CERAMIC FLATPACK 20pin
Abstract: No abstract text available
Text: MECHANICAL DRAWINGS Ceramic DIP Ordering Code: C C1 24-pin, 0.3" wide C2 20-pin, 0.3" wide C3 22-pin, 0.3" wide C4 24-pin, 0.6" wide C5 28-pin, 0.3" wide C6 28-pin, 0.6" wide C7 16-pin, 0.3" wide C8 18-pin, 0.3" wide C9 32-pin, 0.6" wide C10 28-pin, 0.4" wide
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24-pin,
20-pin,
22-pin,
28-pin,
16-pin,
18-pin,
32-pin,
CERAMIC FLATPACK 20pin
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Enplas socket ots-28
Abstract: No abstract text available
Text: PA-SXA-28SS Data Sheet 28 pin SSOP socket/28 pin DIP 0.3” of 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Ubicom SX28AC/SS in a 28 pin SSOP package can be programmed on programmers capable of programming the 28 pin DIP version of the part.
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PA-SXA-28SS
socket/28
SX28AC/SS
SX28AC/SS
SX28AC/DP
SXA-28SS
Enplas socket ots-28
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footprint plcc 208
Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC
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SXT6051
SXT6251
SXT6282
144-Pin
LXT300Z/301Z
28-Pin
LXT304A
footprint plcc 208
PLASTIC QUAD FLAT PACK 160 PINS DIMENSION
LXT304A
LXT305A
LXT307
LXT310
LXT317
LXT318
LXT325
A 3120 8 Pins ICs
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Size #23 Copper Alloy Crimp Contacts
Abstract: chromel 809-065C
Text: Series 79 Contacts and Tools Size #23 Copper Alloy Crimp Contacts Size #23 Copper Alloy Crimp Contacts B #23 Pin Contact Contact Type Wire Size Material ØA Pin Pin Pin #22 – #28 #26 – #30 #22 – #28 BeCu BeCu Alumel Pin #22 – #28 Chromel Socket #22 – #28
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09-065A
809-065C
09-066A
809-066C
Size #23 Copper Alloy Crimp Contacts
chromel
809-065C
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC FPT-28C-C03 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013
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FPT-28C-C03
28-pin
FPT-28C-C03)
F28014SC-3-2
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c03 diode
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-C03 Lead pitch 50mil Lead shape Straight Sealing method Cerdip 28-pin ceramic SOP FPT-28C-C03 28-pin ceramic SOP (FPT-28C-C03) 9.53±0.64 (.375±.025) +0.33 9.83 –0.30 +.013 .387 –.012 INDEX AREA 27.94(1.100)
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FPT-28C-C03
50mil
28-pin
FPT-28C-C03)
F28014SC-3-2
c03 diode
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28-pin
Abstract: FPT-28P-M17
Text: SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M17 Lead pitch 50mil Nominal dimensions 450mil Lead shape Gullwing Sealing method Plastic mold 28-pin plastic SOP FPT-28P-M17 28-pin plastic SOP (FPT-28P-M17) +0.25 17.75 –0.20 +.010 .699 –.008 28
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FPT-28P-M17
50mil
450mil
28-pin
FPT-28P-M17)
FPT-28P-M17
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Untitled
Abstract: No abstract text available
Text: PA28SO1-15B-3 6 Data Sheet 28 pin SO socket/28 pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, 28 pin SO packages with a body width of 8.6mm - 9.1mm and lead pitch 1.27mm can be programmed on DIP programmers.
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PA28SO1-15B-3
socket/28
FP-28-1
27-15B
28SD-15B
28SO-2815
PA28SO1-15B-3
PA28SO1-15B-6
28SD-15
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Untitled
Abstract: No abstract text available
Text: FLAT PACKAGE 28 PIN CERAMIC FPT-28C-A08 28-pin ceramic FPT Lead pitch 12.857° Sealing method Metal seal FPT-28C-A08 28-pin ceramic FPT (FPT-28C-A08) 1.85±0.40 (.073±.016) 0.97(.038)TYP. 2.69±0.30 (.106±.012) 0.70±0.06 (.0276±.0024) 0.30±0.06 (.012±.0024)
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FPT-28C-A08
28-pin
FPT-28C-A08)
F28026SC-1-2
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28 pin ceramic dip
Abstract: DIP28C-C02
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38
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DIP-28C-C02
DIP028-G-0600-1
28-pin
DIP-28C-C02)
D28010SC-3-3
28 pin ceramic dip
DIP28C-C02
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28 pin ceramic dip
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)
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DIP-28C-C02
DIP028-G-0600-1
100mil
600mil
28-pin
DIP-28C-C02)
28 pin ceramic dip
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SOD2815B-2
Abstract: No abstract text available
Text: PA-SOD-2815B-28/2 Data Sheet 28 pin SO socket/28 pin SO receptacle Supported Device/Footprints Adapter Construction Using this adapter, 28 pin SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.
