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    2GB NAND MCP Search Results

    2GB NAND MCP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54H30J Rochester Electronics LLC NAND Gate Visit Rochester Electronics LLC Buy
    DM74LS22J Rochester Electronics LLC DM74LS22 - NAND Logic Gate Visit Rochester Electronics LLC Buy
    54H30J/C Rochester Electronics LLC 54H30 - NAND Gate Visit Rochester Electronics LLC Buy
    946HM/C Rochester Electronics LLC 946 - NAND Gate Visit Rochester Electronics LLC Buy
    MC2101F Rochester Electronics LLC MC2101F - Dual NAND Logic Gate Visit Rochester Electronics LLC Buy

    2GB NAND MCP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MT29C4G48MAZBBAKQ-48 IT

    Abstract: MT29C8G96MAZBBDJV-48 IT MT29C4G96MAZBBCJG-48 mt29c4g96
    Text: Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package PoP Combination Memory (TI OMAP ) MT29C4G48MAZBBAKQ-48 IT: 4Gb x16 (NAND) with 2Gb x32 (LPDDR) MT29C4G96MAZBBCJG-48 IT: 4Gb x16 (NAND) with 4Gb x32 (LPDDR)


    Original     		PDF 168-Ball MT29C4G48MAZBBAKQ-48 MT29C4G96MAZBBCJG-48 MT29C8G96MAZBBDJV-48 09005aef855512a5 168ball MT29C4G48MAZBBAKQ-48 IT MT29C8G96MAZBBDJV-48 IT mt29c4g96

    MT29C2G24MAKLA-XIT

    Abstract: mt29C2G24
    Text: MS29C2G24MAKLA1-XX 2Gb NAND FLASH x16 / 1Gb LPDDR (x32) FEATURES GENERAL DESCRIPTION  Package: Microsemi package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, highperformance, and minimal package-footprint design requirements.


    Original     		PDF MS29C2G24MAKLA1-XX MT29C2G24MAKLA-XIT" MT29C2G24MAKLA-XIT mt29C2G24

    MT29C2G24MAABAKAMO-S

    Abstract: 130ball mcp MT29C micron lpddr Micron mcp MT29C2G 2gb nand mcp
    Text: Specifications Data Sheets Pa11 Status Code: Production NAND Density: 2Gb Wi<nh: X16 LPDDR Density: 1Gb LPSOR Density: Seconda1y Wi<nh: x32 ~ Data sheet: 130-ball 8mm x 9mm NAND • LPDDR MCP J41l Q Rev. Date: 0112011, File Size: 4.11 MB RoHS: Yes vonage: 1. 7V-1.9V


    Original     		PDF 130-ball MT29C2G24MAABAKAMO-S 130ball mcp MT29C micron lpddr Micron mcp MT29C2G 2gb nand mcp

    Untitled

    Abstract: No abstract text available
    Text: MS29C4G48MAZAKC1-XX *PRELIMINARY 4Gb NAND FLASH x16 / 2Gb LPDDR (x32) FEATURES GENERAL DESCRIPTION  Package: Microsemi package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, highperformance, and minimal package-footprint design requirements.


    Original     		PDF MS29C4G48MAZAKC1-XX MT29C4G48MAZAPACA-XIT"

    Untitled

    Abstract: No abstract text available
    Text: MS29C4G48MAZAKC1-XX 4Gb NAND FLASH x16 / 2Gb LPDDR (x32) FEATURES GENERAL DESCRIPTION  Package: Microsemi package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, highperformance, and minimal package-footprint design requirements.


    Original     		PDF MS29C4G48MAZAKC1-XX MT29C4G48MAZAPACA-XIT"

    mt29C2G24MAAAA

    Abstract: MT29C2G24MAAAAHAM0-5
    Text: Specifications Data Sheets Pa11 Status Code: Production NAND Density: 2Gb ~ Data sheet: 130-ball 8mm x Wi<nh: x8 LPDDR Density: 1Gb LPSOR Density: Seconda1y Wi<nh: x16 9mm NAND • LPDDR MCP J41l Q Rev. Date: 0112011, File Size: 4.11 MB RoHS: Yes vonage: 1. 7V-1.9V


    Original     		PDF 130-ball MT29C2G24MAAAAHAM0-5 mt29C2G24MAAAA

    x-gold 716

    Abstract: MD8832 diskonchip g4 MD8832-D1G md8832-d1g-v18-x-p st mlc flash datasheet intel p4 motherboard power supply circuit diagram TRUEFFS computer motherboard circuit diagram P4 arm microprocessor data sheet
    Text: DiskOnChip G4 128MB 1Gb /256MB (2Gb) 1.8V Flash Disk with MLC NAND and M-Systems’ x2 Technology Data Sheet, November 2005 „ Highlights DiskOnChip G4 is M-Systems' 4th generation of the DiskOnChip family of products. Based on Multi-Level Cell (MLC) NAND, utilizing


    Original     		PDF 128MB /256MB 92-DS-1105-00 x-gold 716 MD8832 diskonchip g4 MD8832-D1G md8832-d1g-v18-x-p st mlc flash datasheet intel p4 motherboard power supply circuit diagram TRUEFFS computer motherboard circuit diagram P4 arm microprocessor data sheet

