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    27N INDUCTOR Search Results

    27N INDUCTOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DFE2016CKA-1R0M=P2 Murata Manufacturing Co Ltd Fixed IND 1uH 1800mA NONAUTO Visit Murata Manufacturing Co Ltd
    LQW18CN55NJ0HD Murata Manufacturing Co Ltd Fixed IND 55nH 1500mA POWRTRN Visit Murata Manufacturing Co Ltd
    LQW18CNR56J0HD Murata Manufacturing Co Ltd Fixed IND 560nH 450mA POWRTRN Visit Murata Manufacturing Co Ltd
    DFE322520F-2R2M=P2 Murata Manufacturing Co Ltd Fixed IND 2.2uH 4400mA NONAUTO Visit Murata Manufacturing Co Ltd
    LQW18CN4N9D0HD Murata Manufacturing Co Ltd Fixed IND 4.9nH 2600mA POWRTRN Visit Murata Manufacturing Co Ltd

    27N INDUCTOR Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    K1518

    Abstract: K1113 33-4550
    Text: Viking MULTILAYER CHIP INDUCTOR-CL Features -High frequency -High Q -High IDC -Cost effective Applications -High frequency circuits for portable telephones, PHS, Wireless communication, etc. Part Numbering CL 03 J T 27N 1 2 3 4 5  Inductance Tolerance


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    PDF 100cycles 24hrs 1000hrs K1518 K1113 33-4550

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    Abstract: No abstract text available
    Text: AIR CORE INDUCTORS 空芯チップインダクタ(高Q/電流タイプ) Air-Core Chip Inductors High Q/High Current type •構造図 Construction 0402 W W L ② ● ● ● ● ● ● ● ● ● 移動体通信機器等の端末及び基地局の高周波回路及


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    PDF KQC0402Tã

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    Abstract: No abstract text available
    Text: AIR CORE INDUCTORS 空芯チップインダクタ(高Q/電流タイプ) Air-Core Chip Inductors High Q/High Current type •構造図 Construction 0402 W W L ② ● ● ● ● ● ● ● ● ● 移動体通信機器等の端末及び基地局の高周波回路及


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    PDF KQC0402Tã

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    Abstract: No abstract text available
    Text: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    R22-R27

    Abstract: No abstract text available
    Text: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    1N5 diode

    Abstract: EIA 01005 diode marking 47n marking code diode R12 L-07C10NJV6T marking L03
    Text: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    Untitled

    Abstract: No abstract text available
    Text: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    Untitled

    Abstract: No abstract text available
    Text: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    L-07C

    Abstract: marking 1N3 1N5 diode L07C 2n2 j 100 L-07C10NJV6T
    Text: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    2n2 j 100

    Abstract: nh33 marking 68N KL73
    Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking


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    PDF tech50 2n2 j 100 nh33 marking 68N KL73

    L-07C

    Abstract: marking code 33n 3n3 100
    Text: RF ceRaMic chiP inDUcToRs High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance . These RF chip inductors are compact in size and feature lead-free tin


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    MARKING H9

    Abstract: No abstract text available
    Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking


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    PDF D-25578 MARKING H9

    KQC0603TTE12NJ

    Abstract: 27n INDUCTOR
    Text: KQC high current inductor NEW features • • • • Low DC resistance and high allowable DC current Low profile style 0.027 inches 0.7mm typical Suitable for reflow soldering Marking: Black body color with no marking dimensions and construction L W inductors


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    PDF 1000h, KQC0603TTE12NJ 27n INDUCTOR

    L-07C68N

    Abstract: LQG10A1N2S00
    Text: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0402 - 0805 and


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    PDF MLI00-revB. L-07C68N LQG10A1N2S00

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    Abstract: No abstract text available
    Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking


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    PDF E4991A HP4291B D-25578

    2n2 j 100

    Abstract: No abstract text available
    Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking


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    PDF E4991A HP4291B D-25578 2n2 j 100

    Cl201210-1N5D

    Abstract: L-07C27N L-14C68N L-07CR10 L-07C4N7 CL1005 L-07C68N cl100505 L-14CR12 cl2012
    Text: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0201 - 0805 and


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    PDF MLI01 Cl201210-1N5D L-07C27N L-14C68N L-07CR10 L-07C4N7 CL1005 L-07C68N cl100505 L-14CR12 cl2012

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    Abstract: No abstract text available
    Text: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin


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    PDF 10lectrodes

    Untitled

    Abstract: No abstract text available
    Text: KQC high current inductor NEW features • • • • Low DC resistance and high allowable DC current Low profile style 0.027 inches 0.7mm typical Suitable for reflow soldering Marking: Black body color with no marking dimensions and construction L W inductors


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    PDF 1000h,

    07C12

    Abstract: CL1005 CL100505 L-14CR10 L-07C3N9 L-07C4N7 L-15C33N L-14CR22 SRF10-10
    Text: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0402 - 0805 and


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    PDF TEMP00 MLI00-revB. 07C12 CL1005 CL100505 L-14CR10 L-07C3N9 L-07C4N7 L-15C33N L-14CR22 SRF10-10

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    Abstract: No abstract text available
    Text: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking


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    PDF E4991A HP4291B D-25578

    marking TB

    Abstract: 8 tb 08 Marking code H6 TE 56 -ATC
    Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE


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    PDF E4991A HP4291B D-25578 marking TB 8 tb 08 Marking code H6 TE 56 -ATC

    Untitled

    Abstract: No abstract text available
    Text: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE


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    PDF HP4291B D-25578

    Untitled

    Abstract: No abstract text available
    Text: HIGH FREQUENCY CHIP INDUCTORS New miniature 0603 and 0805 size inductor chips feature monolithic ceramic construction allowing low cost manufacturing methods. The high-Q ceramic material exhibits self resonant frequencies up to 17 GHz. APPLICATIONS • CELL/PCS RF Modules


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