PPAP level submission requirement table
Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage
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diode b1c SMD
Abstract: EM78P159NAS R3F SMD EM78P159N XTAL 8MHZ SMD EM78P157N EM78P159NM EM78P159NP DIODE C63
Text: EM78P159N 8-Bit Microcontroller with OTP ROM Product Specification DOC. VERSION 1.0 ELAN MICROELECTRONICS CORP. March 2006 Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation.
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EM78P159N
EM78P159N
diode b1c SMD
EM78P159NAS
R3F SMD
XTAL 8MHZ SMD
EM78P157N
EM78P159NM
EM78P159NP
DIODE C63
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Untitled
Abstract: No abstract text available
Text: MIL-DTL-38999: Our customizable product solutions proves our continued focus on customers demand. ITT’s D38999 meets the stringent MIL-DTL-38999 specifications and is ideally suited for the harsh environments in military and aerospace. This product line
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MIL-DTL-38999:
D38999
MIL-DTL-38999
MIL-C-39029
MIL-I-81969
MIL-STD-1560
1970s.
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BAI 59
Abstract: plaskon FBGA PACKAGE thermal resistance
Text: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069
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CY62127VLL-BAI
CY62137VLL-BAIB
BAI 59
plaskon
FBGA PACKAGE thermal resistance
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DC04 display
Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79
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DC04-0001
DC04 display
how to test POWER MOSFET with digital multimeter
tektronix 576 curve tracer
VISHAY VT 300 WEIGHT INDICATOR
TSMC 0.35Um
FLUKE 79 manual
THERMAL ELECTRIC COOLER
hp 4274A
532 nm laser diode
PHOTO TRANSISTOR ppt
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1mm pitch BGA
Abstract: No abstract text available
Text: 512K x 8 Static RAM MSM8512B - 020 Issue 5.0 September 1999 Description The MSM8512B is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM8512B
020/48D
1mm pitch BGA
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Abstract: No abstract text available
Text: Description The MSM8512B is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature grades. The Chip Size BGA provides an ultra high density
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MSM8512B
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Abstract: No abstract text available
Text: SIDACtor Protection Thyristors Broadband Optimized Protection SDP Biased Series - SOT23-6 RoHS Pb e3 Description This new SDP Biased series provides overvoltage protection for applications such as VDSL2, ADSL2, and ADSL2+ with minimal effect on data signals. This
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OT23-6
OT23-6
30MHz)
180mm
EIA-481
OT-23
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Untitled
Abstract: No abstract text available
Text: 512K x 8 Static RAM MSM8512C - 020 Issue 5.2 April 2001 Description The MSM8512C is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM8512C
MSM8512CB
020/48D
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Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM81000B
140mW
020/48D
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Untitled
Abstract: No abstract text available
Text: SIDACtor Protection Thyristors Teccor® brand SIDACtor® DSL Protection Devices SDP Series - SOT23-5 Description This new SIDACtor series is targeted for the tertiary or line driver side protection position for VDSL2+, ADSL2 applications and general I/O protection functions. This new
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OT23-5
OT23-5
30MHz
EIA-481-A
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Untitled
Abstract: No abstract text available
Text: 512K x 8 Static RAM MSM8512B - 020 Issue 5.1 April 2000 Description The MSM8512B is a 512K x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM8512B
MSM8512AB
020/48D
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tsmc cmos 0.13 um sram
Abstract: TSMC 90nm sram ford ppap EMMI microscope TSMC 0.13um process specification PPAP MANUAL for automotive industry Kyocera mold compound semiconductors cross index ISO 9001 Sony foundry metals quality MANUALS
Text: Integrated Silicon Solution Inc 2012 Q Quality y and Reliability Manual Contents Content Page Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2008 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning
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em78p154nmj
Abstract: EM78P154 EM78P159NPJ EM78P159 EM78P154NPJ smd code p61 SMD 5 PIN CODE PAB EM78P159NMJ EM78P159NM EM78P159NP
Text: EM78P159/155NxJ/xS EM78P154/1541NxJ/xS 8-Bit Microcontroller with OTP ROM Product Specification DOC. VERSION 1.4 ELAN MICROELECTRONICS CORP. July 2007 Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation.
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EM78P159/155NxJ/xS
EM78P154/1541NxJ/xS
EM78P159/155/154/1541N
ICE159N
em78p154nmj
EM78P154
EM78P159NPJ
EM78P159
EM78P154NPJ
smd code p61
SMD 5 PIN CODE PAB
EM78P159NMJ
EM78P159NM
EM78P159NP
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ED-4701
Abstract: J-STD-020B LTW020ZDCG-P1 LTW-020ZDCG
Text: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Package in 12mm tape on 7" diameter reels. * Compatible with automatic placement equipment. * Compatible with infrared and vapor phase reflow solder process. * EIA STD package. * I.C. compatible.
