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    30PIN Search Results

    30PIN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10159549-130KCLF Amphenol Communications Solutions WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Receptacle Housing 30pin C Coding Visit Amphenol Communications Solutions
    10159549-130KDLF Amphenol Communications Solutions WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Receptacle Housing 30pin D Coding Visit Amphenol Communications Solutions
    10159549-130KALF Amphenol Communications Solutions WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Receptacle Housing 30pin A Coding Visit Amphenol Communications Solutions
    10159549-130KBLF Amphenol Communications Solutions WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Receptacle Housing 30pin B Coding Visit Amphenol Communications Solutions
    10153118-130KDLF Amphenol Communications Solutions WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Right Angle - Through Hole, Type 30pin Header D Coding Visit Amphenol Communications Solutions
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    30PIN Price and Stock

    American Electrical Inc DR-30PINS

    DR 30K POLES FOR ROTARY PLATE (1
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    DigiKey DR-30PINS Bulk 1
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    Onlinecomponents.com DR-30PINS
    • 1 $133.33
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    • 100 $104.64
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    Kasp Security K10530PIND

    Lock, Combi, Aluminium, 30Mm, Pink; Width:30Mm; Shackle Clearance - Horizontal:12Mm; Shackle Clearance - Vertical:27Mm; Shackle Diameter:5Mm; Lock Material:Aluminium; Product Range:-; Svhc:No Svhc (15-Jan-2019); Colour:Pin Rohs Compliant: Na |Kasp Security K10530PIND (Alternate Part Number: 5013969904246
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    Newark K10530PIND Bulk 1
    • 1 $17.46
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    MACOM AT-230-PIN

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    Bristol Electronics AT-230-PIN 290
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    OMRON Corporation XG4M3030TBYOMZ

    Rectangular MIL Spec Connectors Socket+StrainRelief Set 30Pin 1Polar
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    TTI XG4M3030TBYOMZ Kit 2,470 10
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    HARTING Technology Group 09252306850

    DIN 41612 Connectors 30P Fmle 3C Press-In Solder
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    TTI 09252306850 Bulk 500 2
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    30PIN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TSSOP30

    Abstract: No abstract text available
    Text: SANYO Semiconductor Thin Shrink Small Outline Package 30Pin Plastic TSSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin TSSOP30 275mil) ED-7303A) TSSOP30 PDF

    30P4

    Abstract: DIP30-P-600-2
    Text: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5


    Original     		30pin 600mil DIP30-P-600-2 30P4 PDF

    DIP30SD

    Abstract: DIP-30SD
    Text: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SD 400mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。


    Original     		30Pin DIP30SD 400mil) ED-7303A DIP30SD DIP-30SD PDF

    TA8776N

    Abstract: philips sub woofer circuit diagram circuit diagram "dolby digital stereo" sub woofer circuit i2c bass volume balance hall
    Text: TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8776N SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled I2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package. FEATURES


    Original     		TA8776N TA8776N 30pin 000707EBA2 philips sub woofer circuit diagram circuit diagram "dolby digital stereo" sub woofer circuit i2c bass volume balance hall PDF

    traffic light controller

    Abstract: BM1040R0A TLCS-870 TMP86CH12MG
    Text: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86CH12MG 8-bit microcontroller in small-sized package suitable for inverter-type lights and IH appliances TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 V


    Original     		TLCS-870 TLCS-870/C 30pin TMP86CH12MG 10-bit 16-bit traffic light controller BM1040R0A TMP86CH12MG PDF

    Untitled

    Abstract: No abstract text available
    Text: 30S1B Metal seal 30pin 400mil DIP EIAJ Package Code WDIP30-C-400-1.78 Weight g JEDEC Code – 1 15 e1 16 E 30 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 4.75 – – 0.72 3.53 – –


    Original     		30S1B 30pin 400mil WDIP30-C-400-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Zigzag In-line Package 30Pin Plastic SIP30Z Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations ED-7303A , which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin SIP30Z ED-7303A) 16MAX 95MIN PDF

    Untitled

    Abstract: No abstract text available
    Text: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SDLF 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin DIP30SDLF 400mil) ED-7303A) DIP30SDLF PDF

    MFP30S

    Abstract: No abstract text available
    Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SDJ 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin MFP30SDJ 375mil) ED-7303A) 45ming 45max MFP30SDJ MFP30S PDF

    SSOP30

    Abstract: SSOP30 package
    Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic SSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin SSOP30 275mil) ED-7303A) SSOP30 SSOP30 package PDF

    MFP30S

    Abstract: No abstract text available
    Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30S 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the


    Original     		30Pin MFP30S 375mil) ED-7303A) 35max MFP30S PDF

    TA8776N

    Abstract: circuit diagram "dolby digital stereo" philips sub woofer circuit diagram dual sub woofer circuit diagram circuit diagram "dolby digital" bass treble control circuit for woofer sorround sound processor ic dolby bass circuit 3d surround sound circuits i2c bass volume balance hall
    Text: TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8776N SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled I2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package. FEATURES


    Original     		TA8776N TA8776N 30pin 000707EBA2 circuit diagram "dolby digital stereo" philips sub woofer circuit diagram dual sub woofer circuit diagram circuit diagram "dolby digital" bass treble control circuit for woofer sorround sound processor ic dolby bass circuit 3d surround sound circuits i2c bass volume balance hall PDF

    Untitled

    Abstract: No abstract text available
    Text: QB-144-CA-01's pin header cover for 78K0/KB2 30pin MC package CP1 CP2 CP3 CP4 GND N.C. N.C. 20 19 18 N.C. N.C. N.C. N.C. 17 16 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 15 N.C. N.C. 14 13 N.C. 12 N.C. 11 10 9 8 7 N.C. N.C. GND GND 78K0/KB2 30pinMC


