M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-262/263 D2PAK Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 292 185,504 85_C, 85%RH 0.00 BOND INT 2,040 1,020,000 200_C + N2 0.00 HAST 5,557
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O-262/263
10SEC
M2003
30-Jan-05
M2003
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SQFP-48
Abstract: M2003 65C15
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SQFP 48-64 LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 240 120,000 200_C +N2 0.00 HAST 530 53,000 130_C, 85%RH 0.00 Pressure Pot 730 70,080
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10SEC
M2003
30-Jan-05
SQFP-48
M2003
65C15
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SOT-563 SOT-666
Abstract: marking 802 soic8 sot-563 MOSFET D1 20l sot-23 siliconix MARKING CODE mSOp-8 siliconix code marking to-220 marking code 20L sot-23 sot23 V30114-T1
Text: Si1024X Vishay Siliconix Dual N-Channel 20-V D-S MOSFET PRODUCT SUMMARY VDS (V) 20 rDS(on) (W) ID (mA) 0.70 @ VGS = 4.5 V 600 0.85 @ VGS = 2.5 V 500 1.25 @ VGS = 1.8 V 350 FEATURES D D D D D D D BENEFITS Very Small Footprint High-Side Switching Low On-Resistance: 0.7 W
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Si1024X
OT-563
SC-89
SC70-6L
SC89-6L
Specification--PACK-0007-9
T-05206,
AN826
SC-89:
20-Jun-03
SOT-563 SOT-666
marking 802 soic8
sot-563 MOSFET D1
20l sot-23
siliconix MARKING CODE mSOp-8
siliconix code marking to-220
marking code 20L sot-23 sot23
V30114-T1
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M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-70 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 760 126,360 85_C, 85%RH 0.00 BOND INT 975 393,750 200_C + N2 0.00 HAST 4,113 426,800 130_C, 85%RH
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SC-70
10SEC
M2003
30-Jan-05
M2003
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Untitled
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR SO-8 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 492 492,000 85_C, 85%RH 0.00 BOND INT 540 240,000 200_C +N2 0.00 HAST 4,785 480,600
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10SEC
30-Jan-05
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transistor HR
Abstract: m2003 package diode electronic reliability siliconix j201
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 420 3,360 883 M2003 0.00 Temp Cycle 2,300 662,500 −65_C−150_C 0.00 Document Number: 72454
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M2003
30-Jan-05
transistor HR
m2003
package diode
electronic reliability
siliconix j201
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M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PLCC Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 315 31,500 130_C, 85%RH 0.00 Pressure Pot 1,075 103,200 121_, 15 PSIG 0.00 Solder DUNK 110 330
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10SEC
M2003
30-Jan-05
M2003
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M2003
Abstract: TO252-DPAK
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-251/252 AND REVERSE TO-252 DPAK Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 1,050 744,704 85_C, 85%RH 0.00 BOND INT 2,800 1,400,000 200_C + N2
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O-251/252
O-252
10SEC
M2003
30-Jan-05
M2003
TO252-DPAK
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130C
Abstract: Siliconix
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR 1212 SOLDER PROCESS Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 550 55,000 130_C, 85%RH 0.00 Pressure Pot 275 30,360 121_, 15 PSIG 0.00
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30-Jan-05
130C
Siliconix
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2n4416 and application note
Abstract: TSSOP-8 footprint and soldering sot-23 2N4416 equivalent Siliconix sot23 marking THERMAL SWITCH SC-75A sot-23 Marking N2 699 marking code sot23-5 marking code v6 SOT23 V30114 marking code 20L sot-23 sot23
Text: 2N4416/2N4416A/SST4416 Vishay Siliconix N-Channel JFETs PRODUCT SUMMARY Part Number VGS off (V) V(BR)GSS Min (V) gfs Min (mS) IDSS Min (mA) 2N4416 −v6 −30 4.5 5 2N4416A −2.5 to −6 −35 4.5 5 SST4416 −v6 −30 4.5 5 FEATURES BENEFITS D Excellent High-Frequency Gain:
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2N4416/2N4416A/SST4416
2N4416
2N4416A
SST4416
2N4416/A,
2N4416/2N4416A/SST4416
26-Nov-03
AN826
OT-23
20-Jun-03
2n4416 and application note
TSSOP-8 footprint and soldering sot-23
2N4416 equivalent
Siliconix sot23 marking
THERMAL SWITCH SC-75A
sot-23 Marking N2
699 marking code sot23-5
marking code v6 SOT23
V30114
marking code 20L sot-23 sot23
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cerdip
Abstract: sidebraze siliconix j201 transistor HR M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR CerDIP/SIDEBRAZE Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 105 840 883 M2003 0.00 Temp Cycle 500 130,000 −65_C−150_C 0.00 Document Number: 72452
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M2003
