Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA A B Bottom View 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D SRQPNML K J HGF EDCB A Index mark Orientation pin J I K L F φM E M H G NOTE Each lead centerline is located within φ 0.50 mm (φ 0.020 inch) of its true position (T.P.) at maximum material condition.
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208PIN
X208RF-100A3-1
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Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA SEAM WELD A (Bottom View) 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D S RQ P NM L K J HG F E D C B A Index Mark orientation pin J I K L F φM E M H G NOTE Each lead centerline is located within φ 0.5 mm (φ 0.020 inch) of its true position (T.P.) at maximum material condition.
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208PIN
X208R-100A-1
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HQFP208-P-2828-0
Abstract: HQFP 208 D1561 PAD105
Text: 208P6H-A Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Lead Material Alloy 42 MD e JEDEC Code – Weight g 5.39 157 b2 208 ME HD D 156 1 I2 Symbol HE E Recommended Mount Pad 105 52 53 104 A L1 F b y A1 c A2 e A A1 A2 b c D E e HD
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208P6H-A
208pin
HQFP208-P-2828-0
HQFP 208
D1561
PAD105
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Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA HEAT SINK TYPE A B (Bottom View) 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D S RQP NM L K J HG F E DC B A Orientation pin Index mark J I K F E L H G ITEM A MILLIMETERS INCHES 1.700±0.018 B 43.18±0.45 40.33 C 40.33 1.588 D 43.18±0.45
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208PIN
X208RF-100A5-1
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Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA A Bottom View 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D S RQP NM L K J HG F E DC B A Index mark Orientation pin J I K F E L H G ITEM MILLIMETERS INCHES A 43.18±0.45 1.700±0.018 D 43.18±0.45 1.700±0.018 E 1.27 0.050 F 2.54 (T.P.)
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208PIN
X208RH-100A-1
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SQFP208
Abstract: 28X28
Text: SANYO Semiconductor Shrink Quad Flat Package 208Pin Plastic SQFP208 28X28 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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208Pin
SQFP208
28X28)
ED-7303A)
SQFP208
28X28
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208pin
Abstract: 364PIN
Text: Unit : mm 276±1.0 32±1.0 212±1.0 2.0 53±0.5 223±1.0 159±1.0 53±0.5 44 32±1.0 –A LA-028 44 0.5 15 2.0 LA - 028 - A Conductive plastic Applied Package Quantity pcs 208pin ceramic PGA 20 208pin plastic PGA 20 364pin ceramic PGA 20
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LA-028
208pin
364pin
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QFP208-P-2828-0
Abstract: No abstract text available
Text: 208P6Y-E Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 5.48 Lead Material Cu Alloy MD e JEDEC Code – b2 208 157 1 ME HD D 156 I2 Recommended Mount Pad 52 HE E Symbol 105 53 104 A L1 F b A1 c A2 e x M y L Detail F A A1 A2
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208P6Y-E
208pin
QFP208-P-2828-0
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HQFP208-P-2828-0
Abstract: HQFP 208
Text: 208P6Z-E Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Planning b2 208 ME D 157 1 156 I2 Recommended Mount Pad E HE Symbol 105 52 53 104 F A L1 A1 c A2 e b L y Detail F
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208P6Z-E
208pin
HQFP208-P-2828-0
HQFP 208
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Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA HEAT SINK TYPE A (Bottom View) B 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D SRQPNML K J HGF EDCB A Index mark Orientation pin J I K F E L H G ITEM A MILLIMETERS INCHES 1.700±0.018 B 43.18±0.45 40.33 C 40.33 1.588 D 43.18±0.45 1.700±0.018
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208PIN
X208RF-100A7-1
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Untitled
Abstract: No abstract text available
Text: 208PIN CERAMIC PGA HEAT SINK TYPE A (Bottom View) B 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D SRQPNML K J HGF EDCB A Orientation pin Index mark J I K F E L H G ITEM A MILLIMETERS INCHES 1.700±0.018 B 43.18±0.45 40.39 C 40.39 1.590 D 43.18±0.45 1.700±0.018
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208PIN
X208RF-100A6-1
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SQFP208
Abstract: 28X28 SQFP-208
Text: SANYO Semiconductor Shrink Quad Flat Package 208Pin Plastic SQFP208 28X28 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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208Pin
SQFP208
28X28)
ED-7303A
SQFP208
28X28
SQFP-208
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87a1
Abstract: No abstract text available
Text: Unit : mm 335±1.0 59.5±0.5 24±0.5 216±0.5 22±0.5 A A' 126±0.5 180±1.0 42±0.1 27±0.5 54±0.1 HEAT PROOF 30.6 NEC LA–3A87A-1 30.6 <SECTION A − A'> 27.88 16 6.8 0.4 5.8 8.8 1.5 30.6 2 0.5 Applied Package Quantity PCS 208pin plastic QFP (Fine Pich)(1.4mm thick)
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3A87A-1
208pin
LA-3A87A-1
87a1
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Untitled
Abstract: No abstract text available