    Original     		QB-144-CA-01 78K0/KB2 30pin 78K0/KB2 30pinMC PDF

    Untitled

    Abstract: No abstract text available
    Text: 30P4B Plastic 30pin 400mil SDIP JEDEC Code – Weight g 2.2 Lead Material Alloy 42 16 1 15 E 30 e1 c EIAJ Package Code SDIP30-P-400-1.78 D L A1 A A2 Symbol b1 SEATING PLANE b e A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08 0.51


    Original     		30P4B 30pin 400mil SDIP30-P-400-1 PDF

    TLCS-870

    Abstract: TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C808NG TMP86P808DMG TMP86P808NG
    Text: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86F808DMG/NG 8-bit microcontroller with flash memory and two serial interfaces in small-sized package TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 Ｖ


    Original     		TLCS-870 TLCS-870/C 30pin TMP86F808DMG/NG 16-bit TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C8083 TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C808NG TMP86P808DMG TMP86P808NG PDF

    Untitled

    Abstract: No abstract text available
    Text: September 2006 TLCS-870 Family TLCS-870/C Series 30pin TMP86FH92DMG 8-bit microcontroller incorporating Flash memory, power-on reset circuit and voltage detecting circuit in 30-pin SSOP TLCS-870/C CPU Core •Operating voltage 4.0 to 5.5 V, 2.7 to 5.5 V ·Minimum instruction execution time


    Original     		TLCS-870 TLCS-870/C 30pin TMP86FH92DMG 30-pin 10-bit 16-bit PDF

    HM511000

    Abstract: hb56g19b-7
    Text: HB56G19A/B Series Maintenance only 1,048,576-word x 9-bit High Density Dynamic RAM Module The HB56G19 is a 1M × 9 dynamic RAM module, mounted two 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 1 Mbit DRAM (HM511000 AJP/ALJP) sealed in SOJ package. An outline of the HB56G19 is 30pin single in-line package. Therefore, the


    Original     		HB56G19A/B 576-word HB56G19 HM514400BS/BLS) HM511000 30pin HB56G19A-7B/7BL hb56g19b-7 PDF

    Untitled

    Abstract: No abstract text available
    Text: QB-144-CA-01's pin header cover for PD78F073x 30pin MC package CP1 GND N.C. N.C. N.C. N.C. N.C. N.C. 14 13 12 11 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 22 21 20 19 18 17 16 15 23 N.C. N.C. 10 9 N.C. N.C. GND GND μPD78F073x 30MC CP2


    Original     		QB-144-CA-01 PD78F073x 30pin PD78F073x PDF

    Untitled

    Abstract: No abstract text available
    Text: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.


    OCR Scan     		TA8776N TA8776N 30pin SDIP30-P-400-1 PDF

    e50p

    Abstract: DCE37PT
    Text: D-subm iniature M etal Shell W ire W rap Basic D Series • Reliable wire wrap termination. • Two contact lengths: .375" or .585". • .025” square contact tails. Cinch Materials • Contact Material: Copper alloy machined . • Contact Plating: Gold flash or 30pin. gold. All over nickel.


    OCR Scan     		30pin. 30gin. DE-9P-F179 DE-9P-F179-30 DEE-9P-F179 DEE-9P-F179-30 DEY-9P-F179 DEY-9P-F179-30 DA-15P e50p DCE37PT PDF

    toshiba ctv circuit diagram

    Abstract: dolby bass circuit TA8776N philips sub woofer circuit diagram surround processor 254TYP sorround sound processor ic Ic surround 1996090 super treble diagram
    Text: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.


    OCR Scan     		TA8776N TA8776N 30pin 20Max SDIP30-P-400-1 toshiba ctv circuit diagram dolby bass circuit philips sub woofer circuit diagram surround processor 254TYP sorround sound processor ic Ic surround 1996090 super treble diagram PDF

    dip switch ece

    Abstract: cs359
    Text: I 3*427555 DD4T150 AIT • NECE N E C -DATA S H E E T . . BIPOLAR ANALOG INTEGRATED CIRCUIT ; E E C T R O N D E V IC E *’»> .» 4, . - »V -, it / / P C I 8 2 0 ' ; * ._t7 .7 ,.^ ?' COLOR TV/VTR PLL IF SIGNAL PROCESSING 1C The /¿PC1820 is a semiconductor integrated circuit for processing the color T V / V T R P IF / S IF signals. T his 1C is housed in a 30pin shrink dual-in-line package (D IP . Its main features are supported by the built-in keyed-pulse generator circuit needed for


    OCR Scan     		DD4T150 uPC1820 30pin /zPC1820 30-pin S30C-70-400B dip switch ece cs359 PDF

    Untitled

    Abstract: No abstract text available
    Text: D-subminiature Metal Shell Vertical Dip Solder PCS D*U Series Cinch • .024" contact diameter. • Longer rear insulator provides integral standoff from PCB. Materials • Contact Material: Plug - Brass machined . Socket - Copper alloy (machined). • Contact Plating: Gold flash or 30pin. gold. All over nickel.


    OCR Scan     		30pin. DEU-9PBF-30 DEUE-9PBF-30 DEUY-9PBF-30 DAU-15PBF DAU-15PBF-30 DAUE-15PBF PDF

    Untitled

    Abstract: No abstract text available
    Text: TOSHIBA TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC T A ft 7 7 fi M • m m » a ■v SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.


    OCR Scan     		TA8776N f77fM TA8776N 30pin 10//F SDIP30-P-400-1 PDF