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    256 PIN CERAMIC QUAD FLAT PACKAGE Search Results

    256 PIN CERAMIC QUAD FLAT PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    256 PIN CERAMIC QUAD FLAT PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nitride

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03 256-pin ceramic QFP (FPT-256C-C03)


    Original     		PDF FPT-256C-C03 256-pin FPT-256C-C03) F256014SC-2-3 nitride

    256 pin ceramic Quad flat package

    Abstract: Aluminum nitride QFP
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic


    Original     		PDF FPT-256C-C02 256-pin FPT-256C-C02) F256012SC-3-3 256 pin ceramic Quad flat package Aluminum nitride QFP

    256 pin ceramic Quad flat package

    Abstract: FPT-256C-C03
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic


    Original     		PDF FPT-256C-C03 256-pin FPT-256C-C03) F256014SC-2-3 256 pin ceramic Quad flat package FPT-256C-C03

    FPT-256C-C03

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03


    Original     		PDF FPT-256C-C03 256-pin FPT-256C-C03) F256014SC-2-3 FPT-256C-C03

    FPT-256C-C02

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02


    Original     		PDF FPT-256C-C02 256-pin FPT-256C-C02) F256012SC-3-3 FPT-256C-C02

    296-0025

    Abstract: Aluminum nitride QFP
    Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02 256-pin ceramic QFP (FPT-256C-C02)


    Original     		PDF FPT-256C-C02 256-pin FPT-256C-C02) F256012SC-3-3 296-0025 Aluminum nitride QFP

    Untitled

    Abstract: No abstract text available
    Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP


    Original     		PDF FPT-256C-C01 256-pin FPT-256C-C01) F256003SC-5-3

    Untitled

    Abstract: No abstract text available
    Text: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP (FPT-256C-C01) 3.80 (.150) MAX


    Original     		PDF FPT-256C-C01 256-pin FPT-256C-C01) F256003SC-5-3

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07)


    Original     		PDF FPT-256C-A07 256-pin FPT-256C-A07) F256013SC-1-3

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012)


    Original     		PDF FPT-256C-A07 256-pin FPT-256C-A07) F256013SC-1-3

    C1995

    Abstract: 256 pin ceramic Quad flat package 256-PIN
    Text: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012) 2.10(.083) 36.00±0.30 SQ


    Original     		PDF FPT-256C-A07 256-pin FPT-256C-A07) F256013SC-1-3 C1995 256 pin ceramic Quad flat package

    Untitled

    Abstract: No abstract text available
    Text: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic


    Original     		PDF FPT-256C-C01 256-pin FPT-256C-C01) F256003SC-5-3

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    mitsubishi 32 pin SOP

    Abstract: hssop
    Text: Single Inline Package Heat sink Single Inline Package Zig-zag Inline Package Dual Inline Package Shrink Dual Inline Package SIP HSIP ZIP DIP SDIP PACKAGE – 2.54 1.778 2.54 1.27 750 600 500 400 300 600 400 300 400 325 – – 2.54 1.778 WIDTH mil LEAD PITCH


    Original     		PDF

    CQ208

    Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
    Text: HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP. The TQFP package has a nominal thickness of only


    Original     		PDF PF144 CF160 PQ208 CQ208 PB256 CQ208 CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    BGA and QFP Package mounting

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
    Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,


    Original     		PDF

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545