Untitled
Abstract: No abstract text available
Text: TEMD5120 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5120 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area and an infrared bandpass filter matched to IR
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TEMD5120
TEMD5120
J-STD-20)
2000/53/EC,
2002/95/EC
2002/96/EC
08-Apr-05
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Si4310DY
Abstract: No abstract text available
Text: SPICE Device Model Si4310DY Vishay Siliconix Dual N-Channel 30-V D-S MOSFET with Schottky Diode CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range
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Si4310DY
18-Jul-08
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sn 8406
Abstract: No abstract text available
Text: TEMD5020 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5020 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area, detecting visible and near infrared radiation.
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TEMD5020
TEMD5020
J-STD-20)
2000/53/EC,
2002/95/EC
2002/96/EC
D-74025
12-Aug-05
sn 8406
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Untitled
Abstract: No abstract text available
Text: TEMD5020 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5020 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area, detecting visible and near infrared radiation.
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PDF
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TEMD5020
TEMD5020
J-STD-20)
2000/53/EC,
2002/95/EC
2002/96/EC
08-Apr-05
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CH1155
Abstract: Si4310DY
Text: SPICE Device Model Si4310DY Vishay Siliconix Dual N-Channel 30-V D-S MOSFET with Schottky Diode CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range
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Original
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PDF
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Si4310DY
S-51868Rev.
12-Aug-05
CH1155
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Untitled
Abstract: No abstract text available
Text: TEMD5120 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5120 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area and an infrared bandpass filter matched to IR
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Original
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PDF
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TEMD5120
TEMD5120
J-STD-20)
2000/53/EC,
2002/95/EC
2002/96/EC
D-74025
12-Aug-05
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DO214BA
Abstract: DO-214BA DO-214B do214ba general semiconductor
Text: EGF1T New Product Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier Major Ratings and Characteristics IF AV 1.0 A VRRM 1300 V IFSM 20 A trr 75 ns EAS 15 mJ Tj max. 150 °C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent
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DO-214BA
MIL-S-19500
J-STD-020C
DO-214B0
12-Aug-05
DO214BA
DO-214BA
DO-214B
do214ba general semiconductor
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293D
Abstract: No abstract text available
Text: 293D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Commercial, Surface Mount FEATURES • • • • • • PERFORMANCE/ELECTRICAL CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C. To + 125 °C with voltage derating. Capacitance Range: 0.10 µF to 680 µF.
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QC300801/US0001
535BAAC.
EIA-481-1.
12-Aug-05
293D
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BZM55B
Abstract: BZM55C
Text: BZM55C Series Surface Mount Zener Diodes P b Lead Pb -Free SMALL SIGNAL ZENER DIODES Features: *500mw Power Dissipation *General Purpose *Ideal for Surface Mountted Application 0.5 WATTS Mechanical Data: *Case : MICRO-MELF Glass Case *Weight : Approx 0.01g
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BZM55C
500mw
12-Aug-05
RJA300
500mW
15-Aug-05
BZM55B
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DO-214BA
Abstract: EGF1t DO214BA 214BA JESD22-B102D J-STD-002B
Text: EGF1T New Product Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier Major Ratings and Characteristics IF AV 1.0 A VRRM 1300 V IFSM 20 A trr 75 ns EAS 15 mJ Tj max. 150 °C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent
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DO-214BA
DO-214BA,
UL-94V-0
J-STD-002B
JESD22-B102D
08-Apr-05
DO-214BA
EGF1t
DO214BA
214BA
JESD22-B102D
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Untitled
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST CM 53 REVISIONS LTR B DESCRIPTION DATE DWN BSV RCJ 12AUG05 EC 0G3B 0213 05 APVD PINS TO COMPLY WITH AMP SOLDERABILITY
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12AUG05
UL94V-0
0ZAPR96
31MAR2000
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. 2 3 - - LOC DIST GP 00 REVISIONS DESCRIPTION D 1. RELEASED PER EC OS13 - 0 2 2 6 - 0 5 BM JG 12AUG05 D PARTS PACKAGED UNASSEMBLED, AS A UNIT KIT.
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12AUG05
12AUG05
31MAR2000
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ASTM-B-488
Abstract: MIL-M-24519 QQ-C-530
Text: 8 THIS DRAWING 15 UNPUBLISHED. COPYRIGHT 7 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. DIST R E V IS IO N S 16 AJ LTR A DESCRIPTION REVISED PER EC 0S1 4 - 0 1 5 0 - 0 5 DATE DWN APVD 12AUG05 BM JL POLYESTER PBT PER M IL - M - 2 4 5 1 9 , TYPE
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ASTM-B-488
21APR2005
31MAR2000
MIL-M-24519
QQ-C-530
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Untitled
Abstract: No abstract text available
Text: 4 T H IS D R A W IN G IS U N P U B L IS H E D . 3 R ELEASED FOR A LL C O P Y R IG H T A 1471-9 3 /1 1 P U B L IC A T IO N R IG H TS RESERVED. 2 GP R E V IS IO N S 00 D E S C R IP T IO N R EVISED 1. RER ECO-11-004835 RK HMR I M AR 11 D PARTS PACKAGED UNASSEMBLED, AS A UNIT KIT.
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ECO-11-004835
12AUG05
12AUG05
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - ALL RIGHTS RESERVED. LOC DIST AD 38 REVISIONS LTR H D OBSOLETE OBSOLETE .125 /K /K .318 .125 .318 E D C SUPERCEDED BY 3 - 1 0 3 3 2 1 - 5 OBSOLETE OBSOLETE
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4-40-UNC-2B
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - . - LOC DIST R E V IS IO N S GP 00 ALL RIGHTS RESERVED. LTR B DESCRIPTION DATE DWN BM WM 22JU L08 REVISED PER E C 0 - 0 8 - 0 0 7 3 2 7 APVD STUD R E C E IV E R
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EC0-08-007327
22JUL08
05/im
4-40UNC-2B
12AUG05
31MAR2000
4-40-UNC-2B
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Untitled
Abstract: No abstract text available
Text: 4 TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR ALL COPYRIGHT 2 3 PUBLICATION RIGHTS - — LOC D IS T REVISIONS GP 00 RESERVED. BY TYCO ELECTRONICS CORPORATION. LTR 1. ALL PARTS 2^ ZINC PACKAGED D E SC RIPTIO N RELEASED PER EC UNASSEMBLED O S13 - 0 2 2 6 - 0 5
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12AUG05
12AUG
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Untitled
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 4 5 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC REVISIONS DIST AD 00 ALL RIGHTS RESERVED. LTR DESCRIPTION B REV PER DATE DWN BC GS 07APR06 EC 0 S 1 2 - 0 3 0 3 - 0 5 APVD CONTAC SCALE 5:1 CONNECTOR A
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07APR06
31MAR2000
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Untitled
Abstract: No abstract text available
Text: 6 7 TH IS DRAWING IS U N P U B L IS H E D . COPYRIGHT RELEASED BY TYCO ELECTRONICS CORPORATION. ALL FOR PUBLIC ATIO N RIG HTS - , 5 4 3 2 - LOC RE S ER VED . GP DIST R E V IS IO N S 00 LTR B REVISED PER D E S C R IP T IO N DATE DWN APVD EC0-08-007327 22JUL08
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EC0-08-007327
22JUL08
5SS5fifi5aSS55Sfi55S555fififiS
12AUG05
31MAR2000
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