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Catalog Datasheet	MFG & Type	PDF	Document Tags
SDC-W25XB-09-LF Abstract: SDC-W25XB-09 Text: 1.50±0.05 1.65 11.57 11.06 SPECIFICATION MATERIAL Insulator: Thermal Plastic U L 9 4 V -0 Contacts: Copper Alloy Boardlock: Copper Alloy CONTACT PLATING Underplated: 50rn Nickel Contact Area: 1rti~30rrV Selective Gold Solder Tails Area: 100rrf Tin/Lead Brighten Tin or	OCR Scan	PDF	UL94V-0 100rrT SDC-W25XB-09-LF SDC-W25XB-09 SDC-W25XB-09

Catalog Datasheet

MFG & Type

PDF

Document Tags

SDC-W25XB-09-LF

Abstract: SDC-W25XB-09
Text: 1.50±0.05 1.65 11.57 11.06 SPECIFICATION MATERIAL Insulator: Thermal Plastic U L 9 4 V -0 Contacts: Copper Alloy Boardlock: Copper Alloy CONTACT PLATING Underplated: 50rn Nickel Contact Area: 1rti~30rrV Selective Gold Solder Tails Area: 100rrf Tin/Lead Brighten Tin or

OCR Scan

PDF

UL94V-0 100rrT SDC-W25XB-09-LF SDC-W25XB-09 SDC-W25XB-09