30-Jan-05
cerdip
sidebraze
siliconix j201
transistor HR
M2003
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M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-5/6 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 275 44,880 85_C, 85%RH 0.00 BOND INT 805 463,820 200_C +N2 0.00 HAST 3,594 377,800 130_C, 85%RH
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10SEC
M2003
30-Jan-05
M2003
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M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR 1212 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND TNT 120 60,000 200_C +N2 0.00 HAST 4,046 401,650 130_C, 85%RH 0.00 Power Cycle 246 5,271,288
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10SEC
M2003
30-Jan-05
M2003
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M2003
Abstract: SC-75A
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-75A Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 610 610,000 130_C, 85%RH 0.00 Pressure Pot 1,610 152,260 121_, 15 PSIG 0.00 Solder DUNK 335
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SC-75A
10SEC
M2003
30-Jan-05
M2003
SC-75A
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transistor 388
Abstract: M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-220 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 360 180,000 200_C + N2 0.00 HAST 1,631 160,950 130_C, 85%RH 0.00 Power Cycle 801 7,332,008
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O-220
10SEC
M2003
30-Jan-05
transistor 388
M2003
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PowerPAK SO-8
Abstract: M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR SO-8 SOLDER PROCESS Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 300 150,000 200_C +N2 0.00 HAST 2,102 207,450 130_C, 85%RH 0.00 Power Cycle
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10SEC
M2003
30-Jan-05
PowerPAK SO-8
M2003
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PDIP-8
Abstract: M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PDIP 8-28 LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 200 10,000 85_C, 85%RH 0.00 BOND INT 375 227,500 200_C + N2 0.00 HAST 2,090 206,5750
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10SEC
M2003
30-Jan-05
PDIP-8
M2003
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M2003
Abstract: 72451 415 tssop
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSSOP 8-LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 1,000 500,000 200_C + N2 0.00 HAST 4,705 476,000 130_C, 85%RH 0.00 Pressure Pot 10,380
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10SEC
M2003
30-Jan-05
M2003
72451
415 tssop
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M2003
Abstract: No abstract text available
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-92 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 320 191,000 200C + N2 0.00 HAST 2,005 200,500 130_C, 85%RH 0.00 Pressure Pot 4,700 468,000
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M2003
30-Jan-05
M2003
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M2003
Abstract: SC-89
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-89 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 165 25,080 85_C, 85%RH 0.00 BOND INT 285 176,250 200_C +N2 0.00 HAST 1,255 133,640 130_C, 85%RH
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SC-89
10SEC
M2003
30-Jan-05
M2003
SC-89
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Package Reliability
Abstract: 72456 M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MSOP Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 80 90,000 200_C + N2 0.00 HAST 1,130 118,500 130_C, 85%RH 0.00 Pressure Pot 2,180 214,560
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10SEC
M2003
30-Jan-05
Package Reliability
72456
M2003
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Package Reliability
Abstract: 72455 M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MLP/QFN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 165 51,700 85_C, 85%RH 0.00 BOND INT 960 700,000 200_C + N2 0.00 HAST 1,910 191,000 130_C, 85%RH
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10SEC
M2003
30-Jan-05
Package Reliability
72455
M2003
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SSOT-23
Abstract: M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SSOT-23 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 200 100,000 200_C + N2 0.00 HAST 650 76,000 130_C, 85%RH 0.00 Power Cycle 246 3,690,000
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SSOT-23
10SEC
M2003
30-Jan-05
SSOT-23
M2003
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Untitled
Abstract: No abstract text available
Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. DIST LOC ALL RIGHTS RESERVED. AD 00 REVISIONS LTR B DESCRIPTION DATE EC 0G3C 0809 04 DWN APVD BSV JRO 30JAN05 THESE DIMENSIONS PERTAIN TO CAVITY CENTERLINES ONLY,
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30JAN05
31MAR2000
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