24-Pin Ceramic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C03 EIAJ code :∗DIP024-G-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C03 24-pin ceramic DIP
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Original
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DIP-24C-C03
DIP024-G-0600-3
24-pin
DIP-24C-C03)
D24014SC-2-3
24-Pin Ceramic DIP
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PDF
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dip 24 dimension
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP
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Original
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DIP-24C-A04
DIP024-C-0600-2
24-pin
DIP-24C-A04)
D24013SC-2-3
dip 24 dimension
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C01 EIAJ code : ∗DIP024-G-0600-2 Lead pitch 100mil Row spacing 600mil Sealing method Cerdip 24-pin ceramic DIP DIP-24C-C01 24-pin ceramic DIP (DIP-24C-C01) +1.02 +.040 31.78 –0.33 1.251–.013 R0.64(.025) REF
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Original
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DIP-24C-C01
DIP024-G-0600-2
100mil
600mil
24-pin
DIP-24C-C01)
D24008SC-3-4
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PDF
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DIP-24C-C04
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C04 EIAJ code :∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69
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Original
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DIP-24C-C04
DIP024-G-0300-1
24-pin
DIP-24C-C04)
D24016SC-3-3
DIP-24C-C04
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PDF
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24-Pin Ceramic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A06 EIAJ code : ∗DIP024-C-0600-3 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A06 24-pin ceramic DIP (DIP-24C-A06) 30.48±0.36 (1.200±.014) R0.64(.025) REF 14.99±0.25
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Original
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DIP-24C-A06
DIP024-C-0600-3
100mil
600mil
24-pin
DIP-24C-A06)
D24028SC-2-3
24-Pin Ceramic DIP
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PDF
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DIP024-C-0400-1
Abstract: 24-Pin Ceramic DIP
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A05 EIAJ code : ∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-24C-A05 24-pin ceramic SL-DIP (DIP-24C-A05) 30.48±0.36 (1.200±.014) R1.27(.050)
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Original
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DIP-24C-A05
DIP024-C-0400-1
100mil
400mil
24-pin
DIP-24C-A05)
D24027SC-2-3
DIP024-C-0400-1
24-Pin Ceramic DIP
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C03 EIAJ code : ∗DIP024-G-0600-3 Lead pitch 100mil Row spacing 600mil Sealing method Cerdip 24-pin ceramic DIP DIP-24C-C03 24-pin ceramic DIP (DIP-24C-C03) +1.02 +.040 31.78 –0.33 1.251–.013 R0.64(.025) REF
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Original
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DIP-24C-C03
DIP024-G-0600-3
100mil
600mil
24-pin
DIP-24C-C03)
D24014SC-2-3
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PDF
|
Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP (DIP-24C-A04) 30.48 ± 0.36
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Original
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DIP-24C-A04
DIP024-C-0600-2
24-pin
DIP-24C-A04)
D24013SC-2-3
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PDF
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SHEET24
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP
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Original
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DIP-24C-A07
DIP024-C-0600-4
24-pin
DIP-24C-A07)
D24021SC-1-3
SHEET24
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PDF
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24-Pin Ceramic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C01 EIAJ code :∗DIP024-G-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C01 24-pin ceramic DIP
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Original
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DIP-24C-C01
DIP024-G-0600-2
24-pin
DIP-24C-C01)
D24008SC-3-4
24-Pin Ceramic DIP
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A07 EIAJ code : ∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP (DIP-24C-A07) 30.48±0.36 (1.200±.014) R1.27(.050) REF +0.25
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Original
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DIP-24C-A07
DIP024-C-0600-4
100mil
600mil
24-pin
DIP-24C-A07)
D24021SC-1-3
24021SC-1-3
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PDF
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a06 transistor
Abstract: dip 24 dimension fujitsu
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A06 EIAJ code :∗DIP024-C-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A06 24-pin ceramic DIP
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Original
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DIP-24C-A06
DIP024-C-0600-3
24-pin
DIP-24C-A06)
D24028SC-2-3
contents64(
a06 transistor
dip 24 dimension
fujitsu
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PDF
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C05 EIAJ code : ∗DIP024-G-0400-1 24-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C05 24-pin ceramic SL-DIP (DIP-24C-C05) +0.69 30.30 –0.33 +.027 1.193 –.013 R0.64(.025)
