54112-405201250LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
54122-108201250LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
10127720-125GLF
Amphenol Communications Solutions
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 12 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, GW Compatible LCP, With Pegs, Tray Packing.
10127720-125GRLF
Amphenol Communications Solutions
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 12 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, GW Compatible LCP, With Pegs, Tape and Reel.
54122-109201250LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch