mate-n-lok

Abstract: mate-n-lok amp tyco X-172161-Y
Contextual Info: 107-68193 Packaging Specification 29Jul09 Rev C MINI UNIVERSAL MATE-N-LOK HSG 1. PURPOSE 目的 Define the packaging specification and packaging method of MINI UNIVERSAL MATE-N-LOK HSG. 订定 MINI UNIVERSAL MATE-N-LOK HSG 产品之包装规格及包装方式。

418x

Contextual Info: 107-68101 Packaging Specification 29Jul09 Rev M SLOT SINGLE CARD BUS 1. PURPOSE 目的 Define the packaging specifiction and packaging method of SLOT SINGLE CARD BUS Products. 订定 SLOT SINGLE CARD BUS 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

PLC service manual

Abstract: 654-632 TERMI POINT 654632-1 654633-1 17APR09
Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FDR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LIHC R EV ISIO N S DIST ALL INTERNATIONAL RIGHTS RESERVED. p LTR c DESCRIPTION DATE ECR—09—016824 29JUL09 DWN APVD LS ML 144 Mandrel: Customer manual:

E13288

Abstract: LR7189
Contextual Info: 4 TH IS DRAWING IS U N P U B LIS H E D . COPYRIGHT 2 RELEASED FOR PUBLICATION BY ^ C O ELECTRONICS CORPORATION. REVISIO N S ALL INTERNATIONAL RIGHTS RESERVED. G LTR D ESC R IPTIO N REV PER ECR 0 9 - 0 1 5 2 4 3 DATE DWN 29JUL09 JR APVD D D AMP / j " \ E13288

Contextual Info: 107-68572 Packaging Specification 29Jul09 Rev C MINI POWER DRAWER CONT. 1. PURPOSE 目的 Define the packaging specifiction and packaging method of MINI POWER DRAWER CONT. 订定 MINI POWER DRAWER CONT. 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

200POS

Abstract: 824-W
Contextual Info: 107-68561 Packaging Specification 29Jul09 Rev E EMBOSS ASSY FOR DDR SODIMM SOCKET 200POS PROFILE 1. PURPOSE 目的 Define the packaging specifiction and packaging method of EMBOSS ASSY FOR DDR SODIMM SOCKET 200POS PROFILE. 订定 EMBOSS ASSY FOR DDR SODIMM SOCKET 200POS PROFILE 产品之包装规格及包装方式。

PTCCL

Abstract: 5479
Contextual Info: 2381 66. 5.2/PTCCL.H.FBE Vishay BCcomponents 145 V PTC Thermistors For Overload Protection FEATURES • Wide range of trip and non-trip currents: From 47 mA up to 1 A for the non-trip current • Small ratio between trip and non-trip currents It/Int = 1.5 at 25 °C

Contextual Info: MC9S12ZVHY-Family Reference Manual HCS12 Microcontrollers MC9S12ZVHYRMV1 Rev. 1.00 09/2013 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information

4614 mosfet

Abstract: Si2304DDS A 0412 MOSFET MOSFET 4614 AN609
Contextual Info: Si2304DDS_RC Vishay Siliconix R-C Thermal Model Parameters DESCRIPTION The parametric values in the R-C thermal model have been derived using curve-fitting techniques. R-C values for the electrical circuit in the Foster/tank and Cauer/filter configurations are included. When implemented in P-SPICE,

R0100

Abstract: R4700
Contextual Info: LTO 50 Vishay Sfernice Power Resistor Thick Film Technology FEATURE • 50 W at 25 °C case temperature heatsink mounted • Direct mounting ceramic on heatsink • Broad resistance range: 0.010 Ω to 550 kΩ • Non inductive • TO-220 package: Compact and easy to mount

SMD custom precision rESISTOR network

Abstract: ARRAY resistor ESCC 4001 smd transistor marking HR smd marking R7 vishay smd resistor code marking SMD array resistors PRA100 PRA135 PRA182
Contextual Info: Space Applications Only PRA HR CNW HR Vishay Sfernice ESA ( ) Qualified High Precision Chip Resistor Arrays FEATURES Vishay Sfernice Thin Film division holds ESCC QML qualification (ESCC technology flow qualification). PRA Hi-Rel arrays can be used in most applications requiring a

