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    1352H Search Results

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    G64V31352HR Amphenol Communications Solutions Extremeport Z-Link, SFF-TA-1002/1020, 85Ω, Surfacemount, Vertical, 1C, 56 Pin, PCIe, GenZ, NVMe, cable, dual, card Visit Amphenol Communications Solutions
    G97V21352HR Amphenol Communications Solutions Mini Cooledge IO Vertical, 0.6mm pitch, Surface mount, PCIE Gen 5, 30u\\ gold, 1.20mm shell pin length, Visit Amphenol Communications Solutions
    G64R31352HR Amphenol Communications Solutions Extremeport Z-Link, SFF-TA-1002/1020, 85Ω, Surfacemount, Right Angle, 1C, 56 Pin, PCIe, GenZ, NVMe, cable, dual, card Visit Amphenol Communications Solutions
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    Amphenol Communications Solutions G97V21352HR

    CONN EDGE DUAL FMALE 38POS 0.024
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    DigiKey G97V21352HR Digi-Reel 429 1
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    G97V21352HR Cut Tape 429 1
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    G97V21352HR Reel 200 200
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    Newark G97V21352HR Cut Tape 2,798 1
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    G97V21352HR Reel 2,800
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    Master Electronics G97V21352HR
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    Citizen Finedevice Co Ltd CLU02Q-1203E1-352H5X3

    LED COB CLU02Q WARM WHT SQ 3500K
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    DigiKey CLU02Q-1203E1-352H5X3 Tray 66 1
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    Citizen Finedevice Co Ltd CLU02Q-1201E1-352H5X3

    LED COB CLU02Q WARM WHT SQ 3500K
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    DigiKey CLU02Q-1201E1-352H5X3 Tray 54 1
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    Citizen Finedevice Co Ltd CLU02Q-1202E1-352H5X3

    LED COB CLU02Q WARM WHT SQ 3500K
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    DigiKey CLU02Q-1202E1-352H5X3 Tray 54 1
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    Citizen Finedevice Co Ltd CLU03Q-1208E1-352H5X3

    LED COB CLU03Q WARM WHT SQ 3500K
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    DigiKey CLU03Q-1208E1-352H5X3 Tray 51 1
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    1352H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    TDK H5C2 material

    Abstract: SC12N pc40t TDK H5C2 CORE MATERIAL TDK pc90 P30/19 TDK H5C2 TDK PC95 X HP5 tdk pc40 core
    Text: 伝送用フェライト 概要 Issue date: February 2010 ●製品をより正しく安全にご使用いただくために、さらに詳細な特性・仕様をご確認いただける納入仕様書をぜひご請求ください。 ●記載内容は、改良その他により予告なく変更する場合がありますので、あらかじめご了承ください。


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    PDF 2002/95/EC C1400 800J/kg 100kg/cm2 107N/m2 106N/m2 1011N/m2 AL400 AL400 65ATFig TDK H5C2 material SC12N pc40t TDK H5C2 CORE MATERIAL TDK pc90 P30/19 TDK H5C2 TDK PC95 X HP5 tdk pc40 core

    ferrite core transformer calculation formula

    Abstract: TDK Ferrite Core PC40 ferrite core tdk h5c2 TDK H5C2 material TDK Ferrite Core PC44 TDK Ferrite Core PC40 ei SC12N TDK H5C2 TDK H5C2 CORE MATERIAL tdk ferrite H5A
    Text: Ferrite for Telecommunication Summary Issue date: February 2010 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific


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    PDF 2002/95/EC, ferrite core transformer calculation formula TDK Ferrite Core PC40 ferrite core tdk h5c2 TDK H5C2 material TDK Ferrite Core PC44 TDK Ferrite Core PC40 ei SC12N TDK H5C2 TDK H5C2 CORE MATERIAL tdk ferrite H5A

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    SI 1340H

    Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
    Text: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.


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    PDF PM5365 PMC-1990682 PM5365 PMC-1990682 SI 1340H 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    TDK H5C2 material

    Abstract: TDK H5C2 CORE MATERIAL SC12N TDK H5C2 AW106 pc40t tdk pc95 TDK PC40 EE TDK EI PC40 EI 28 PC95
    Text: 勧補喘鑓剳悶 古勣 Issue date: February 2010 ●芝墮坪否,壓短嗤嚠御議秤趨和嗤辛嬬個序才延厚,萩嚠參疎盾。 ● RoHS 峺綜議斤哘:燕幣茅阻卆象 EU Directive 2002/95/EC 窒茅議喘余岻翌,隆聞喘忍,鑽,康,鎗勺候式蒙協粤狼佃伴質 PBB,PBDE 吉。


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    PDF 2002/95/EC 800J/kg 100kg/cm2 107N/m2 106N/m2 1011N/m2 194A/m 3AL400AL400 65ATFig 165A25 TDK H5C2 material TDK H5C2 CORE MATERIAL SC12N TDK H5C2 AW106 pc40t tdk pc95 TDK PC40 EE TDK EI PC40 EI 28 PC95

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    SI 1360H

    Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
    Text: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential


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    PDF PM8315 PMC-1990495 PM8315 SI 1360H 1542H 1488h 1558h PSL 26 MX12 MX23 SI 1340H

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


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    PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0110 R8C/22 R8C/23