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    1MM PITCH BGA 144 Search Results

    1MM PITCH BGA 144 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    1MM PITCH BGA 144 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1mm pitch BGA 144

    Abstract: 12X12 SF-BGA144C-B-11 BGA144C
    Text: C Package Code: BGA144C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 11.00mm [0.433"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 0.508 mm [0.020"]


    Original     		PDF BGA144C FR4/G10 12X12 SF-BGA144C-B-11 1mm pitch BGA 144 12X12 BGA144C

    55740-001LF

    Abstract: 10060913-001 GS-20-016
    Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the


    Original     		PDF 10Gb/s 100-Ohm inno1-001LF 55700-001LF 55727-001LF 10054784-001LF 55740-001LF 10060912-001LF 55701-001LF 10060913-001LF 10060913-001 GS-20-016

    Untitled

    Abstract: No abstract text available
    Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the


    Original     		PDF 10Gb/s 100-Ohm inno4784-001LF 55740-001LF 10081496-001LF 10060912-001LF 55701-001LF 10081497-001LF 10060913-001LF ELXGIGARRAY0812ELT

    55740-001LF

    Abstract: FCI Connector TERMINAL FCI 0.65mm pitch BGA solder joint reliability 1mm pitch BGA GR-1217-CORE 10060912-001LF bga trays
    Text: BOARD TO BOARD CONNECTORS GIG-ARRAY CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the


    Original     		PDF 10Gb/s 100-Ohm 55740-001LF 10081496-001LF 10060912-001LF 55701-001LF 10081497-001LF 10060913-001LF ELXGIGARRAY0408ELT 55740-001LF FCI Connector TERMINAL FCI 0.65mm pitch BGA solder joint reliability 1mm pitch BGA GR-1217-CORE 10060912-001LF bga trays

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


    Original     		PDF 1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296

    8mm pitch BGA 256 pin 14x14

    Abstract: CB45000 CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


    Original     		PDF CB55000 8mm pitch BGA 256 pin 14x14 CB45000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10

    b55qs

    Abstract: CB45000 ultra fine pitch BGA CB55Q CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


    Original     		PDF CB55000 b55qs CB45000 ultra fine pitch BGA CB55Q D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics

    0.25-um CMOS standard cell library inverter

    Abstract: CMOS GATE ARRAY stmicroelectronics OLIVETTI
    Text: CB55000 Series HCMOS7 Standard Cells FEATURES • ■ ■ ■ ■ ■ 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided


    Original     		PDF CB55000 0.25-um CMOS standard cell library inverter CMOS GATE ARRAY stmicroelectronics OLIVETTI

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		PDF N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile

    CG51364

    Abstract: CG51284 CG51114 CG51754 CG51214 CG51484 CG51654 fujitsu asic quad design motive
    Text: November 1995 Edition 1.5 DATA SHEET CG51/CE51 SERIES 3V, 0.50 MICRON HIGH PERFORMANCE/LOW POWER CMOS GATE ARRAYS DESCRIPTION The Fujitsu CG51/CE51 is a series of ultra high performance CMOS gate arrays. The CG51 is a high density Sea-of-Gates array for applications requiring high levels of integration or low


    Original     		PDF CG51/CE51 Th5431 ASIC-DS-20084-11/95 CG51364 CG51284 CG51114 CG51754 CG51214 CG51484 CG51654 fujitsu asic quad design motive

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: KMMR16R84 6/8/C/G C1 KMMR18R84(6/8/C/G)C1 4/6/8/12/16d 4/6/8/12/16d RIMMTM RIMMTM Preliminary Module with 128Mb RDRAMs Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad


    Original     		PDF KMMR16R84 KMMR18R84 4/6/8/12/16d 128Mb 144Mb 128Mb/144Mb

    Untitled

    Abstract: No abstract text available
    Text: KMMR16R84 6/8/C/G C KMMR18R84(6/8/C/G)C 4/6/8/12/16d 4/6/8/12/16d RIMMTM RIMMTM Preliminary Module with 128Mb RDRAMs Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad


    Original     		PDF KMMR16R84 KMMR18R84 4/6/8/12/16d 128Mb 144Mb 128Mb/144Mb

    74 hc 59581

    Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
    Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .