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LTW-020ZDCG-P1
BNS-OD-C131/A4
LTW-020d
EIA-471
ED-4701
J-STD-020B
LTW020ZDCG-P1
LTW-020ZDCG
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A102C
Abstract: No abstract text available
Text: SIDACtor Protection Thyristors Broadband Optimized Protection SDP Biased Series - SOT23-6 RoHS Description This new SDP Biased series provides overvoltage protection for applications such as VDSL2, ADSL2, and ADSL2+ with minimal effect on data signals. This
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OT23-6
OT23-6
30MHz)
180mm
EIA-481
OT-23
A102C
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nitto 201
Abstract: mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128
Text: Cypress Semiconductor Technology Derivative Qualification Report QTP# 99396 VERSION 1.2 November, 2000 R52LD-5R Technology Fab 4 Cypress CY62128B 128K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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R52LD-5R
CY62128B
CY62128B-ZAC
CY62128B-SC
nitto 201
mp8000ch4
8361H
CY62128B
MP8000CH4-A2
MP8000C
7C62128
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transistor b740
Abstract: N010-0551-T642 N010-0559-V036 4-wire Resistive Technology N010-0550-T627 JIS for humidity test for touch screen T703 17-inch lcd touch screen NC41120-0018 touch light control
Text: CAPABILITY OVERVIEW RESISTIVE TOUCH PANELS FUJITSU, TOUCH PANELS simple solutions in a complex world Fujitsu Touch Panels Fujitsu is a one of the leading touch panel manufacturers. Our production process is based on the best choice of industry materials, achieving an outstanding optical and mechanical
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17MAR06.
transistor b740
N010-0551-T642
N010-0559-V036
4-wire Resistive Technology
N010-0550-T627
JIS for humidity test for touch screen
T703
17-inch lcd touch screen
NC41120-0018
touch light control
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Untitled
Abstract: No abstract text available
Text: EM78P159/155NxJ/xS 8-Bit Microcontroller with OTP ROM Product Specification DOC. VERSION 1.2 ELAN MICROELECTRONICS CORP. March 2007 Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation.
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EM78P159/155NxJ/xS
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9200
Abstract: cel 9200 hitachi mold cel 8361H JESD22 cel hitachi CEL-9200
Text: Cypress Semiconductor Qualification Report QTP# 97174 VERSION 1.0 June, 1997 Hitachi CEL 9200/9200U Molding Compound Cypress Semiconductor Hitachi CEL 9200/9200U Moding Compound Device: CY7C1009/CY7C199 Package: SOJ/TSOP QTP# 97174, V. 1.0 Page 2 of 7 Jun, 1997
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9200/9200U
CY7C1009/CY7C199
28-pins
8361H
JESD22-A112
85C/85
CY7C1009-VC
9200
cel 9200
hitachi mold cel
8361H
JESD22
cel hitachi
CEL-9200
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8355F
Abstract: 130C JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 99331 VERSION 2.0 December, 2000 48 Lead Fine Pitch Ball Grid Array FBGA 7mm x 8.5mm ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Kim-Ngan Nguyen
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BA48G
48-ball
O925255
CY62146VLL-BAIB
150C/-55)
8355F
130C
JESD22
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Marvell 8686
Abstract: CSR BC4 bluetooth CSR BC4 rom bluetooth Coexistence 3-wire CSR BC4 bt Coexistence wire CSR BC4 external CSR Bluetooth Driver 4.0 BC4 csr bluetooth module BC4
Text: Preliminary DFCM-MGC31 WLAN/ Bluetooth Combo Module An IEEE 802.11g&b WLAN plus v2.0 + EDR Bluetooth Module for various applications. 1. Features: z Applications for cellular handsets and consumer electronic devices that require low power consumption z Compared with DFWM-MHG21
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DFCM-MGC31
DFWM-MHG21
DFBM-CS32x
DFWM-MHG21
Marvell 8686
CSR BC4 bluetooth
CSR BC4 rom
bluetooth Coexistence 3-wire
CSR BC4
bt Coexistence wire
CSR BC4 external
CSR Bluetooth Driver 4.0
BC4 csr
bluetooth module BC4
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GEZ 44 A diode
Abstract: No abstract text available
Text: Transient Voltage Suppression Diodes Surface Mount – 1500W > SMCJ-HR series SMCJ-HR Series RoHS Description TVS Diode Arrays SPA Family of Products Uni-directional The SMCJ-HR High Reliability series is designed specifically to protect sensitive electronic equipment from
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E230531
DO-214AB
16mm/7â
RS-481
GEZ 44 A diode
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SAMSUNG NAND Flash Qualification Report
Abstract: SAMSUNG 128Mb NAND Flash Qualification Reliability NAND "read disturb" Samsung NAND Qualification Reliability NAND Flash Qualification Reliability NAND qualification NAND read disturb 63-TBGA K9F2808U0C-YCB0 K9F2808U0C-YIB0
Text: SAMSUNG 128Mb NAND Flash Qualification & Reliability Report [ 128Mb NAND Flash C-die ] September, 2003 Rev. 01 Memory Quality Assurance The information contained in this document is proprietary to Samsung Electronics Co., Ltd. and shall be protected from any reproduction in part or as a whole without Samsung`s written approval.
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128Mb
industria1980
30pcs
48TSOP1
SAMSUNG NAND Flash Qualification Report
SAMSUNG 128Mb NAND Flash Qualification Reliability
NAND "read disturb" Samsung
NAND Qualification Reliability
NAND Flash Qualification Reliability
NAND qualification
NAND read disturb
63-TBGA
K9F2808U0C-YCB0
K9F2808U0C-YIB0
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