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    16 PIN DIP WITH HEAT SINK Search Results

    16 PIN DIP WITH HEAT SINK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    16 PIN DIP WITH HEAT SINK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    16 pin dip with heat sink

    Abstract: 580200B00000G
    Text: Standard Heat Sinks For use with 14 or 16 PIN DIP packages Part Number - 580200B00000G Mechanical Outline Drawing 10/24/2007 Page 2 of 3 A Dim 6.35 Thermal Curves Therm based o Product Information Part # Description Finish 580200B00000G Slide on heat sink with angled


    Original     		PDF 580200B00000G 16 pin dip with heat sink 580200B00000G

    Thermal Management

    Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
    Text: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.


    Original     		PDF

    NTE422

    Abstract: NTE209 NTE410 NTE426 NTE430 NTE417 NTE421 TO3 SILICONE MICA SHEET DATA SHEET NTE435K28 NTE436W22
    Text: HARDWARE & ACCESSORIES NTE Type Number Diagram Number Quantity Per Pkg NTE400 NTE401 NTE402 NTE403 NTE404 NTE405 NTE406 NTE406A NTE410 NTE411 NTE412 NTE440A NTE440B 362 352 363 364 365 366 373 727 354 345 367 520 520 2 2 2 2 1 1 2 2 2 2 2 1 1 Heat Sink for TO5/TO39 Type Package


    Original     		PDF NTE400 NTE401 NTE402 NTE403 NTE404 NTE405 NTE406 NTE406A NTE410 NTE411 NTE422 NTE209 NTE410 NTE426 NTE430 NTE417 NTE421 TO3 SILICONE MICA SHEET DATA SHEET NTE435K28 NTE436W22

    Y1212

    Abstract: b0505s-1w BM025 PMB2409 vrb2405d-5w PMB4824 ADP05C24A ADP05C24 Y051 WRB0515S-1W
    Text: ADPCA Series FEATURES INPUT SPECIFICATIONS ● LCD Display Appropriative ● Single Output ● Small Footprint ● SIP Package ● Industry Standard Pinout ● UL94-V0 Package ● No Heat sink Required ● Temperature Range: -20°C -+71°C ● No External Components Required


    Original     		PDF UL94-V0 ADP05C24A 12VDC UL94-V0) NOV-2005 Y1212 b0505s-1w BM025 PMB2409 vrb2405d-5w PMB4824 ADP05C24A ADP05C24 Y051 WRB0515S-1W

    Motorola ULN2068B

    Abstract: all ic data Motorola ic DATA BOOK ULN2068 ULN2068B uln2060 motorola DTL
    Text: Order this document by ULN2068/D ULN2068 Quad 1.5 A Sinking High Current Switch The ULN2068B is a high–voltage, high–current quad Darlington switch array designed for high current loads, both resistive and reactive, up to 300 W. It is intended for interfacing between low level TTL, DTL, LS and 5.0 V


    Original     		PDF ULN2068/D ULN2068 ULN2068B ULN2068/D* Motorola ULN2068B all ic data Motorola ic DATA BOOK ULN2068 uln2060 motorola DTL

    Untitled

    Abstract: No abstract text available
    Text: OVEN INDUSTRIES, INC. OPERATING MANUAL Model 5C7-550 A THERMOELECTRIC MODULE TEMPERATURE CONTROLLER CAUTION: Always be careful around heaters and TE modules, their related heat sinks, or other parts of the thermal system. Do not come into contact with a hot or very cold surface. Use a thermal fuse for


    Original     		PDF 5C7-550 5C7-550 24volt

    Untitled

    Abstract: No abstract text available
    Text: M3WPWA_D Series 4:1 WIDE INPUT ISOLATED & REGULATED 3W OUTPUT DUAL OUTPUT 24 DIP PACKAGE FEATURES RoHS PRODUCT PROGRAM ● Wide 4:1 Input Range ● Operating Temperature: -40°C~+85°C ● 1.5KVDC Isolation ● Dual Output ● UL94-V0 Package ● No Heat Sink Required


    Original     		PDF UL94-V0 M3WPWA2405D 36VDC M3WPWA2409D M3WPWA2412D M3WPWA2415Din NOV-2005

    682-2102

    Abstract: amp 3510 682-2101 CRYDOM CX240D5
    Text: C r y d o m Company Solid State Relays For Complete Product Specifications c FAX-ON-DEMAND, Call 888-267-9188 for Instant Specs on Your FAX c www.crydom.com Ñ View and Download Specifications AC Series SDV, SDI, DPA AC Series ASPF PowerFin Ñ Integral Heat Sink


    Original     		PDF technolog240D5R CXE240D5 CXE240D5R* CX380D5 CX480D5 DO061A CXE480D5 DO061B MCX380D5 DMO063 682-2102 amp 3510 682-2101 CRYDOM CX240D5

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original     		PDF follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    16DIP300