    Original     		PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16

    rg6 f connector

    Abstract: 534 b34 diode a32 1015
    Text: Preliminary KMMR16R84 6/8/C/G AC1 KMMR18R84(6/8/C/G)AC1 RIMMTM 4/6/8/12/16d Module with 128Mb RDRAMs TM 4/6/8/12/16d RIMM Module with 144Mb RDRAMs Overview Key Timing Parameters/Part Numbers The Rambus RIMM module is a general purpose highperformance memory subsystem suitable for use in a broad


    Original     		PDF KMMR16R84 KMMR18R84 4/6/8/12/16d 128Mb 144Mb 4/6/8/12/16d 128Mb/144Mb rg6 f connector 534 b34 diode a32 1015

    337 BGA footprint

    Abstract: tray datasheet bga 10x10 84502 meg array 55740-001LF 74221 84512 84501 84501-201 bga 9x9 Shipping Trays tray datasheet bga 9x9
    Text: COMMUNICATIONS, DATA, CONSUMER DIVISION Mezzanine High-Speed High-Density Connectors GIG-ARRAY and MEG-ARRAY® Electrical Performance Data FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI is a leading manufacturer of connectors.


    Original     		PDF GR-1217-CORE CDC-MEGIGSI-09/06-E 337 BGA footprint tray datasheet bga 10x10 84502 meg array 55740-001LF 74221 84512 84501 84501-201 bga 9x9 Shipping Trays tray datasheet bga 9x9

    IPC-2152

    Abstract: sdrx2 IPC-2221A vsc8244hg TP153 11C6 74alvch32973kr RGMII trace mils SMD CAPACITOR L27 tp107
    Text: Freescale Semiconductor Application Note Document Number: AN3535 Rev. 0, 2/2008 A Strategy for Routing the MPC8544E in a Six-Layer PCB by Michael George NMG Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer


    Original     		PDF AN3535 MPC8544E MPC8544E IPC-2152 sdrx2 IPC-2221A vsc8244hg TP153 11C6 74alvch32973kr RGMII trace mils SMD CAPACITOR L27 tp107

    53389

    Abstract: 16 pin (2x25), 2mm pitch header connectors base transceiver stations equipments JEDEC MO 224 10 pin 2x5, 2mm pitch header connectors MO-224 HDMI CONNECTOR 19 pin through hole 10 pin 2x5, 2.54mm pitch header connectors right angle 68 pin pcb SCSI connector display lcd 2x14
    Text: COMMUNICATIONS, DATA, CONSUMER DIVISION CONNECTOR OVERVIEW FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI is a leading manufacturer of connectors. Our 13,500 employees are committed to providing customers with high-quality, innovative products for


    Original     		PDF CDC-OVERVIEW-05/07-E 53389 16 pin (2x25), 2mm pitch header connectors base transceiver stations equipments JEDEC MO 224 10 pin 2x5, 2mm pitch header connectors MO-224 HDMI CONNECTOR 19 pin through hole 10 pin 2x5, 2.54mm pitch header connectors right angle 68 pin pcb SCSI connector display lcd 2x14

    BlueCore5

    Abstract: BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232
    Text: Features ƒ ƒ ƒ ƒ ƒ ƒ ƒ Single Chip Bluetooth v2.1 + EDR System Fully Qualified Bluetooth v2.1 + EDR system Integrated FM Radio Receiver with RDS Demodulator Stereo Audio Output Stage Full-speed Bluetooth Operation with Full Piconet Support Scatternet Support


    Original     		PDF CS-101570-DSP4 CS-101570-DSP8 BlueCore5 BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232

    Untitled

    Abstract: No abstract text available
    Text: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*


    OCR Scan     		PDF NP276 100MQ 100VDC 100VAC NP276-119 NP276- NP276-1 190BGA^ 27x27