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Molex 0757103006 High Speed / Modular Connectors 11X6 DC REC GUIDE LEFT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	0757103006	Kit	8		1	1 $23.14 10 $23.14 100 $23.14 1000 $21.04 10000 $21.04	Buy Now
TE Connectivity 1717139-1 Automotive Connectors 025/040 SEALED 132PO CAP ASSY
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	1717139-1	Tray			50	1 - 10 - 100 $8 1000 $7.2 10000 $7.2	Buy Now

132POS Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
QUALITY CONTROL HARNESS ASSEMBLY Abstract: 1612776-1 Text: 411-78121 Instruction Sheet 取扱説明書 CLEAN BODY 22FEB08 025/040 Rev. B1 防水 132 極/104 極/60 極コネクタ（CLEAN BODY 025/040 SEALED 132Pos 104Pos 60Pos CONNECTOR）１．製品名称及製品名称及びび型番 Product Descriptions and Part Numbers	Original	22FEB08 132Pos 104Pos 60Pos 44Pos 34Pos QUALITY CONTROL HARNESS ASSEMBLY 1612776-1	PDF
JIS D1601 vibration Testing Method for Automobile Abstract: No abstract text available Text: Product Specification CLEAN BODY 025/040 Sealed 132pos Con Connector 108-5911 21SEP10 Rev.A3 1.Scope: 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of Clean Body 025/040 Sealed 132pos.Connector.	Original	132pos 21SEP10 100mm 44Pos JIS D1601 vibration Testing Method for Automobile	PDF
hk-001 94v-0 Abstract: sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136 Text: Catalog 1307612 Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: 650 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com Sockets Revised 7-01 Table of Contents DIP Sockets Solder Tail Dual Leaf (DL) Contact …………………………………………5002-5007	Original	8046-1G1 8046-1G2 8046-1G3 8046-1G4 8046-1G5 8046-1G6 8046-1G7 8046-1G8 8046-1G9 8046-1G10 hk-001 94v-0 sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136	PDF
din 42802 Abstract: AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2 Text: Catalog 296642 Focused Product Guide Revised 3-99 Input/Output Connectors Index Table of Contents Section One: Input/Output Connector Click Below Subminiature D, HDP-20 Crimp, Snap-In Connector AMPLIMITE Crimp, Snap-In Contacts and Solder Contacts, Size 20 D	Original	HDP-20 HDF-20 HDJ-20 HD-22 HD-20 HDE-20 Weight--14 din 42802 AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2	PDF
95-132I25 Abstract: AMS-QQ-N-290 Text: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,	Original	95-132I25 132-Position 13x13 C36000, 995132125-P 13x13 132PGM13072-30 AMS-QQ-N-290	PDF
ht 13003 Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196 Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature	Original	com/products/18012 com/products/18003 com/products/18013 350000-HT com/products/18005 com/products/18013RC 35W000 com/products/18007 com/products/18014 35W000-11-RC ht 13003 LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196	PDF
18017 Abstract: No abstract text available Text: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,	Original	95-132I25 132-Position 13x13 C36000, B16/B16M 995132125-P 132PGM13072-30 18017	PDF
DIMENSIONS PQFP 132 Abstract: 821949-51 Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 PQFP Sockets Revised 1-04 Standard Product Facts .025 [0.64] centerline for high density, low cost packaging • Low profile permits even higher density packaging	Original		PDF
Untitled Abstract: No abstract text available Text: 132-Position 8 x 4 Header jjLnmn nom-iBy_nJLiUL 2-2.6 dia ( 2 - , 102) 2-2.6 dia 3.5 (.138) ( 2- , 102) am am m) am r-> o (r> «SI J=1 UUUU UUUU ITU U U U UUUU 32 29 28 2 5 ' 2 4 5 4 1 3 (•118) . contact No. 3.15 (.124) 116.22 (4.576) Right angle type	OCR Scan	132-Position	PDF
Untitled Abstract: No abstract text available Text: Catalog 296642 Focused Product Guide Miscellaneous 1C Sockets PLCC Sockets - Low Profile, Surface Mount Square Sockets Material and Finish Housing — Polyphenylene sulfide, 40% glass-filled, 94V-0 rated 220°C Contacts — Phosphor bronze, plated.000200 [0,00508] min, tin-lead per	OCR Scan	MIL-T-10727 QQ-N-290	PDF
80286 schematic Abstract: lp9 pinout fe3031 FE3021A 8042 "Keyboard Controller" A1981 8042 keyboard controller LIM EMS 4.0 tl982 c3fff Text: FE3021 DESCRIPTION 1.0 DESCRIPTION 1.1 The FE3021 is a 16 MHz AT address buffer and memory controller in a 132-pin JEDEC package. Chip count is significantly reduced by integrating the memory controller, AT bus address buffers, and I/O into one chip. The memory controller is a	OCR Scan	FE3021 FE3021 132-pin FE3021. FE3600B aS5S23s36S3 0io10 Tl982 132POSN 80286 schematic lp9 pinout fe3031 FE3021A 8042 "Keyboard Controller" A1981 8042 keyboard controller LIM EMS 4.0 c3fff	PDF
Untitled Abstract: No abstract text available Text: A I V I P Catalog 1307612 PQFP Sockets Revised 7-01 Standard Product Facts • .025 [0.64] centerline for high density, low cost packaging ■ Low profile permits even higher density packaging with only .375 [9.53] maximum height pc boards ■ High normal force and	OCR Scan		PDF