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    2-CQFP PACKAGE Search Results

    2-CQFP PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    2-CQFP PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    RTAX2000S

    Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
    Text: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note


    Original     		208-Pin RTAX250S/SL IO43PB2F2 IO76PB5F5/CLKGP IO02NB0F0 RTAX2000S RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA PDF

    RTAX1000S

    Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
    Text: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5


    Original     		208-Pin RTAX250S IO43PB2F2 IO76PB5F5/CLKGP IO02NB0F0 IO44NB2F2 RTAX1000S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA PDF

    CERAMIC QUAD FLATPACK CQFP

    Abstract: No abstract text available
    Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997


    Original     		160-pins 160-pin 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP PDF

    QL16X24B1PF144C

    Abstract: CF160 PF100 PF144 PL84 QL16X24B-1PF144C cg144
    Text: Appendix E - QL16x24B Pinout Diagrams Appendix E: QL16x24B Pinout Diagrams QL16x24B Packages Summary Total # Pins 84 100 144 144 160 Package Type PLCC TQFP TQFP CPGA CQFP No Connect 2 2 18 VCC and GND 8 12 20 20 20 Clock 2 2 2 2 2 User Pins Input-Only Input/Output


    Original     		QL16x24B QL16X24B1PF144C CF160 PF100 PF144 PL84 QL16X24B-1PF144C cg144 PDF

    QL24X32B-1PQ208C

    Abstract: ql24x32b PF144 PQ208 QL24X32B-1PF144C
    Text: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F


    Original     		QL24x32B PF144) QL24X32B-1PF144C QL24x32B) QL24X32B-1PQ208C PF144 PQ208 QL24X32B-1PF144C PDF

    CF160

    Abstract: PF100 PF144 PL84 QL16X24B-1PF144C
    Text: Appendix E - QL16x24B Pinout Diagrams Appendix E: QL16x24B Pinout Diagrams QL16x24B Packages Summary Total # Pins 84 100 144 144 160 Package Type PLCC TQFP TQFP CPGA CQFP No Connect 2 2 18 VCC and GND 8 12 20 20 20 Clock 2 2 2 2 2 User Pins Input-Only Input/Output


    Original     		QL16x24B CF160 PF100 PF144 PL84 QL16X24B-1PF144C PDF

    QL24X32B-1PF144C

    Abstract: OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C
    Text: Appendix F - QL24x32B Pinout Diagrams Appendix F: QL24x32B Pinout Diagrams QL24x32B Packages Summary Total # Pins 144 208 Package Type TQFP PQFP CQFP No Connect VCC and GND 20 28 28 Clock 2 2 2 User Pins Input-Only Input/Output 6 116 6 172 6 172 Appendix F


    Original     		QL24x32B PF144) QL24X32B-1PF144C QL24x32B) QL24X32B-1PF144C OPTOCOUPLER 817c data sheet 77-I PF144 PQ208 QL24X32B-1PQ208C PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    FBGA-484

    Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
    Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly


    Original     		FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 PDF

    CQFP 240

    Abstract: No abstract text available
    Text: a 240-Lead CQFP Package Mount with Heat Slug Up and Unformed Leads QS-240 Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 61 120 121 60 61 120 60 121 SEAL RING 2؋ 2.594 (65.90) TOP VIEW


    Original     		240-Lead QS-240) CQFP 240 PDF

    CQFP 240

    Abstract: No abstract text available
    Text: a 240-Lead CQFP Package Mount with Heat Slug Down and Unformed Leads QS-240A Dimensions shown in inches and (mm) 0.665 (16.88) 8 ؋ 0.650 (16.50) 0.635 (16.12) 2.953 (75.00) SQ 1.161 (29.50) BSC 120 60 60 SEAL RING 2؋ 2.594 (65.90) 120 61 61 121 121 LID


    Original     		240-Lead QS-240A) CQFP 240 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    Micro-ACE-TE

    Abstract: BU-64860B3
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE-TE FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-down Options • World’s Smallest CQFP MIL-STD-1553


    Original     		BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball MIL-STD1553 1-800-DDC-5757 A5976 F-02/04-0 Micro-ACE-TE BU-64860B3 PDF

    dss-1005 bu6484

    Abstract: dss-1003 bu64863
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553


    Original     		BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball MIL-STD1553 1-800-DDC-5757 A5976 N-10/07-0 dss-1005 bu6484 dss-1003 bu64863 PDF