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Original
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DIP-24C-C05
DIP024-G-0400-1
100mil
400mil
24-pin
DIP-24C-C05)
D24020SC-3-3
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PDF
|
Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A06 EIAJ code :∗DIP024-C-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A06 24-pin ceramic DIP (DIP-24C-A06) 30.48±0.36 (1.200±.014)
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Original
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DIP-24C-A06
DIP024-C-0600-3
24-pin
DIP-24C-A06)
D24028SC-2-3
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PDF
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|
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DIP024-C-0400-1
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C05 EIAJ code :∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C05 24-pin ceramic SL-DIP
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Original
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DIP-24C-C05
DIP024-C-0400-1
24-pin
DIP-24C-C05)
D24020SC-3-3
DIP024-C-0400-1
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PDF
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DIP024-C-0400-1
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A05 EIAJ code :∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Metal seal DIP-24C-A05 24-pin ceramic SL-DIP (DIP24C-A05) 30.48±0.36
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Original
|
DIP-24C-A05
DIP024-C-0400-1
24-pin
DIP-24C-A05)
DIP24C-A05)
D24027SC-2-3
DIP024-C-0400-1
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP (DIP-24C-A07) 30.48±0.36 (1.200±.014)
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Original
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DIP-24C-A07
DIP024-C-0600-4
24-pin
DIP-24C-A07)
D24021SC-1-3
|
PDF
|
DIP-24C-C04
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C04 EIAJ code :∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP
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Original
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DIP-24C-C04
DIP024-G-0300-1
24-pin
DIP-24C-C04)
D24016SC-3-
D24016SC-3-3
DIP-24C-C04
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PDF
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24-Pin Ceramic DIP
Abstract: DIP-24C-C04
Text: SKINNY DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C04 EIAJ code : ∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69 .027 30.30 +– 0.33 (1.193 +– .013
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Original
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DIP-24C-C04
DIP024-G-0300-1
100mil
400mil
24-pin
DIP-24C-C04)
D24016SC-3-3
30024C-C04
24-Pin Ceramic DIP
DIP-24C-C04
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PDF
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DIP-24C-C03
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C03 EIAJ code :∗DIP024-G-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C03 24-pin ceramic DIP (DIP-24C-C03) +1.02 +.040 31.78 –0.33 1.251 –.013
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Original
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DIP-24C-C03
DIP024-G-0600-3
24-pin
DIP-24C-C03)
D24014SC-2-3
DIP-24C-C03
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PDF
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DIP024-C-0400-1
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C05 EIAJ code :∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C05 24-pin ceramic SL-DIP (DIP-24C-C05) +0.69 30.30 –0.33
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Original
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DIP-24C-C05
DIP024-C-0400-1
24-pin
DIP-24C-C05)
D24020SC-3-3
DIP024-C-0400-1
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A04 EIAJ code : ∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP (DIP-24C-A04) 30.48 ± 0.36 (1.200 ± .014) R1.27 (.050) REF 14.94 ± 0.25
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Original
|
DIP-24C-A04
DIP024-C-0600-2
100mil
600mil
24-pin
DIP-24C-A04)
D24013SC-2-3
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PDF
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cerdip
Abstract: 28 pin ceramic dip
Text: UNIT : mm 8.6 15.5 18.3 11.2 22.4 SC-600-1P Length : 495±2.0 Thickness : 0.7+0.3 −2.0 Tolerance : ±0.4 Material : Plastic With Antistatic Finish Applied Package Quantity(pcs) 24 pin Plastic DIP MAX. 14 24 pin Ceramic DIP (Cerdip) MAX. 15 24 pin Ceramic DIP (Seam Weld)
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Original
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SC-600-1P
cerdip
28 pin ceramic dip
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PDF
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28-PIN
Abstract: No abstract text available
Text: Section 3 Application Specific Bipolar E C L R A M s — A t a Glance Capacity Package Options 6 1024 bits 256w x 4b 24-pin Ceramic DIP, FPT 24-pad Ceramic LCC MBM100423LL-6 6 1024 bits (256w x 4b) 24-pin Ceramic DIP, FPT 24-pad Ceramic LCC 3-27 MBM10476LL-9
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OCR Scan
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MBM10423LL-6
MBM100423LL-6
MBM10476LL-9
BM10476RR-9
MBM10476RL-9
MBM100476LL-9
M8M100476RR-9
MBM100476RL-9
MBW10486LL-13
MBM10486RR-13
28-PIN
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PDF
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