Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    35NCM Search Results

    SF Impression Pixel

    35NCM Price and Stock

    3M Interconnect 7100071645

    Adhesive Tapes POLYIMIDE FILM ELECT TAPE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 7100071645 Spool 12
    • 1 -
    • 10 -
    • 100 $73.24
    • 1000 $73.24
    • 10000 $73.24
    Buy Now

    35NCM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 6 5 4 3 2 1 28 A/F CABLE Ø 14-16 D 53 *77,2 `1 D C 15,2 C 4-40UNC 75,6 Ø31 B 23,8 61,1 B NOTES: 1. MATERIALS: HOOD: PBT GF UL94 V-0 BLACK FRONTSEALING: SILICONE VMQ BLUE SCREW: STAINLESS STEEL O-RING: NBR BLACK 2. TEMPERATURE RANGE: -30°C TO +90°C 3. RECOMMENDED TORQUE FOR SCREW:


    Original
    PDF 4-40UNC 35Ncm 68Ncm 2002/95/EC 4-40UNC 15K1A1439

    Untitled

    Abstract: No abstract text available
    Text: 6 5 4 3 2 1 24 A/F CABLE Ø 10-12 D 44 52 *67,7± 1 D C C 4-40UNC 62 21 Ø27 47,04 B B Directive 2002/95/EC RoHS compliant 6 5 DO NOT ALTER CAD DRAWING BY HAND A THIS DRAWING MAY NOT BE COPIED OR REPRODUCED IN ANY WAY, AND MAY NOT BE PASSED ON TO A THIRD PARTY WITHOUT


    Original
    PDF 4-40UNC 2002/95/EC 35Ncm 68Ncm 4-40UNC 15K1A1440 15K1A1154

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 78 +- 0,3 5:1 0,4 8,6 +- 0,3 D 3,6 +- 0,25 b 5,99 +- 00,3 11,2 +- 0,4 0,3 11,5 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 37pos. 15K1A308

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A NOTES: 1,04 15x D (5:1) 9,5 +- 0,4 0,3 0,4 12 +- 0,3 D 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50 in NICKEL PLATING over COPPER


    Original
    PDF D2000 2002/95/EC 15pos. 15K1A281

    Untitled

    Abstract: No abstract text available
    Text: F E D C B NOTES: n1,16 9x (5:1) 10,34 +- 0,4 0,3 D 39,4 +- 0,3 3,6 +- 0,25 b 0,17 6,13 +- 0,08 D 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50µin NICKEL PLATING over COPPER


    Original
    PDF D2000 15K1A279

    Untitled

    Abstract: No abstract text available
    Text: F b E D C B A c NOTES: 47,7 +- 0,3 5:1 8,6 +- 0,4 0,3 D 3,6 +- 00,25 c 0,17 6,13 +- 0,08 11,5 +- 0,4 0,3 11,93 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 15pos. 15K1A268

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 39,4 +- 0,3 5:1 8,6 +- 0,4 0,3 D 3,6 +- 00,25 b 0,17 6,13 +- 0,08 11,5 +- 0,4 0,3 11,93 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 15K1A276

    Untitled

    Abstract: No abstract text available
    Text: F E D C B n1,12 25x NOTES: (5:1) 10,31 +- 0,4 0,3 D b 3,6 +- 0,25 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50µin NICKEL PLATING over COPPER


    Original
    PDF D2000 25pos. 15K1A291

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A c b NOTES: 47,7 +- 0,3 POS. 1 5:1 D 8,6 +- 0,4 0,3 c 3,6 +- 0,25 6 +- 0,18 0,12 0,4 11,5 +- 0,3 12,23 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 26pos 15K1A265

    Untitled

    Abstract: No abstract text available
    Text: F b E D C B A c NOTES: 47,7 +- 0,3 C 5:1 8,6 +- 0,4 0,3 D 3,6 +- 00,25 0,12 c 6 +- 0,18 11,2 +- 0,4 0,3 11,5 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 15pos. 15K1A269

    Untitled

    Abstract: No abstract text available
    Text: F E D C d 61,4 +- 0,3 C A 4,74 `0,3 6,35 `0,3 D 10,21 +- 0,4 0,3 5:1 3,6 +- 00,25 d 6,13 +- 0,17 0,08 10,75 +- 0,4 0,3 0,4 13,5 +- 0,3 13,05 +- 0,4 0,3 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.)