    K524G2GACB-A050

    Abstract: samsung "nand flash" derating K524G2GACB MCP 256M nand samsung mobile DDR nand flash DQS KF94 samsung MCP K5 transistor BA 92 samsung transistor 4gb nand flash SAMSUNG MCp nand ddr
    Text: K524G2GACB-A050 MCP MEMORY MCP Specification 4Gb NAND Flash + 2Gb Mobile DDR INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF K524G2GACB-A050 A10/AP K524G2GACB-A050 samsung "nand flash" derating K524G2GACB MCP 256M nand samsung mobile DDR nand flash DQS KF94 samsung MCP K5 transistor BA 92 samsung transistor 4gb nand flash SAMSUNG MCp nand ddr

    153-FBGA

    Abstract: 153FBGA 153Ball FBGA samsung "nand flash" derating MCP LPDDR 1Gb 512Mb K522H1HACF-B050 k522h1 MCP 256M nand samsung mobile DDR MCP 1Gb nand 512mb dram 130 2gb nand mcp
    Text: Rev. 1.0, Oct. 2010 K522H1HACF-B050 MCP Specification 2Gb 128M x16 NAND Flash + 1Gb (64M x16 ) Mobile DDR SDRAM datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		PDF K522H1HACF-B050 A10/AP 153-FBGA 153FBGA 153Ball FBGA samsung "nand flash" derating MCP LPDDR 1Gb 512Mb K522H1HACF-B050 k522h1 MCP 256M nand samsung mobile DDR MCP 1Gb nand 512mb dram 130 2gb nand mcp

    Micron 512MB nand FLASH

    Abstract: 64gb NAND chip micron nand flash chip 8gb Micron 1GB NAND FLASH nand flash 32gb x16 1g nand DDR mcp MCP NAND DDR MICRON mcp micron nand flash chip 16gb MT29C
    Text: MCP/PoP Part Numbering System Micron's part numbering system is available at www.micron.com/numbering Multichip Packages MT 29C 1G 12M A B A A Micron Technology IT ES Production Status AG = 16Gb BG = 32Gb CG = 64Gb DG = 128Gb LPDRAM Density 56M = 256Mb 24M = 1Gb


    Original     		PDF 128Gb 256Mb 512Mb 152Mb 640Mb 128Mb Micron 512MB nand FLASH 64gb NAND chip micron nand flash chip 8gb Micron 1GB NAND FLASH nand flash 32gb x16 1g nand DDR mcp MCP NAND DDR MICRON mcp micron nand flash chip 16gb MT29C

    LPDDR2 PoP

    Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet 216-ball LPDDR lpddr2 nand mcp Micron 512MB nand FLASH 136-Ball 168-ball LPDDR Micron NAND
    Text: A Perfect Match for Matchless Performance Micron Multichip Packages Form Factor, Speed, Power. Choose All That Apply. Form factor, speed, power—your mobile customers want all three. With Micron’s MCPs, you can respond to customers’ everincreasing demands without compromising leading-edge performance. Mix and match devices, configurations, and package


    Original     		PDF

    samsung 2GB X16 Nand flash

    Abstract: SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH
    Text: Multi-Chip Package Technology from Samsung The ultimate memory solution for mobile devices MCPs: New Memory Solution for Today’s Handhelds As the popularity of handheld electronic devices continues to expand, the Best Source for MCPs memory solution of choice for designers of these products has become


    Original     		PDF BR-06-MEM-001 samsung 2GB X16 Nand flash SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH

    toshiba mcp nand

    Abstract: toshiba mcp GBNAND 2Gb NAND FLASH Toshiba MEP core MCP Technology Trend toshiba psram MCP 1Gb toshiba 512Mb TOSHIBA flash memory -NAND sd controller
    Text: EYE 07 July 2006 TOSHIBA SEMICONDUCTOR BULLETIN EYE VOLUME 168 CONTENTS INFORMATION Kaga Toshiba to Build New 200mm Wafer-based Production Fab 2 Toshiba and ARC Collaborate to Grow Industry Adoption of Configurable Processor Technology Worldwide .3


    Original     		PDF 200mm toshiba mcp nand toshiba mcp GBNAND 2Gb NAND FLASH Toshiba MEP core MCP Technology Trend toshiba psram MCP 1Gb toshiba 512Mb TOSHIBA flash memory -NAND sd controller

    MT29F2G16AB

    Abstract: MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET
    Text: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components


    Original     		PDF 168-Ball MT29CxGxxMAxxxxx 09005aef83070ff3 168ball MT29F2G16AB MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET

    MT29C1G12

    Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
    Text: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package


    Original     		PDF 152-Ball 409ng 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29C1G12 mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1

    MT29C2G24m

    Abstract: MT29C2G48 MT29C4G48M SMD MARKING CODE h23 MT29F4G16ABC JW256 MT29F4G16AB MT29C2G24MAKLAJG-6 MCP LPDDR 1Gb 512Mb marking k22 SMD
    Text: Preliminary‡ 168-Ball NAND Flash and LP-DRAM PoP TI-OMAP MCP Features NAND Flash and LP-DRAM 168-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package


    Original     		PDF 168-Ball 09005aef83071038/PDF: 09005aef83070ff3 168ball MT29C2G24m MT29C2G48 MT29C4G48M SMD MARKING CODE h23 MT29F4G16ABC JW256 MT29F4G16AB MT29C2G24MAKLAJG-6 MCP LPDDR 1Gb 512Mb marking k22 SMD

    MT29C1G24MADLAJA-6

    Abstract: Micron 512MB nand FLASH MT29C2G24MAKLAJA-6 Micron 512MB nand FLASH mcp Flash MCp nand DRAM 137-ball JW190 137-Ball MCP NAND sDR mt29c 1g nand DDR mcp
    Text: Preliminary‡ Micron Confidential and Proprietary 137-Ball NAND Flash with LP-DRAM MCP Features NAND Flash with LP-DRAM 137-Ball Multiple-Chip Package MCP MT29CxGxxMAxxxJA Current Production Part Numbers: Table 1 on page 2 Features Figure 1: • All-Micron NAND Flash and LP-DRAM


    Original     		PDF 137-Ball MT29CxGxxMAxxxJA 09005aef82ff4431 09005aef82ff448c 137ball MT29C1G24MADLAJA-6 Micron 512MB nand FLASH MT29C2G24MAKLAJA-6 Micron 512MB nand FLASH mcp Flash MCp nand DRAM 137-ball JW190 MCP NAND sDR mt29c 1g nand DDR mcp

    MT29F1G08ABCHC

    Abstract: mt29c MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
    Text: Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP ) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1:


    Original     		PDF 152-Ball MT29C 152-Ball 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29F1G08ABCHC MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr

    "NOR Flash" 512MB

    Abstract: MCP NOR FLASH SDRAM 512MB SRAM 512MB TMP89FS60UG GBNAND TMP89FS60FG LP SDRAM MCP 1Gb 512Mb 2gb nand mcp
    Text: EYE 07 July 2006 東芝半導体情報誌アイ 2006年7月号 VOLUME 168 CONTENTS INFORMATION 加賀東芝エレクトロニクス 株 に200mmウェハ対応の 新製造棟を建設.2


    Original     		PDF 200mm 962m2 000m2 "NOR Flash" 512MB MCP NOR FLASH SDRAM 512MB SRAM 512MB TMP89FS60UG GBNAND TMP89FS60FG LP SDRAM MCP 1Gb 512Mb 2gb nand mcp

    K9F2G08U0C

    Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
    Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


    Original     		PDF BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0

    s3c2442

    Abstract: sc32442 Samsung SC32442 s3c2442 datasheet lcd stn 4096 mobile camera interface microcontroller SAMSUNG MCP "TSP Controller" ARM920T rom samsung 1Gb nand flash
    Text: Samsung SC32442 MSP Multi Stacked Package Leading-Edge Application Processor with single package incorporating Memory MCP Product Brief SC32442 MSP product is a proprietary solution provided exclusively by Samsung Electronics. SC32442 includes an S3C2442 AP


    Original     		PDF SC32442 S3C2442 ARM920T 512Mb 128MB Samsung SC32442 s3c2442 datasheet lcd stn 4096 mobile camera interface microcontroller SAMSUNG MCP "TSP Controller" ARM920T rom samsung 1Gb nand flash

    K9F2G08U0B

    Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
    Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage January 2009 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


    Original     		PDF BR-09-ALL-001 K9F2G08U0B K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B

    s3c6410x

    Abstract: S3C6410 s3c6410 external interrupt s3c6410 arm1176JZF datasheet samsung S3C6410 s3c6410 datasheet Samsung S3C6410 ARM S3C6410X5D S3C6430 oneDRAM
    Text: y inaarry imin PPrreelilm Product Technical Brief S3C6410 July 2008 Overview S3C6410 is a 16/32-bit RISC cost-effective, low power, high performance micro-processor solution for mobile phones, Portable Navigation Devices and other general applications. To provide optimized H/W performance for the


    Original     		PDF S3C6410 S3C6410 16/32-bit 64/32-bit 424-pins S3C6410X5A 491-pins 533MHz 667MHz s3c6410x s3c6410 external interrupt s3c6410 arm1176JZF datasheet samsung S3C6410 s3c6410 datasheet Samsung S3C6410 ARM S3C6410X5D S3C6430 oneDRAM

    K9HCG08U5M

    Abstract: K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 K4M56323PI MCCOE32GQMPQ-M K4M56163PI movinand
    Text: SAMSUNG Mobile Memory C ontents NAND Flash NOR Flash One NAND Mobile DRAM movi NAND™ SSD Multi Media Card Living in NAND Flash world Living in the stage of 20GB memory after passing through the dark-age of 1GB in 2002, the mobile & consumer electronics now start to feel the needs


    OCR Scan     		PDF 120GB 128MB 256MB 128MB 512MB K9HCG08U5M K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 K4M56323PI MCCOE32GQMPQ-M K4M56163PI movinand