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    207AP Search Results

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    207AP Price and Stock

    Micro Commercial Components FR207-AP

    DIODE GEN PURP 1KV 2A DO15
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    DigiKey FR207-AP Ammo Pack
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    Micro Commercial Components RL207-AP

    DIODE GEN PURP 1KV 2A DO15
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    DigiKey RL207-AP Ammo Pack
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    Mouser Electronics RL207-AP
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    onsemi NCP1207AP

    IC OFFLINE SWITCH FLYBACK 8DIP
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    DigiKey NCP1207AP Tube 50
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    Micro Commercial Components HER207-AP

    DIODE GEN PURP 800V 2A DO15
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    DigiKey HER207-AP Ammo Pack
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    onsemi NCP1207APG

    IC OFFLINE SWITCH FLYBACK 8DIP
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    DigiKey NCP1207APG Tube
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    Newark NCP1207APG Bulk 1
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    RS NCP1207APG Bulk 10
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    Bristol Electronics NCP1207APG 380
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    Rochester Electronics NCP1207APG 379 1
    • 1 $0.4728
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    Win Source Electronics NCP1207APG 30,000
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    Find more 207AP price and stock on Findchips.com

    207AP Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    217-36CTT6

    Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		O-220, OT-223, SOL-20 217-36CTT6 ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5 PDF

    ebonol

    Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		O-220, OT-223, SOL-20 ebonol 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB PDF

    HX8353D

    Abstract: HX8353
    Text: DATA SHEET DOC No. HX8353-D-DS HX8353-D 132RGB x 162 dots, 262K color, with Internal GRAM, TFT Mobile Single Chip Driver Preliminary version 01 Apr, 2010 HX8353-D 132RGB x 162 dot, 262K Color, with Internal GRAM, TFT Mobile Single Chip Driver List of Contents


    Original     		HX8353-D-DS HX8353-D 132RGB HX8353D 300um 250um 227Apr, HX8353 PDF

    ebonol

    Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		O-220, OT-223, SOL-20 ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb PDF

    ebonol

    Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		O-220, OT-223, SOL-20 ebonol 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm PDF

    HX8357-D01

    Abstract: MIPI dbi data rate hx8357
    Text: DATA SHEET DOC No. HX8357-D00/D01-DS HX8357-D00/D01 320RGB x 480 dot, 16M color, with internal GRAM, TFT Mobile Single Chip Driver Temporary Version 00 April, 2012 HX8357-D00/D01 320RGB x 480 dot, 16M color, with internal GRAM, TFT Mobile Single Chip Driver


    Original     		HX8357-D00/D01-DS HX8357-D00/D01 320RGB 253April, HX8357-D0x0 254April, HX8357-D01 MIPI dbi data rate hx8357 PDF

    Wakefield Thermal Solutions TYPE 120

    Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF

    ebonol

    Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF