Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    23X23 TRAY Search Results

    23X23 TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    23X23 TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nec 575

    Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)


    Original
    PDF BGA23 23ESP 324-pin 352-pin 484-pin 575-pin SSD-A-H7317-4 nec 575 484-pin BGA NEC C 324 C jedec tray BGA tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER

    G770LE

    Abstract: PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide pxa270 PXA270 usb
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 Glossary-14 G770LE PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide PXA270 usb

    pxa270

    Abstract: G770* sumitomo motorola MCX 90 radio PXA270 jtag flash programming PXA270 instruction set blackberry mobile phone circuit diagram blackberry mobile phone G770 motorola g18 gsm datasheet Intel pxa270
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 Glossary-14 G770* sumitomo motorola MCX 90 radio PXA270 jtag flash programming PXA270 instruction set blackberry mobile phone circuit diagram blackberry mobile phone G770 motorola g18 gsm datasheet Intel pxa270

    PXA270 jtag flash programming

    Abstract: PXA270 BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 PXA270 jtag flash programming BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola

    pxa270

    Abstract: PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet n n n n n n n n n n High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family

    Untitled

    Abstract: No abstract text available
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270

    PXA270 instruction set

    Abstract: blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 PXA270 G770L intel 28000 BGA 23X23 0.8 23X23
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 Glossary-14 PXA270 instruction set blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 G770L intel 28000 BGA 23X23 0.8 23X23

    pxa270c

    Abstract: tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance rtpxa270c0c520 356-ball Universal Subscriber Identity Module pxa25
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original
    PDF PXA270 RCPXA270C0C312 RCPXA270C0C416 RCPXA270C0C520 RCPXA270C0C624 RTPXA270C0C312 RTPXA270C0C416 RTPXA270C0C520 RTPXA270C0C624 13x13x1 pxa270c tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance 356-ball Universal Subscriber Identity Module pxa25

    PXA255 MARVELL

    Abstract: Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M pxa270
    Text: Cover Marvell PXA270 Processor Electrical, Mechanical, Thermal Specification Doc. No. MV-S104690-00 , Rev. D April 2009 Marvell. Moving Forward Faster Released PXA270 Processor Electrical, Mechanical, and Thermal Specification Document Conventions Note: Provides related information or information of special importance.


    Original
    PDF PXA270 MV-S104690-00 PXA270 MV-S104690-00 PXA255 MARVELL Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M

    208z

    Abstract: SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27
    Text: Application Report SSZA002 – August 2009 Plastic Ball Grid Array PBGA . SSZA002 – August 2009 Submit Documentation Feedback


    Original
    PDF SSZA002 208z SSZA002 Texas Instruments Philippines PBGA 23X23 0.8 pitch tray 23X23 376ZDW high current pogo pin shape 23x23 tray 27X27

    JESD51-9

    Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
    Text: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of


    Original
    PDF

    VFBGA 120

    Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
    Text: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package


    Original
    PDF

    emmc pcb layout

    Abstract: oled display 96x16 flashpro3 schematic silicon sculptor 3 actel smart fusion fpga JTAG Programmer Schematics microcontroller based temperature control fan avr M1A3PL-DEV-KIT A3PE3000L FG484 96x16
    Text: Product Catalog November 2009 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart from


    Original
    PDF

    emmc pcb layout

    Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
    Text: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart


    Original
    PDF

    ZL70102

    Abstract: zl70101 3Dg12 zl70101 design ZL70321 zl70120 433 mhz rf power amplifier module efficiency B7966 superheterodyne receiver GHz ook deMODULATOR ghz
    Text: Data Sheet, Revision 2 ZL70102 Medical Implantable RF Transceiver MICS RF Telemetry Features • • • • • • • Description 402–405 MHz 10 MICS Channels and 433–434 MHz (2 ISM Channels) High Data Rate (800/400/200 kbit/s raw data rate) High Performance MAC with Automatic Error Handling


