LC4064V
Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch
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32-Pin
100-Ball
132-Ball
56-Ball
269-Ball
208-Ball
256-Ball
100-Pin
128-Pin
44-Pin
LC4064V
Lattice ispmach LC4064V
ispMACH 4A5
flip chip bga 0,8 mm
OR3T80
LC4064
OR3C80
OR3T20
OR3T30
OR3T55
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TFBGA132
Abstract: No abstract text available
Text: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e ball A1 index area P N M L K J H G F
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TFBGA132:
OT599-1
MO-216
TFBGA132
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A ball A1 index area shape optional 4x y1 C ∅v M C A B
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TFBGA132:
OT599-1
MO-216
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls body; 12 x 12 x 0.8 mm A B D SOT599-2 ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v ∅w b M M y y1 C C A B C P N M L K J H G F E D C B A ball A1 index area e e2
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TFBGA132:
OT599-2
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TFBGA132
Abstract: sot599
Text: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L
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TFBGA132:
OT599-1
TFBGA132
sot599
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PDF
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A shape optional 4x
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TFBGA132:
OT599-1
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CPG132
Abstract: CP132 132-ball CP132/CPG132
Text: R Chip Scale BGA CP132/CPG132 Package PK373 (v1.3) June 25, 2008 132-BALL CHIP SCALE BGA 0.50mm PITCH (CP132/CPG132) 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
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CP132/CPG132)
PK373
132-BALL
maCPG132)
CPG132
CP132
CP132/CPG132
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BGA-56 DATASHEET
Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3
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bga 1296
Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
Text: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E
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XC2V1000
XC2V1500
XC2V2000
XC2V3000
XC2V4000
XC2V6000
XC2V8000
XC2V250
XC2V500
XCV100E
bga 1296
XC2V80
LVDSEXT25
BLVDS-25
LVDSEXT-25
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,
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AB244A
Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
Text: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002
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CMOS-10HD
A16400EJ4V0DM00
A16400EJ4V0DM
IR50-203-3-37
IR50-207-3-37
AB244A
R488A
AD9361
AK2177
CMOS-9HD
UPD65891
N526A
PD65891
tqfp 64 thermal resistance nec
PD65881
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im4a3-64
Abstract: lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea
Text: Lattice Socket Adapter Listing Rev 4.30 Socket Adapters are the interface between programming hardware such as the Lattice Model 300 desktop programmer , and Lattice programmable devices. This document shows which Lattice Socket Adapters support which Lattice programmable products. Lattice Socket Adapters are
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28-pin
im4a3-64
lattice im4a3
im4a3
im4a3-128
im4a3-192
lfe3-35ea
IM4A3-256
iM4A3-384
LFXP2-8E
lfe3-70ea
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ispmach lc4032
Abstract: Lattice Socket Products LFE3-95EA
Text: Rev 5.8.1 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of all Lattice families except iCE without soldering on a printed circuit board. The Model 300 is supported by the Lattice Programming Cable HW-USBN-2A is included with the Model 300 . To program a specific Lattice device, an appropriate Lattice socket adapter must be
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pDS4102-FB208-C1)
PN-Q208-GDX160V
PN-FB208/GX160V
PA-FB388/GX240VA
PN-T48/CLK5510V
PN-T100/CLK5520V
Model300
ispmach lc4032
Lattice Socket Products
LFE3-95EA
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Lattice Socket Products
Abstract: LFE3-95EA
Text: Rev 5.7 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of all Lattice families except iCE without soldering on a printed circuit board. The Model 300 is supported by the Lattice Programming Cable (HW-USBN-2A is included with the Model 300). To program a specific Lattice device, an appropriate Lattice socket adapter must
