UPD70F3341GC(A)-UEU-AX
Renesas Electronics Corporation
32-bit Microcontrollers
68033-415HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
133-411C-11D
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Direct Orthogonal, Double End Wall, 1.5mm Wipe, Nickel Sulfamate.
133-411E-21D
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 12 Column, Direct Orthogonal, Double End Wall, 2.25mm Wipe, Nickel Sulfamate.
133-411A-21H
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Direct Orthogonal, Double End Wall, 2.25mm Wipe, APP.
