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    Untitled

    Abstract: No abstract text available
    Text: F-213 Rev 31JUL13 MEC6–120–02–L–D–RA1 MEC6–130–02–L–D–RA1 (0,635 mm) .025" MEC6–150–02–L–D–RA1 MEC6-RA SERIES RIGHT ANGLE MICRO EDGE CARD SOCKET SPECIFICATIONS Mates with: (1,60 mm) .062" thick cards Mates with (1,60 mm) .062"


    Original     		PDF F-213 31JUL13)

    Untitled

    Abstract: No abstract text available
    Text: RF-12 Rev 31-JUL-13 MH113–MH1RP–MH1RP–0300 MH113–MH1RP–01BJ1–0300 MH113* SERIES MICRO HIGH FREQUENCY RF CABLES U.FL Type SPECIFICATIONS For complete specifications see www.samtec.com?MH113 Outer Contact Material: Au plated Phosphor Bronze Center Contact Material:


    Original     		PDF RF-12 31-JUL-13) MH113â 01BJ1â MH113* MH113 01BJ1 01BJ2 01SB1

    Untitled

    Abstract: No abstract text available
    Text: F-213 Rev 31-JUL-13 ECUE–12–010–C1–FF–02 ECUE–12–008–C1–FF–01 ECUE SERIES COPPER FIREFLY CABLE ASSEMBLY SPECIFICATIONSi “Flyover” application significantly simplifies board design Mates with: UEC5, UCC8 Low cost, high performance for short


    Original     		PDF F-213 31-JUL-13)

    Untitled

    Abstract: No abstract text available
    Text: RF-12 Rev 31-JUL-13 MH081–MH3RP–MH3RP–0300 MH081–MH3RP–01BJ1–0300 MH081* SERIES MICRO HIGH FREQUENCY RF CABLES U.FL and W.FL Types SPECIFICATIONS For complete specifications see www.samtec.com?MH081 Outer Contact Material: Au plated Phosphor Bronze


    Original     		PDF RF-12 31-JUL-13) MH081â 01BJ1â MH081* MH081 01BJ1 01BJ2 01SB1

    Untitled

    Abstract: No abstract text available
    Text: F-213 Rev 31-JUL-13 MEC1–130–02–L–D–EM2 MEC1–120–02–F–D–EM2 (1,00 mm) .0394" MEC1–120–02–L–D–RA1–SL MEC1-RA, MEC1-EM SERIES RIGHT ANGLE/EDGE MOUNT SOCKETS SPECIFICATIONS For complete specifications and recommended PCB layouts see


    Original     		PDF F-213 31-JUL-13)

    Untitled

    Abstract: No abstract text available
    Text: FC1–25–02–T–WT F-213 Rev 31-JUL-13 ZF1–25–01–T–WT FC1–20–01–T (1,00 mm) .0394" ZF1–10–01–T–WT ZF1, FC1 SERIES FLAT FLEXIBLE CABLE (FFC) SOCKET Mates with: FJ NO. OF POSITIONS ZF1 LEAD STYLE PLATING OPTION WT –T –WT –TR


    Original     		PDF F-213 31-JUL-13)

    Untitled

    Abstract: No abstract text available
    Text: V4PAN50 www.vishay.com Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier FEATURES • Very low profile - typical height of 0.95 mm • Ideal for automated placement TMBS SMPATM • Trench MOS Schottky technology • Low power losses, high efficiency


    Original     		PDF V4PAN50 J-STD-020, DO-221BC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: PATT www.vishay.com Vishay Dale Thin Film Precision Automotive High Temperature 155 °C at full rated power Thin Film Chip Resistor, AEC-Q200 Qualified FEATURES • • • • • • The terminations consist of an adhesion layer, a leach resistant nickel barrier and gold plating compatible with high


    Original     		PDF AEC-Q200 MIL-STD-202, 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

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    Abstract: No abstract text available
    Text: RCA e3 www.vishay.com Vishay Draloric Automotive, Sulfur Resistant Lead Pb -Free Thick Film, Rectangular Chip Resistors FEATURES • • • • Superior resistance against H2S-atmosphere Stability R/R = 1 % for 1000 h at 70 °C Metal glaze on high quality ceramic


    Original     		PDF AEC-Q200 RCA0402 RCA0603 RCA0805 RCA1206 RCA1210 RCA1218 RCA2010 RCA2512 2002/95/EC.

    Untitled

    Abstract: No abstract text available
    Text: F-213 Rev 31-JUL-13 MEC1–120–02–F–D–A MEC1–130–02–F–D–A (1,00 mm) .0394" MEC1–140–02–L–D MEC1 SERIES MINI EDGE CARD SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC1 Insulator Material:


    Original     		PDF F-213 31-JUL-13)

    Untitled

    Abstract: No abstract text available
    Text: V8PAN50 www.vishay.com Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier FEATURES • Very low profile - typical height of 0.95 mm • Ideal for automated placement TMBS SMPATM • Trench MOS Schottky technology • Low power losses, high efficiency


    Original     		PDF V8PAN50 J-STD-020, DO-221BC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: V8PAL50 www.vishay.com Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier FEATURES • Very low profile - typical height of 0.95 mm • Ideal for automated placement TMBS SMPATM • Trench MOS Schottky technology • Low power losses, high efficiency


    Original     		PDF V8PAL50 J-STD-020, DO-221BC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12