    Abstract: TAPE RECORDER bias tape head pre amplifier TAPE RECORDER bias application EARJ diode 1n60 1N60 S1A2213C01 S1A2213C01-D0B0 S1A2213C01-H0B0
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213C01 S1A2213C01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF 16DIP300 TAPE RECORDER bias tape head pre amplifier TAPE RECORDER bias application EARJ diode 1n60 1N60 S1A2213C01-D0B0 S1A2213C01-H0B0

    tape head pre amplifier

    Abstract: TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213C01 S1A2213C01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF tape head pre amplifier TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias

    TAPE RECORDER bias

    Abstract: TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213B01 S1A2213B01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF TAPE RECORDER bias TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER

    TAPE RECORDER bias

    Abstract: TAPE RECORDER bias application tape head pre amplifier 16DIP300 DUAL PRE-AMPLIFIER FOR TAPE RECORDER diode 1n60 ALC RECORDER PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER 1N60 diode
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213B01 S1A2213B01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF TAPE RECORDER bias TAPE RECORDER bias application tape head pre amplifier 16DIP300 DUAL PRE-AMPLIFIER FOR TAPE RECORDER diode 1n60 ALC RECORDER PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER 1N60 diode

    FSBB30CH60C

    Abstract: AN-9044 FSBB15CH60C schematic diagram inverter air conditioner FSBB20CH60C pneumatic system used in train heat sink design guide, inverter, water cooling IGBT INVERTER CIRCUIT FSBB20CH60CT COMPONENT REQUIRED FOR MAKING MINI INVERTER
    Text: V4 Mini DIP SPM Application Note 2008-03-03 Application Note AN-9044 Smart Power Module Motion-SPM in Mini DIP SPM Ver.4 User’s Guide Written by: BokKeun Song JongMu Lee SooHyuk Han GuHo Jung Motion Control System HV FPG FAIRCHILD SEMICONDUCTOR 2008-03-03


    Original     		PDF AN-9044 FSBB30CH60C AN-9044 FSBB15CH60C schematic diagram inverter air conditioner FSBB20CH60C pneumatic system used in train heat sink design guide, inverter, water cooling IGBT INVERTER CIRCUIT FSBB20CH60CT COMPONENT REQUIRED FOR MAKING MINI INVERTER

    Untitled

    Abstract: No abstract text available
    Text: M2WWRA-B_N Series 2W, WIDE INPUT, DUAL & SINGLE OUTPUT, DIP DC-DC CONVERTER FEATURES PRODUCT PROGRAM Ultra Miniature Dip Package Wide 2:1 Input Range 1500VDC Isolation Operating Temperature: -40°C~+85°C No Heat Sink Required Short Circuit Protection (Automatic Recovery)


    Original     		PDF 1500VDC M2WWRA1209N M2WWRA1212N M2WWRA1205N M2WWRA1215N M2WWRB1209N M2WWRB1212N

    191 ISOLATION TRANSFORMER

    Abstract: HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 HI-1569 Holt Applications Note AN-500
    Text: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers November 2004 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1567, HI-1568 MIL-STD-1553 HI-1569 MIL-STD-1553A MIL-STD-1760, 44-pin 20-PIN 191 ISOLATION TRANSFORMER HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 Holt Applications Note AN-500

    HI1568PSI

    Abstract: TL1553-45 MIL-STD-1553 voltage HI-1567 TQ1553 TQ1553-2 HI-1568 HI-1569 HI-1567CDI HI-1567PSI
    Text: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1567, HI-1568 MIL-STD-1553 HI-1569 MIL-STD-1553A MIL-STD-1760, 44-pin 20-PIN HI1568PSI TL1553-45 MIL-STD-1553 voltage HI-1567 TQ1553 TQ1553-2 HI-1568 HI-1567CDI HI-1567PSI

    Untitled

    Abstract: No abstract text available
    Text: SMB1N-1550 v 1.0 1.07.2014 Description SMB1N-1550 is a surface mount InGaAsP High Power LED with a typical peak wavelength of 1550 nm and radiation of 16 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-1550 SMB1N-1550

    124 008r

    Abstract: No abstract text available
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER July 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r

    3188 diode

    Abstract: 124 008r
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER December 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 3188 diode 124 008r

    HI-3183

    Abstract: 124 008r HI-3182 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 December 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 HI-3183 124 008r HI-3182 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383

    Teledyne

    Abstract: No abstract text available
    Text: ö'llTbbT QQOQSÔS 3 • TSS 45E D TELEDYNE SOLID STATE WTELEDYNE SOLID STATE MODEL MILITARY SOLID STATE RELAY 682-1 M28750/9 OPTICALLY ISOLATED 1 A, 250 Vrms (2 A with Heat Sink) SPST/SO FEATURES • JAN Relay, qualified to MIL-R-28750 PART NUMBER* MILITARY


    OCR Scan     		PDF M28750/9) MIL-R-28750 82-1W 682-1Y M28750/9-001W M28250/9-001Y MIL-R-28750. Teledyne