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PA-SOD-2815B-28/2
socket/28
FP-28-1
27-15B
PA-SOD-2815B-28/2
OD2815B-2
SOD2815B-2
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MAX7300
Abstract: MAX7301 MAX7301AAI MAX7301AAX MAX7301AGL MAX7301ANI display 70 pin configuration 1136L 25p28
Text: 19-2438; Rev 2; 2/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP
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20-Port
28-Port
MAX7301AAX
MAX7301AGL
36-pin
40-pin
MAX7301AAI
MAX7301ANI
28-pin
MAX7300
MAX7301
display 70 pin configuration
1136L
25p28
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MAX7301
Abstract: MAX7301AAX 28-Port MAX6957 MAX7300 MAX7301AAI MAX7301AGL MAX7301ANI Port Expander 32 bit max7301 8 bit control
Text: 19-2438; Rev 3; 10/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP
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20-Port
28-Port
MAX7301AAX
MAX7301AGL
36-pin
40-pin
MAX7301AAI
MAX7301ANI
28-pin
MAX7301
MAX6957
MAX7300
Port Expander 32 bit
max7301 8 bit control
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P23-20
Abstract: No abstract text available
Text: 19-2438; Rev 3; 7/03 4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and 28-Port I/O Expander The MAX7301AAX and MAX7301AGL have 28 ports and are available in 36-pin SSOP and 40-pin QFN packages, respectively. The MAX7301AAI and MAX7301ANI have 20 ports and are available in 28-pin SSOP and 28-pin DIP
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20-Port
28-Port
MAX7301
MAX7301AAX
MAX7301AGL
and23
P23-20
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518256
Abstract: V62C518256 Mosel Vitelic sram 32k
Text: PRELIMINARY V62C518256 32K X 8 STATIC RAM MOSEL VITELIC • Packages – 28-pin TSOP Standard – 28-pin 600 mil PDIP – 28-pin 330 mil SOP (450 mil pin-to-pin) Features ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 5mA (max.) ■ Low Power Dissipation:
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V62C518256
28-pin
V62C518256
144-bit
518256
Mosel Vitelic sram 32k
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zilog Smart usb cable schematic
Abstract: SSR schematics
Text: Reference Design Mini-Z WLAN 28-Pin Module RD000502-1011 Overview The Mini-Z WLAN 28-Pin Module is a stand-alone 802.11 b/g TCP/IP Wireless Networking module that is produced in a 28-pin Dual Inline Pin package. The Mini-Z WLAN 28-Pin Module integrates Zilog’s powerful ZNEO microcontroller with a Roving Networks 2.4 GHz RN171 802.11 b/g WiFly LAN Module.
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28-Pin
RD000502-1011
RN171
zilog Smart usb cable schematic
SSR schematics
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ZA104
Abstract: zu107 p028
Text: SONY CXK58257CTM/CYM/CM/CP -70LLX 32768-word x 8-bit High Speed CMOS Static RAM Description CXK58257CTM CXK58257CYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) CXK58257CM CXK58257CP 28 pin SOP (Plastic) 28 pin DIP (Plastic) The CXK58257CTM/CYM/CM/CP is 262,144 bits
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CXK58257CTM/CYM/CM/CP
-70LLX
32768-word
CXK58257CTM/CYM
TSOP-28P-L01R
CXK58257CTM/CYM/CM/CP
ZA104
zu107
p028
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Untitled
Abstract: No abstract text available
Text: IMP23L128 IMP23L256 IMP23L512 VERY LOW POWER 23000 Series ROMS IMP23L100 IMP23L101 IMP23L208 LOW POWER/HIGH PERFORMANCE CMOS ROMS Features Six JEDEC Standard Versions: IMP23L128 IMP23L256 IMP23L512 IMP23L100 IMP23L101 IMP23L208 28 28 28 28 32 32 Pin Pin Pin
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OCR Scan
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IMP23L128
IMP23L256
IMP23L512
IMP23L100
IMP23L101
IMP23L208
IMP23L512
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Untitled
Abstract: No abstract text available
Text: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ
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OCR Scan
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PDF
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28-Pin
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Untitled
Abstract: No abstract text available
Text: M O SEL VITELIC PRELIM INARY V62C318256 2 .7 VOL T 3 2 K X 8 STA TIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin TSOP (Reverse) - 28-pin 600 mil PDIP - 28-pin 300 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns ■ Ultra low DC operating current of 3mA (max.)
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OCR Scan
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PDF
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V62C318256
28-pin
V62C318256
144-bit
b3S3311
0D047S4
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Untitled
Abstract: No abstract text available
Text: HV18 inc. 8-Channel High Voltage Analog Switch Ordering Information_ Package Options Vpp Vnn +70V +80V VsiG 28-pin Ceramic Side-brazed DIP* Die 36-pin Leaded Ceramic Chip Carrier* 28-pin Plastic DIP 28-lead Plastic Chip Carrier
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OCR Scan
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PDF
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28-pin
HV1814C
HV1816C
HV1814X
HV1816X
36-pin
HV1814CS
HV1816CS
HV1814P
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY LH5164A/AH • 8,192 x 8 bit organization • Access times: 80/100 ns MAX. PIN CONNECTIONS 28-PIN DIP 28-PIN SK-DIP 28-PIN SOP • Low-power consumption: Operating: 303 mW (MAX.) LH5164A/D/N @ 80 ns 248 mW (MAX.) LH5164A/D/N/T @ 100 ns _
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LH5164A/AH
LH5164A/D/N
LH5164A/D/N/T
28-PIN
164A-1;
LH5164AH/HD/HN/HT
LH5164A/D/N/T:
LH5164AH/HD/HN/HT:
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V62C518256
Abstract: No abstract text available
Text: MOSEL V I T E L I C PRELIMINARY V62C518256 3 2 K X 8 STATIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin 600 mil PDIP - 28-pin 330 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 70 ns ■ Ultra low DC operating current of 5mA (max.) ■ Low Power Dissipation:
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OCR Scan
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PDF
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V62C518256
28-pin
144-bit
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