Vishay resistor RH

Abstract: shunt R010
Contextual Info: RTOP Vishay Sfernice Power Resistor for Mounting onto a Heatsink Thick Film Technology FEATURES • 1 % tolerance available • High power rating = 200 W • Wide ohmic value range = 0.046 Ω to 1 MΩ • Non inductive • Easy mounting • Low thermal radiation of the case

MC9S12XHY128

Abstract: MC9S12XHY256 0M23Y 9S12XHY256 9s12hy64 dps 161 psu MC9S12XHY LCD40F4BV2 bosch can 2.0A S12XHY256
Contextual Info: MC9S12XHY256 Reference Manual Covers MC9S12XHY Family Data Sheet: Advance Information This document contains information on a new product. Specifications and information here in are subject to change without notice. S12 Microcontrollers MC9S12XHY256RMV1 Rev. 0.12

Contextual Info: 40CPT080-F Vishay High Power Products High Performance Schottky Generation 5.0, 2 x 20 A FEATURES Base 2 common cathode Anode Anode 2 1 Common 3 2 1 cathode TO-247AC • • • • 175 °C high performance Schottky diode Very low forward voltage drop Extremely low reverse leakage

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: GLASS FILED PBT FLAMMABILITY RATING UL94-V0 COLOUR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRONZE NI PLATED QUALITY CLASS: 500 MATING CYCLES

CAM35C44

Abstract: FDC37C669 FDC37N769 PC87108 PC87109 PC87338 TFDU6103 Hitachi smd nor
Contextual Info: TFDU6103 Vishay Semicondutors Fast Infrared Transceiver Module FIR, 4 Mbit/s for 2.4 V to 5.5 V Operation FEATURES • Supply voltage 2.4 V to 5.5 V, operating idle current (receive mode) < 3.3 mA, shutdown current < 1 µA over full temperature range • Surface mount package, top and side view,

IEC 60998

Abstract: 20AWG FTEC174 60512-1-1 Flat Ribbon Connector - 60 IDC
Contextual Info: 108-19388 Product Specification Rev. C GEL CONNECTOR; IDC / WIRE TO WIRE GEL CONNECTOR IDC / WIRE TO WIRE - NOT IN SCALE - C B A Modified P/N page2 and 3.2 req. value (page4) PPo 06 Aug 10 EDe 9aug10 Update after qualification EDe 8Feb10 OLe 8Feb10 Revised

Contextual Info: MC9S12ZVH-Family Reference Manual HCS12 Microcontrollers MC9S12ZVHRMV1 Rev. 1.02 03/2014 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information

Contextual Info: TFDU6103 Vishay Semiconductors Fast Infrared Transceiver Module FIR, 4 Mbit/s for 2.4 V to 5.5 V Operation FEATURES • Supply voltage 2.4 V to 5.5 V, operating idle current (receive mode) < 3.3 mA, shutdown current < 1 µA over full temperature range • Surface mount package, top and side view,

Contextual Info: 40CPT080-F Vishay High Power Products High Performance Schottky Generation 5.0, 2 x 20 A FEATURES Base 2 common cathode Anode Anode 2 1 Common 3 2 1 cathode TO-247AC • • • • 175 °C high performance Schottky diode Very low forward voltage drop Extremely low reverse leakage

Contextual Info: Vishay Thin Film Dual Flat No Lead Molded Surface Mount Precision Thin Film Resistor Network FEATURES • • • • 0.65 mm lead pitch MSL level 1 per J-STD-020 Low profile 1 mm seated height Small size 4 mm x 4 mm size 50 % board savings over SOIC packages

T4080

Contextual Info: 40CPT080-F Vishay High Power Products High Performance Schottky Generation 5.0, 2 x 20 A FEATURES Base 2 common cathode Anode Anode 2 1 Common 3 2 1 cathode TO-247AC • • • • 175 °C high performance Schottky diode Very low forward voltage drop Extremely low reverse leakage

Contextual Info: 40CPT100-F Vishay High Power Products High Performance Schottky Generation 5.0, 2 x 20 A FEATURES Base 2 common cathode Anode Anode 2 1 Common 3 2 1 cathode TO-247AC • • • • 175 °C high performance Schottky diode Very low forward voltage drop Extremely low reverse leakage

Contextual Info: MC9S12ZVH-Family Reference Manual HCS12 Microcontrollers MC9S12ZVHRMV1 Rev. 1.00 09/2013 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information