    BU-64863B

    Abstract: bu64863 BU-64840B3-E02 DSS-3330 mark s07 BU-61860 BU-64863E8
    Text: Make sure the next Card you purchase has. BU-6474X/6484X/6486X MINI-ACE MARK3/MICRO-ACE®*-TE ® FEATURES • Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal • World’s First all 3.3 Volt Terminal • Transceiver Power-Down Options • World’s Smallest CQFP MIL-STD-1553


    Original     		BU-6474X/6484X/6486X MIL-STD-1553 80-pin 324-Ball J-STD-020 BU-64XXXXC/D) BU-64863B bu64863 BU-64840B3-E02 DSS-3330 mark s07 BU-61860 BU-64863E8 PDF

    Untitled

    Abstract: No abstract text available
    Text: SRAM & FLASH Mixed Module Austin Semiconductor, Inc. 128K x 16 SRAM & 512K x 16 FLASH AS8SF384K32 PIN ASSIGNMENT Top View SRAM / FLASH MEMORY ARRAY 68 Lead CQFP (QT) NC A0 A1 A2 A3 A4 A5 FCS\1 GND FCS\2 SWE\1 A6 A7 A8 A9 A10 VCC FEATURES • Operation with single 5V supply


    Original     		AS8SF384K32 AS8SF384K32 AS8SF384K32QT-35/XT AS8SF384K32QT-35/MIL MIL-STD-883 -40oC -55oC PDF

    Untitled

    Abstract: No abstract text available
    Text: ç M/HITE /MICROELECTRONICS a 1Mx32 3.3V FLASH MODULE WF1M32B-XXX3 PRELIMINARY* FEATURES • A cce ss Times of 1 0 0 ,1 2 0 ,150ns ■ Packaging ■ • 66-pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180 inch)


    OCR Scan     		1Mx32 WF1M32B-XXX3 150ns 16KByte, 32KByte, 64kbytes 32B-XG PDF

    mach 1 family amd

    Abstract: MACH110
    Text: Advanced Micro Devices MACH 1 and 2 Device Families High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • High-performance, high-density, electrically-erasable CMOS PLD families ■ ■ 900 to 3600 PLD gates ■ 44 to 84 pins in cost-effective PLCC and CQFP


    OCR Scan     		MACH215 I/O8-I/O15 C16751C-1 MACH215-12/15/20 mach 1 family amd MACH110 PDF

    Untitled

    Abstract: No abstract text available
    Text: WHITE /MICROELECTRONICS WC32P020-XXM 68020 FEATURES • Selection of Processor Speeds: 16.67, 20, 25 MHz ■ M ilita ry Temperature Range: -55 °C to + 1 2 5 °C ■ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Ratpack, CQFP (Q2) ■ High-Performance Asynchronous Bus Is Nonmultiplexed and


    OCR Scan     		WC32P020-XXM 32-Bit PDF

    Untitled

    Abstract: No abstract text available
    Text: AS8F512K32 512K x 32 FLASH AUSTIN SEMICONDUCTOR, INC. FLASH MODULE AVAILABLE AS MILITARY SPECIFICATIONS PIN A SSIG N M EN T Top View 68 Lead CQFP •SMD 5962-94612 •MIL-STD-883 uo^cuco^-Ln|Coz|^|yvDh'CO C^2‘-) Z<E<C<C<C<CC|UU|o|><E<C<C<E<C> FEATURES


    OCR Scan     		AS8F512K32 MIL-STD-883 6/26-D DSO00070 PDF

    Untitled

    Abstract: No abstract text available
    Text: a WS1M32-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM MODULE p r e lim in a r y * FEATURES • A cce ss Tim es o f 17, 20, 25ns ■ 84 lead, 2 8m m CQFP, Package 511 ■ Organized as t w o banks o f 5 1 2Kx32, User C o n fig u ra b le as 2 M x 1 6 or 4 M x 8


    OCR Scan     		WS1M32-XG3X 1Mx32 2Kx32, PDF

    PEAK tray drawing

    Abstract: J300
    Text: RECYCLE CQFP 75X75^ WITH S E M I C Y C L E 30V4.10 j j- 3 .0 0 HHÇYXÇZ. dJOO 330A0IH3S HUM 330A03M SECTI ON 0-0 r-u3 r'~- cY N OY E S : 1. MAYERIA L 2. CHAMFER PACKAGE ALL PP1. DIMENSIONS - O R IE N T A T IO N 4. D "EMPERATURE RATING O P AR T NUMRER- ESD


    OCR Scan     		75X75^ 330A3IH3S 75X75 TCQ75 P-00937 P-00838 P-00716 P-00584 PEAK tray drawing J300 PDF