Untitled
Abstract: No abstract text available
Text: LIGHT BAR 27X27 9 LED DATA SHEET 27 Face Length MM 27.0 Face Width MM 27.0 Height MM 11.0 Pin Spacing MM 5.1 Row Spacing MM No.of pins Pins KLLB 274X 27.0 1 2 2 1 27.0 2 2.0 Seg. Vf @10mA Volts KLLB 274X KLLB274X 11.0 (5.1) Tolerance ± 0.2 mm Note : All Dimensions are in mm
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27X27
KLLB274X
KLLB274
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PBGA-316
Abstract: PRBG0316DB-A 316F
Text: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DB-A D Previous Code 316F7A MASS[Typ.] 2.6g A ZD A B D1 φb φx M S AB e y S Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 1011121314151617181920 S Index mark Reference Symbol
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P-BGA316-27x27-1
PRBG0316DB-A
316F7A
PBGA-316
PRBG0316DB-A
316F
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Untitled
Abstract: No abstract text available
Text: Label sheet, DIN A4 - BMKL 27X27 SR - 0803692 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid
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com/us/products/0803692
27X27
EC000761
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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27x27
40x40
CB1014
FHP27-27-20
/T410
/T411
/T412
FHP27-27-20/T710/T
RevB1014
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Untitled
Abstract: No abstract text available
Text: 256 PIN PLASTIC BGA 27x27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of
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27x27)
Y256S1-B6
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PRBG0449FA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA449-27x27-1.00 RENESAS Code PRBG0449FA-A D Previous Code 449F7T MASS[Typ.] 3.0 A D1 b B A S AB ZD e ZE AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S 1 2 3 4 5 6 7 8 9 10111213141516171819202122232425 S Index mark
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P-BGA449-27x27-1
PRBG0449FA-A
449F7T
PRBG0449FA-A
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P-BGA256-27x27-1
Abstract: PRBG0256DA-A
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA256-27x27-1
PRBG0256DA-A
256F7X-A
PRBG0256DA-A
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PRBG0316DA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DA-A D Previous Code 316F7X-A A MASS[Typ.] 2.6g A B D1 ZD b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA316-27x27-1
PRBG0316DA-A
316F7X-A
PRBG0316DA-A
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PRBG0256DD-A
Abstract: 2.5G P-BGA-256-2
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA256-27x27-1
PRBG0256DD-A
256F7X-F
PRBG0256DD-A
2.5G
P-BGA-256-2
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PRBG0425FB-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA425-27x27-1.00 RENESAS Code PRBG0425FB-A D Previous Code 425F7T MASS[Typ.] 2.3g A D1 φb B A φx M S AB ZD e y S AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 10111213141516171819202122232425
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P-BGA425-27x27-1
PRBG0425FB-A
425F7T
PRBG0425FB-A
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BP-256
Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5
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P-BGA256-27x27-1
PRBG0256DE-A
BP-256
BP-256
PRBG0256DE-A
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Untitled
Abstract: No abstract text available
Text: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S y A1 e S φb φ x1 M S A B φ x2 M S S DIMENSIONS 27.00±0.20 D1 24.00
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256-PIN
27x27)
P256F1-127-MN7-1
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27x27
Abstract: 225-PIN
Text: 225-PIN PLASTIC BGA 27x27 A S B C Index mark 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E D C B A P J R I H K L φM S F E S G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.
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225-PIN
27x27)
S225S1-150-B1-2
27x27
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Untitled
Abstract: No abstract text available
Text: 256 PIN TAPE BGA HEAT SPREADER TYPE (27x27) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M detail of A part E S A B *1 S *2 detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.
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27x27)
25MIN.
S256N7-B6
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GT-64120A
Abstract: IEEE754 RM7000 RM7065A mips uart
Text: RM7065A • PACKAGING • Fully Static 0.18µ CMOS design with dynamic power down logic • 256 pin TBGA package, 27x27 mm DEVELOPMENT TOOLS • Operating Systems: • Linux by MontaVista and Red Hat • VxWorks by Wind River Systems • Nucleus by Accelerated Technology
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RM7065A
27x27
interrupts-10
32bit
RM7065A
GT-64120A
IEEE754
RM7000
mips uart
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d 1047
Abstract: No abstract text available
Text: 256 PIN TAPE BGA 27x27 A U B A B W A1 A2 V D X C Y Index mark J A S H B G F L E M M S A B *1 P M S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.
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27x27)
P256N2-B6
d 1047
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Untitled
Abstract: No abstract text available
Text: Extract from the online catalog BMKL 27X27 SR Order No.: 0803692 The figure shows a version of the article Label sheet for laser printer, sheet format: DIN A4, 1 sheet = 54 labels,
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27X27
CL-2009)
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Untitled
Abstract: No abstract text available
Text: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S S y A1 e S φb φ x1 M S A B φ x2 M S DIMENSIONS 27.00±0.20 D1 24.00
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256-PIN
27x27)
P256F1-127-MN7
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Untitled
Abstract: No abstract text available
Text: 544-PIN PLASTIC BGA 27x27 D w S A D1 ZD ZE A 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 B E1 E w S B INDEX MARK (UNIT:mm) A y1 ITEM D A2 S S y A1 e S φb φx M S AB AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B D1 E
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544-PIN
27x27)
P544F1-100-MNA
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PBGA225
Abstract: PRBG0225CB-A
Text: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CB-A D Previous Code 225F7X-B MASS[Typ.] 2.0g A D1 b S AB B A ZD e e A1 R P N M L K H G F E D C ZE E E1 J B A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x y
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P-BGA225-27x27-1
PRBG0225CB-A
225F7X-B
PBGA225
PRBG0225CB-A
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Untitled
Abstract: No abstract text available
Text: Snap-in markers - UC-EMP 27X27 - 0825451 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid
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com/us/produkte/0825451
27X27)
the0208
EC000761
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RM7065C
Abstract: IEEE754 RM7065A
Text: RM7065C PACKAGING • • Fully Static 0.13µ CMOS design with dynamic power down logic 256 pin TBGA package, 27x27mm on Ex pe rt on Th ur sd ay ,0 8A ug us t, • Dual issue symmetric superscalar microprocessor with instruction prefetch optimized for system level
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RM7065CTM
27x27mm
32-bit
RM7065C
IEEE754
RM7065A
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CG717
Abstract: No abstract text available
Text: R Ceramic Column Grid Array CG717 Package PK086 (v1.0) January 18, 2006 27X27-COLUMN CERAMIC CGA, 1.27MM PITCH (CG717) 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
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CG717)
PK086
27X27-COLUMN
CG717
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27X27
Abstract: BGA 27X27
Text: 225-PIN PLASTIC BGA 27x27 A S B C Index mark 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E D C B A P J I R H K L φM S F S E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.
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225-PIN
27x27)
P225S1-150-B1-2
27X27
BGA 27X27
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