Text: 208P6Q-A Plastic 208pin 28✕28mm body LQFP EIAJ Package Code LQFP208-P-2828-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – b2 208 ME Under Planning HD D 157 156 1 I2 Recommended Mount Pad E HE Symbol 105 52 53 104 A L1 F A1 c A2 e b y L Detail F
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208P6Q-A
208pin
LQFP208-P-2828-0
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QFP208-P-2828-0
Abstract: 208P6G-A
Text: 208P6G-A Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 4.61 Lead Material Alloy 42 MD e JEDEC Code – HD 208 ME D b2 157 1 156 I2 52 HE E Recommended Mount Pad Symbol 105 53 104 A L1 F A1 c A2 e b y L Detail F A A1 A2 b
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208P6G-A
208pin
QFP208-P-2828-0
208P6G-A
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QFP208-P-3636-0
Abstract: A2 104
Text: 208P6S-A Plastic 208pin 36✕36mm body QFP EIAJ Package Code QFP208-P-3636-0.65 JEDEC Code – Weight g 8.57 Lead Material Alloy 42 MD e HD D 157 ME 208 1 b2 156 I2 Recommended Mount Pad 52 105 53 A A1 A2 b c D E e HD HE L L1 y HE E Symbol L1 A e y b F A1
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208P6S-A
208pin
QFP208-P-3636-0
A2 104
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RJP 30 h1
Abstract: No abstract text available
Text: TMS320C6713B FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR SPRS294A − OCTOBER 2005 − REVISED NOVEMBER 2005 D Highest-Performance Floating-Point Digital D D D D D D Signal Processor DSP : TMS320C6713B − Eight 32-Bit Instructions/Cycle − 32/64-Bit Data Word
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TMS320C6713B
SPRS294A
32-Bit
32/64-Bit
200-MHz
167-MHz
TMS320C67x
RJP 30 h1
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Untitled
Abstract: No abstract text available
Text: SM320C6711ĆEP, SM320C6711BĆEP, SM320C6711CĆEP, SM320C6711DĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSORS SGUS054A − AUGUST 2004 − REVISED SEPTEMBER 2005 D Controlled Baseline D D D D D D D D L1/L2 Memory Architecture − One Assembly/Test Site, One Fabrication
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SM320C6711EP,
SM320C6711BEP,
SM320C6711CEP,
SM320C6711DEP
SGUS054A
320C67x
C6711,
C6711B,
C6711C,
C6711D)
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vq80
Abstract: A40MX02 one time
Text: Revision 3 40MX and 42MX Automotive FPGA Families Features High Capacity Ease of Integration • Single-Chip Applications ASIC Alternative for Automotive • Up to 100% Resource Utilization and 100% Pin Locking • 3,000 to 54,000 System Gates • Deterministic, User-Controllable Timing
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BCM4501
Abstract: Broadcom BCM4501 BCM7401
Text: BCM4501 DUAL ADVANCED MODULATION SATELLITE RECEIVER SUMMARY OF BENEFITS FEATURES • Dual direct conversion satellite tuners • Highly integrated, cost-effective front-end solution for • Direct conversion architecture in standard CMOS process • Supports QPSK and 8PSK demodulation
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BCM4501
trBCM94501
BCM4501.
4501-PB00-R
BCM4501
Broadcom BCM4501
BCM7401
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s3c46
Abstract: S3C4510B S3C4510 SDLC 8044 Transistor TEO 1279 diagram TCON resistor 270 ohm ARM7 Series 38109 0x303C
Text: S3C4510B 1 PRODUCT OVERVIEW PRODUCT OVERVIEW OVERVIEW Samsung's S3C4510B 16/32-bit RISC microcontroller is a cost-effective, high-performance microcontroller solution for Ethernet-based systems. An integrated Ethernet controller, the S3C4510B, is designed for use in
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S3C4510B
S3C4510B
16/32-bit
S3C4510B,
208-pin
s3c46
S3C4510
SDLC 8044
Transistor TEO 1279
diagram TCON
resistor 270 ohm
ARM7 Series
38109
0x303C
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PDF
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NetSilicon
Abstract: NET 15 P1284
Text: NET+15 Embedded Ethernet/Internet-Ready Processor Features • 32-bit high performance ARM7TDMI RISC processor • Integral 10/100BaseT Ethernet MAC The NetSilicon NET+15 is a high-performance, highly integrated 32-bit microprocessor designed for use !
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32-bit
10/100BaseT
10-channel
1000/M225
NetSilicon
NET 15
P1284
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5 PEN PC TECHNOLOGY apllications
Abstract: No abstract text available
Text: DATA SHEET PM PMC-970113 ISSUE 3 PMC-Sierra, Inc. PM3351 e l a n 1x100 SINGLE PORT FAST ETHERNET SWITCH PM3351 ELAN 1X100 SINGLE PORT FAST ETHERNET SWITCH DATA SHEET ISSUE 3: FEBRUARY 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
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OCR Scan
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PMC-970113
PM3351
1x100
PM3351
5 PEN PC TECHNOLOGY apllications
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PDF
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8251a usart interface from z80
Abstract: UDL TM 500 f922 verilog code for 8254 timer l912 256x32 POWER MODULE TM 31 udl 500 78K3 F5S4
Text: L4E75BS DÜHBÖGb 3ÔÔ B I N E C E CB-C7, 5-VOLT 0.8-M ICRON CELL-BASED CMOS ASIC NEC NEC Electronics Inc. August 1993 Description Figure 1. Integrated HDD Solution with CBC7 Cell-Based ASIC with Embedded 78K3 MPU, Compiled SRAMs and A/D Converters CB-C7 cell-based product family is a 0.8-micron drawn
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L4E75BS
80C42H
D043fl23
8251a usart interface from z80
UDL TM 500
f922
verilog code for 8254 timer
l912
256x32
POWER MODULE TM 31
udl 500
78K3
F5S4
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