SF-BGA256J-B-01
Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Text: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
16x16
SF-BGA256J-B-01
FR4 substrate 1.6mm
SN63
FR4 1.6mm substrate
1.6mm pitch BGA
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0.3mm pitch BGA
Abstract: SF-BGA180C-B-11
Text: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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FR4/G10
16x16
SF-BGA180C-B-11
0.3mm pitch BGA
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0.3mm pitch BGA
Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1
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BGA292D
396mm
508mm
635mm
FR4/G10
20X20
488mm
SF-BGA292D-B-11
0.3mm pitch BGA
micro pitch BGA
1mm pitch BGA
BGA 20x20
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0.3mm pitch BGA
Abstract: 34X34 1mm pitch BGA SF-BGA680B-B-11
Text: C D Ø 0.0156" 2x (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 33mm X Top View (reference only) 1mm [0.039"] pitch typ. 0.508 mm [0.020"] dia pads 0.3mm [0.012"] dia. 2 8.69mm [0.342"] 6.85mm [0.270"] 0.5mm 0.5mm 33mm B 1
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FR4/G10
34X34
SF-BGA680B-B-11
SF-BGA-680B-B-11
0.3mm pitch BGA
34X34
1mm pitch BGA
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ultra fine pitch BGA
Abstract: C49B 22-N-4
Text: HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawinski graduated from Worcester Polytechnic Institute with a BSEE in 1978 and
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1mm pitch BGA socket
Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)
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MIL-STD202,
1mm pitch BGA socket
thermal shock standard
papst 3412
25M1
Muffin
Thermal Resistance Calculation TO
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transistor CS4
Abstract: BGA Solder Ball 1mm D4047
Text: Issue 1.0 Sept 2001 Description The MSM64V256CB is a 16MBit Fast 3.3V SRAM available in a multichip 192 ball BGA Ball Grid Array package. The device can be organised as 256Kx64, 512Kx32 and 1Mx16. Access times of 15 and 20ns are available at Commercial or Industrial
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MSM64V256CB
16MBit
256Kx64,
512Kx32
1Mx16.
64V256
transistor CS4
BGA Solder Ball 1mm
D4047
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bga676
Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
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27x27mm,
26x26
SBT-BGA-6002
bga676
1mm pitch BGA socket
BGA-676
BGA 27X27 pitch
27X27MM
7075-T6 aluminum
180C
7075-T6
1mm pitch BGA
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Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM81000B
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106 10k 804
Abstract: 106F 213B
Text: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &
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Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
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MSM81000B
140mW
020/48D
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JEDEC JESD22-B117
Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet
Text: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4
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1mm pitch BGA 14X14
Abstract: 14X14 SF-BGA156A-B-11 BGA Solder Ball 1mm BGA Package 14x14 pitch 0.4mm BGA
Text: C Package Code: BGA156A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.53mm [0.021"] 2 0.53mm [0.021"]
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BGA156A
FR4/G10
14X14
SF-BGA156A-B-11
1mm pitch BGA 14X14
14X14
BGA Solder Ball 1mm
BGA Package 14x14
pitch 0.4mm BGA
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pitch 0.4mm BGA
Abstract: 10X10 SF-BGA100B-B-11 0.4mm pitch BGA
Text: C Package Code: BGA100B D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 9.00mm [0.354"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]
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BGA100B
FR4/G10
10X10
SF-BGA100B-B-11
pitch 0.4mm BGA
10X10
0.4mm pitch BGA
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BGA Solder Ball 1mm
Abstract: SF-BGA672B-B-11 pitch 0.4mm BGA
Text: C Package Code: BGA672B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] 1.00mm pitch typ. X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"] dia pads
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BGA672B
FR4/G10
26X26
27mss.
SF-BGA672B-B-11
BGA Solder Ball 1mm
pitch 0.4mm BGA
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pitch 0.4mm BGA
Abstract: SF-BGA324A-B-11
Text: C Package Code: BGA324A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]
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BGA324A
FR4/G10
20X20
SF-BGA324A-B-11
pitch 0.4mm BGA
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0.4mm pitch BGA
Abstract: pitch 0.4mm BGA SF-BGA324G-B-11 1mm pitch BGA
Text: C Package Code: BGA324G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 17.00mm [0.669"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA324G
FR4/G10
18X18
SF-BGA324G-B-11
0.4mm pitch BGA
pitch 0.4mm BGA
1mm pitch BGA
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bga48
Abstract: SF-BGA48M-B-11 0.4mm pitch BGA
Text: C Package Code: BGA48M D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 6.00mm [0.236"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]
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BGA48M
FR4/G10
SF-BGA48M-B-11
SF-BGA048M-B-11
bga48
0.4mm pitch BGA
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0.4mm pitch BGA
Abstract: pitch 0.4mm BGA 27mmx27mm SF-BGA388B-B-11
Text: C Package Code: BGA388B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm [0.020"] dia pads
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BGA388B
FR4/G10
26X26
SF-BGA388B-B-11
0.4mm pitch BGA
pitch 0.4mm BGA
27mmx27mm
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1mm pitch BGA 144
Abstract: 12X12 SF-BGA144C-B-11 BGA144C
Text: C Package Code: BGA144C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 11.00mm [0.433"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 0.508 mm [0.020"]
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BGA144C
FR4/G10
12X12
SF-BGA144C-B-11
1mm pitch BGA 144
12X12
BGA144C
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16X16
Abstract: SF-BGA208C-B-11 16x16 bga
Text: C Package Code: BGA208C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA208C
FR4/G10
16X16
SF-BGA208C-B-11
16X16
16x16 bga
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pitch 0.4mm BGA
Abstract: 1299b 34X34 SF-BGA480E-B-11
Text: C Package Code: BGA480E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 33.00mm [1.299"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 2 0.508 mm
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BGA480E
FR4/G10
34X34
SF-BGA480E-B-11
pitch 0.4mm BGA
1299b
34X34
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PDF
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SF-BGA352B-B-11
Abstract: No abstract text available
Text: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads
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BGA352B
FR4/G10
26X26
SF-BGA352B-B-11
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16x16 bga
Abstract: 16X16 SF-BGA256E-B-11
Text: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA256E
FR4/G10
16X16
SF-BGA256E-B-11
16x16 bga
16X16
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