ra Un M m Energy Metering w od Sub


    Original     		PDF 32-bit 32-bit EFM32 1K-EFM32 qfn32 qfn64 footprint lcd 4x24 EFM32TG108F32 capacitive touch slider QFN64 9x9 EFM32TG840F32 EFM32TG110F32-QFN24 4X40 LCD

    stm32 keil motor control

    Abstract: Gemalto Smartcard STR912FA 2X16 LCD 8051 LQFP-100 footprint ST7DALI-EVAL kit ST10F273 programmer schematic st10f276 jtag USB iso7816 dali schematic
    Text: 62 7x 10 R7 R9 M32 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STR7 STR9 STM32 Family ST72 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins 48 pins 56 pins


    Original     		PDF STM32 10x10) 14x14) SGMICRO0208 stm32 keil motor control Gemalto Smartcard STR912FA 2X16 LCD 8051 LQFP-100 footprint ST7DALI-EVAL kit ST10F273 programmer schematic st10f276 jtag USB iso7816 dali schematic

    EFM32G222FX-QFP48

    Abstract: EFM32GG230FX-QFN64 EFM32ZG222FX-QFP48 EFM32ZG108 EFM32G200FX-QFN32 EFM32TG222FX-QFP48 EFR4D2090 EFM32 EFM32ZG108FX-QFN24 EFM32ZG
    Text: life y ge P ol lon % 3 ro ery r batt og Ene y Friendl y rg v e n Te c h n 32-bit ARM Cortex-M0 and Cortex-M3 microcontrollers for: • Energy, gas, water and smart metering • Alarm and security systems • Health and fitness applications • Industrial and home automation


    Original     		PDF 32-bit EFM32 1L-EFM32 EFM32G222FX-QFP48 EFM32GG230FX-QFN64 EFM32ZG222FX-QFP48 EFM32ZG108 EFM32G200FX-QFN32 EFM32TG222FX-QFP48 EFR4D2090 EFM32ZG108FX-QFN24 EFM32ZG

    Untitled

    Abstract: No abstract text available
    Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:


    Original     		PDF AK64D750-70-QFP14x20-1 64PIN AK68D1200-PLCC AK68DS1200-PLCC AK72D900-QFN/MLP 10X10 10MM-72

    2X16 LCD 8051

    Abstract: STM32F10x ST7LITE25F2 ST72321M9 stm8s207r8 STM32F103VC lcd 2x16 8051 RLink schematic Raisonance selni motor ST10R172
    Text: 62 7x 10 M32 M8S R7 R9 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STM32 STM8 STR7 STR9 Family ST72 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins


    Original     		PDF STM32 10x10) 14x14) SGMICRO0708 2X16 LCD 8051 STM32F10x ST7LITE25F2 ST72321M9 stm8s207r8 STM32F103VC lcd 2x16 8051 RLink schematic Raisonance selni motor ST10R172

    DMP8 pcb pattern

    Abstract: BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC32 BCC36 PCSP20-CC DMP8 pcb pattern BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2

    QFN-28P

    Abstract: QFP80-C3 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP14 SSOP20-F1
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC32 BCC36 PCSP20-CC QFN-28P QFP80-C3 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP14 SSOP20-F1

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF OT-23-6-1 FLP10-C1 SSOP10 SSOP14 SSOP16 SSOP20 SSOP20-B2 SSOP20-C3 SSOP20-F1 SSOP24 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    841S101

    Abstract: No abstract text available
    Text: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology | | POWER MANAGEMENT ANALOG & RF INTERFACE & CONNECTIVITY | CLOCKS & TIMING | MEMORY & LOGIC | TOUCH & USER INTERFACE | VIDEO & DISPLAY | AUDIO PCI Express Timing Solutions


    Original     		PDF 100MHz REVB0111 841S101

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP20-C
    Text: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


    Original     		PDF OT-23-6-1 SON10 FLP10-C1 SSOP10 SSOP14 SSOP16 SSOP20 SSOP20-B2 SSOP20-C3 SSOP20-F1 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP20-C

    MO-069

    Abstract: No abstract text available
    Text: YAMAICHI Q.F.P., P.QJ1R & L.C.C Test & Burn-In • SPECIFICATIONS • Any kind ofSMT type or IC package type SOP & QFP available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pilch IC packages.


    OCR Scan     		PDF 73x73 15x15 MO-069