    Original
    PDF ZL70102 ZL70102-FullDS/137253-2/5 zl70101 3Dg12 zl70101 design ZL70321 zl70120 433 mhz rf power amplifier module efficiency B7966 superheterodyne receiver GHz ook deMODULATOR ghz

    U2829

    Abstract: hp mini 110 laptop MOTHERBOARD pcb CIRCUIT diagram aspire MOTHERBOARD CIRCUIT diagram acer motherboard bios jumper settings panasonic inverter dv 700 install manual book aspire 5570 MOTHERBOARD CIRCUIT diagram Sanyo HM-28 PCI8412 YNV-W02 940GML
    Text: Aspire 3680/5570/5580 Series Service Guide Service guide files and updates are available on the ACER/CSD web; for more information, please refer to http://csd.acer.com.tw PRINTED IN TAIWAN Revision History Please refer to the table below for the updates made on Aspire 3680/5570/5580 service guide.


    Original
    PDF

    LCMXO2-256 pinout

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.2, April 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 


    Original
    PDF DS1035 DS1035 LCMXO2-256 pinout

    Untitled

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet DS1035 Version 02.2, September 2013 MachXO2 Family Data Sheet Introduction January 2013 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 0A-13.

    LCMXO2-256 pinout

    Abstract: LCMXO2-2000 pinout
    Text: MachXO2 Family Data Sheet DS1035 Version 02.1, June 2013 MachXO2 Family Data Sheet Introduction January 2013 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 MachXO2-4000HE LCMXO2-256 pinout LCMXO2-2000 pinout

    Untitled

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet DS1035 Version 02.0, January 2013 MachXO2 Family Data Sheet Introduction January 2013 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 MachXO2-4000HE

    LCMX02

    Abstract: LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000
    Text: MachXO2 Family Data Sheet Preliminary DS1035 Version 01.5, August 2011 MachXO2 Family Data Sheet Introduction April 2011 Features Preliminary Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O 


    Original
    PDF DS1035 DS1035 MachXO2-2000 MachXO2-1200-R1 LCMX02-2000UHE4FG484I, LCMX02-2000UHE-5FG484I, LCMX02-2000UHE-6FG484I. AN8086, LCMX02 LCMX02 1200 LCMXO2-1200HC-4TG144C LCMXO2-4000HC LCMXO2-1200HC-4MG132C lcmxo2-1200 TQFP-144 footprint LCMXO2-7000HC LCMXO2-640HC-4TG100C LCMX02-2000

    Untitled

    Abstract: No abstract text available
    Text: MachXO2 Family Data Sheet DS1035 Version 02.0, January 2013 MachXO2 Family Data Sheet Introduction January 2013 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 MachXO2-4000HE

    LCMXO2-4000

    Abstract: LCMX02 LCMX02 1200 MACHXO2 7000 pinout file LCMXO2 640HC LCMXO2-4000HC LCMXO2-1200HC-4TG100C LCMXO2-7000HC MachXO2 LCMXO2-1200HC-4MG132C
    Text: MachXO2 Family Data Sheet DS1035 Version 01.9, April 2012 MachXO2 Family Data Sheet Introduction March 2012 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 TN1200. LCMXO2-1200ZE1UWG25ITR50. LCMXO2-1200ZE-1UWG25ITR. LCMXO2-4000 LCMX02 LCMX02 1200 MACHXO2 7000 pinout file LCMXO2 640HC LCMXO2-4000HC LCMXO2-1200HC-4TG100C LCMXO2-7000HC MachXO2 LCMXO2-1200HC-4MG132C

    MACHXO2 7000 pinout

    Abstract: MachXO2-4000
    Text: MachXO2 Family Data Sheet DS1035 Version 02.3, December 2013 MachXO2 Family Data Sheet Introduction January 2013 Features Data Sheet DS1035  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O  interfaces top and bottom sides only


    Original
    PDF DS1035 DS1035 0A-13. MACHXO2 7000 pinout MachXO2-4000