    Original
    PDF D2000 25pos. 15K1A300

    Untitled

    Abstract: No abstract text available
    Text: F E D C A c 61,4 +- 0,3 C 4,85 `0,3 6,35 `0,3 D 0,4 10,23 +- 0,3 5:1 3,6 +- 0,25 c 5,99 +- 0,3 10,75 +- 0,4 0,3 13,5 +- 0,4 0,3 13,07 +- 0,4 0,3 1. FOR WAVESOLDERING (SOLDER BATH TEMERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67


    Original
    PDF D2000 25pos. 15K1A299

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 5:1 8,6 +- 0,4 0,3 D 39,4 +- 0,3 3,6 +- 00,25 b 0,17 6,13 +- 0,08 11,5 +- 0,4 0,3 12,13 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 15pos. 15K1A278

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A c NOTES: 61,4 +- 0,3 C 5:1 0,4 8,6 +- 0,3 D 3,6 +- 0,25 c 0,17 6,13 +- 0,08 11,5 +- 0,4 0,3 12,13 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 44pos. 15K1A297

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A n1,16 5:1 7,1 `0,3 SEALING COMPOUND D 5,73 +- 00,25 3,6 +- 0,1 D 39,4 +- 0,2 24,99 +- 0,13 0,12 0,02 8 +- 0,23 16,41 +- 0,05 0,2 C 21,1 +- 00,2 C AT ALL TIMES WATER RESISTANT CONNECTORS NOT IN USE SHOULD BE COVERED WITH A CONEC WATER RESISTANT CAP OR WATER TIGHT HOOD.


    Original
    PDF 35Ncm 40Ncm 8STD09SCM99B30X 15K1A240 8STD09SCM99B30X

    Untitled

    Abstract: No abstract text available
    Text: F E D C B NOTES: 61,4 +- 0,3 POS. 1 C 47,04 POS. 16 1,04 44x (5:1) 9,6 +- 0,4 0,3 D 3,6 +- 0,25 b 5,99 +- 00,3 12,1 +- 0,4 0,3 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING


    Original
    PDF D2000 2002/95/EC 44pos. 15K1A296

    Untitled

    Abstract: No abstract text available
    Text: F E D C B NOTES: n1,16 37x (5:1) 0,4 10,34 +- 0,3 D 3,6 +- 0,25 b 0,17 6,13 +- 0,08 D 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50µin NICKEL PLATING over COPPER


    Original
    PDF D2000 37pos. 15K1A314

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 47,7 +- 0,3 1,04 26x (5:1) 9,5 +- 0,4 0,3 D 3,6 +- 0,25 c 6,13 +- 0,17 0,08 12 +- 0,4 0,3 D 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING


    Original
    PDF D2000 2002/95/EC 26pos. 15K1A273

    Untitled

    Abstract: No abstract text available
    Text: E D C 1. FOR WAVESOLDERING SOLDER BATH TEMPERATURE 240°C FOR 5 SEC. AND SOLDER PREHEAT 120°C FOR 120 SEC. 2. METALSHELLS: COPPER ALLOY; min. 315µin TIN over 40-80µin NICKEL 3. SEALING COMPOUND: PUR; BLUE 4. INSULATORS: PBT GF UL 94 V-0; BLACK n0,6 `0,05 (9x)


    Original
    PDF COPPER/40-120Â NICKEL/120-200Â 15K1A756

    Untitled

    Abstract: No abstract text available
    Text: F E D C A c 78 +- 0,3 C 4,74 `0,3 6,35 `0,3 5:1 0,4 10,21 +- 0,3 D 3,6 +- 0,25 c 0,17 6,13 +- 0,08 10,75 +- 0,4 0,3 0,4 13,5 +- 0,3 13,05 +- 0,4 0,3 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67


    Original
    PDF D2000 37pos. 15K1A319

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 5:1 8,6 +- 0,4 0,3 D 61,4 +- 0,3 POS. 1 C 3,6 +- 0,25 b 5,99 +- 00,3 11,5 +- 0,4 0,3 12,23 +- 0,4 0,3 D 1. FOR WAVESOLDERING (SOLDER BATH TEMPERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI


    Original
    PDF D2000 44pos. 15K1A298

    Untitled

    Abstract: No abstract text available
    Text: F E D C b B d C 47,7 +- 0,3 4,85 `0,3 6,35 `0,3 D 10,23 +- 0,4 0,3 5:1 10,75 +- 0,4 0,3 3,6 +- 0,25 d 0,12 6 +- 0,18 13,07 +- 0,4 0,3 13,5 +- 0,4 0,3 1. FOR WAVESOLDERING (SOLDER BATH TEMERATURE 265°C FOR 8 SEC. AND SOLDER PREHEAT 150°C FOR 180 SEC.) 2. IP RATING: IP 67


    Original
    PDF D2000 15pos. 15K1A256

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A b NOTES: 5:1 D 10,31 +- 0,4 0,3 D n1,12 (15x) 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50µin NICKEL PLATING over COPPER


    Original
    PDF D2000 15pos. 15K1A261

    Untitled

    Abstract: No abstract text available
    Text: F E D C B A NOTES: 1,04 44x (5:1) D 9,5 +- 0,4 0,3 12 +- 0,4 0,3 D 1. RECOMMENDED SOLDER INSTRUCTION SEE SHEET 2 2. IP RATING: IP 67 3. SEALED TO WITHSTAND PRESSURE UP TO 1,45 PSI FOR 30 MINUTES AFTER SOLDERING 4. METALSHELL: ZINC DIE CAST; min. 50 in NICKEL PLATING over COPPER


    Original
    PDF D2000 2002/95/EC 44pos. 15K1A304