normal diode

Contextual Info: M34513T-PTCA Converter for Connecting 32-pin 1.778mm-pitch SDIP for 4500 Series External View and Dimensions Function This converter connects 50-conductor normal-pitch cable to 32-pin 1.778mm-pitch SDIP(32P6U-A). The 50-conductor normal-pitch cable is included emulators of 4500series.

ic59-64075-G4

Abstract: Yamaichi IC51-0804-808 IC51-1004-809 IC51-0644-807 IC51-0242-802 IC51-0644-807 Datasheet socket Yamaichi ic51 qfp IC51-0804-808 Yamaichi Electronics IC51-1004-814-6
Contextual Info: Appendix F List of MCU Connecting Parts Made by Partners Pin-pitch mm Package form Mounting socket SSOP 0.65 20P2E-A 20P2F-A - SOP 1.27 20P2N-A - SSOP 0.8 24P2Q-A - LQFP 0.8 32P6B-A 32P6U-A - SDIP 1.778 32P4B IC83-3204-GG4 (made by Yamaichi Electronics Co., Ltd.)

LQFP32-P-0707-0

Abstract: 32P6U-a
Contextual Info: R8C/10 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/13 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material

32P6U-A

Contextual Info: R8C/11 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

PLQP0032GB-A

Abstract: P-LQFP32 32P6U-A lqfp32 91ze 1D24
Contextual Info: JEITA Package Code P-LQFP32-7x7-0.80 RENESAS Code PLQP0032GB-A Previous Code 32P6U-A MASS[Typ.] 0.2g HD *1 D 24 17 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 16 25 bp c c1 HE *2 E b1 Reference

32P6U-A

Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/12 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material

M37544M2-XXXGP

Abstract: Nippon capacitors
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. 7544 Group REJ03B0012-0102Z Rev.1.02 2003.06.25 SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • The 7544 Group is the 8-bit microcomputer based on the 740 family core technology.

LED04

Abstract: 450 khz ceramic filter Nippon capacitors
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. 7542 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION FEATURES • • • • • • • • • • Basic machine-language instructions . 71

R8C-13

Abstract: R5F21133DFP R5F2113 R5F21134DFP
Contextual Info: REJ09B0111-0120 R8C/13 Group 16 Hardware Manual RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY/R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

Contextual Info: User’s Manual The sales of these products are limited for China, Hong Kong, and India. R7F0C01072DNP, 16 R7F0C010B2DFP-C User’s Manual: Hardware 16-Bit Single-Chip Microcontrollers All information contained in these materials, including products and product specifications,

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: R8C/33T Group RENESAS MCU 1. R01DS0046EJ0110 Rev.1.10 Apr 26, 2011 Overview 1.1 Features The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

Contextual Info: Datasheet R8C/M13B Group RENESAS MCU 1. R01DS0005EJ0200 Rev.2.00 Mar 19, 2012 Overview 1.1 Features The R8C/M13B Group of single-chip microcontrollers MCUs incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, the CPU core is capable of

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

fmr461

Contextual Info: REJ09B0019-0091Z R8C/10 Group 16 Hardware Manual RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C /Tiny SERIES Preliminary Before using this material, please visit our website to confirm that this is the most current document available. Rev. 0.91

R5F21112DFP

Abstract: R5F21114DFP R5F21112FP R5F21113DFP R5F21113FP R5F21114FP 007116 cmp03
Contextual Info: R8C/11 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0034-0110Z Rev.1.10 2003.09.08 1. Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions

fmr461

Contextual Info: REJ09B0110-0100Z R8C/12 Group 16 Hardware Manual RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C /Tiny SERIES Rev. 1.00 Revision date: Sep 10, 2004 www.renesas.com Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products

R5F21134DFP

Abstract: R5F21132DFP R5F21133FP 10MHZ 20MHZ R5F21132FP R5F21133DFP R5F21134FP 00AD16
Contextual Info: R8C/13 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0069-0110 Rev.1.10 Apr 27, 2005 1. Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions

CMP-01

Abstract: 32P6U-A CMP10
Contextual Info: R8C/11 Group 1. Overview 1.5 Pin Assignments Figure 1.3 shows the pin configuration top view . P30/CNTR0/CMP10 AVSS P31/TZOUT/CMP11 AVCC/VREF P32/INT2/CNTR1/CMP12 P33/INT3/ TCIN P07/AN0 IVCC PIN CONFIGURATION (top view) 24 23 22 21 20 19 18 17 P06/AN1 P05/AN2

IBM REV 2.8 manual

Abstract: IBM REV 2.7 user manual IBM REV 2.8 472K LHA-0812-472K ibm rev 1.5 MANUAL 32PIN 5K58
Contextual Info: REJ10J0537-0120 M16C Flash Starter User's Manual R8C/Tiny Series 32PIN Example Circuit RENESAS SINGLE-CHIP MICROCOMPUTER M16C Family Rev.1.20 2006.12.01 Revision date: Dec 01, 2006 Renesas Solutions Corp. http://www.renesas.com/ 1. Using MF_Ten-Nine Cable

017BH

Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/33A Group REJ03B0228-0001 Rev.0.01 Oct 26, 2007 RENESAS MCU 1. Overview 1.1 Features The R8C/33A Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated

R8C-13

Abstract: cmp03 VC271 R5F21133FP R5F2113 R8C/13 ring oscillator design R5F21132DFP R5F21132FP R5F21133DFP
Contextual Info: R8C/13 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0069-0020Z Rev.0.20 2003.12.05 1. Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions

CQ 10.000 crystal oscillator

Abstract: R5F21122DFP R5F21122FP R5F21123DFP R5F21123FP R5F21124DFP R5F21124FP 007916 ring oscillator
Contextual Info: R8C/12 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0068-0020Z Rev.0.20 2003.12.05 1. Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions