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    Abstract: No abstract text available
    Text: f - J T '— used fo r : ir I D -SU B ^ t N O TES : • ^ LM ETA LS H a LS < S T EEL; TIN PLATED ' t INSULATORS PA U L 94 V -fl; B LA C K • 3. PLATING: min. 8fi* HARD GOLD O V ER , in. 5Sp" NICKEL ! 4. PCB-SNAP: COPPER A LLO Y ; TIN PtAjTEO PCB-HQL& #3.1*0.1;PCB THICKNESS! LGmm


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    PDF 16K1HUA 3C1A515S03X 3O1A537603X 301A5096O3X 301A52S683X 9-37pos.