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PN-Q208-GDX160V
PN-FB208/GX160V
pDS4102-FB208-C1)
PA-FB388/GX240VA
PN-T48/CLK5510V
PN-T100/CLK5520V
PN-S64-CLK5410D
Model300
Lattice Socket Products
LFE3-95EA
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pqfp 132
Abstract: No abstract text available
Text: MC68HC16Z1VEH16 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information Operating Characteristics General Information Parameter Value Part Number MC68HC16Z1VEH16
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MC68HC16Z1VEH16
GGF16Z1
PQFP-G132
EAR99
pqfp 132
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BGA-132
Abstract: SF-BGA132A-B-11 1.27 pad layout
Text: D Package Code: BGA132A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.91mm [0.075"] 0.76mm [0.030"] X 16.51mm [0.650"] Top View reference only 1.91mm [0.075"] 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA132A
FR4/G10
SF-BGA132A-B-11
BGA-132
1.27 pad layout
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MMC02G
Abstract: "Manufacturer ID" eMMC 2Gbyte NAND flash emmc controller eMMC driver emmc 16g emmc csd emmc Initialization emmc jedec emmc jedec mechanical standard
Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage
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NAND08GAH0J
NAND16GAH0H
MMC02G
"Manufacturer ID" eMMC
2Gbyte NAND flash
emmc controller
eMMC driver
emmc 16g
emmc csd
emmc Initialization
emmc jedec
emmc jedec mechanical standard
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MMC02G
Abstract: LFBGA169 BGA 221 eMMC
Text: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage
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NAND08GAH0J
NAND16GAH0H
LFBGA153
MMC02G
LFBGA169
BGA 221 eMMC
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XC95288XV
Abstract: XC95288XV Family XC2C256
Text: XILINX CPLD http://www.xilinx.com/products/cpldsolutions PACKAGE OPTIONS AND USER I/O PRODUCT SELECTION MATRIX I/O Features 28 x 28 mm 173 173 173 164 172 180 168 168 VQFP Packages VQ 44 12 x 12 mm 64 12 x 12 mm 100 16 x 16 mm 33 33 64 36 80 80 36 68 34
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XCR3032XL
XC2C128
XC2C256
XC2C384
XC2C512
XCR3064XL
XCR3128XL
XCR3256XL
XCR3384XL
XCR3512XL
XC95288XV
XC95288XV Family
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MMC04G
Abstract: MMC08G FBGA169 "Manufacturer ID" eMMC LFBGA169 MMC16G eMMC driver MMC32G emmc bga TFBGA169
Text: NAND32GAHOK NAND64GAHOK NAND128AHOK NAND256AHOK 4-Gbyte, 8-Gbyte, 16-Gbyte, 32-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 32 Gbytes of formatted data storage
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NAND32GAHOK
NAND64GAHOK
NAND128AHOK
NAND256AHOK
16-Gbyte,
32-Gbyte,
MMC04G
MMC08G
FBGA169
"Manufacturer ID" eMMC
LFBGA169
MMC16G
eMMC driver
MMC32G
emmc bga
TFBGA169
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LCMXO1200C-3TN100C
Abstract: LCMXO640 LVCMOS15 LCMXO1200 LCMXO2280 LCMXO256 LVCMOS25 LVCMOS33 pb7a marking
Text: MachXO Family Data Sheet Version 02.3_4W February 2007 MachXO Family Data Sheet Introduction April 2006 Data Sheet • Flexible I/O Buffer Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL
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TN1086)
TN1087)
TN1097)
LCMXO1200C-3TN100C
LCMXO640
LVCMOS15
LCMXO1200
LCMXO2280
LCMXO256
LVCMOS25
LVCMOS33
pb7a marking
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Untitled
Abstract: No abstract text available
Text: MachXO Family Data Sheet Version 02.0_4W April 2006 MachXO Family Data Sheet Introduction April 2006 Data Sheet • Flexible I/O Buffer Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL − PCI
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twTN1086)
TN1087)
TN1097)
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Untitled
Abstract: No abstract text available
Text: t r ä n S w it c h -X-TB-524 TECHNICAL BULLETIN QEIM VLSI Device, TXC-04252 PRODUCT PREVIEW Plastic Ball Grid Array Package Option for OE1M Device PURPOSE OF THTS TECHNICAL BULLETIN TranSwitch is introducing an additional package option for the QEIM Quad E l Mapper VLSI Device. The
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OCR Scan
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TB-524
TXC-04252
208-Lead
MO-151-AAF-1
TXC-04252
TXC-04252-TB1
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