Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable
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Original
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TS-1121-C
RIA-2217B-E
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer
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Original
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TS-1122-03
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer
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Original
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TS-1122-04
RIA-2217-A
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable
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Original
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TS-1121-04
RIA-2217-A
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PDF
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TG30
Abstract: TR30 TS-1121-B
Text: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable
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Original
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TS-1121-B
RIA-2217B-E
TG30
TR30
TS-1121-B
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for “pizza box” applications • Ideal for hot swapping applications
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Original
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TS-1124-C
RIA-2217B-E
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PDF
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1117 B
Abstract: 1117b TG30 TR30 3M MP2
Text: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position
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Original
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TS-1117-B
RIA-2217B-E
1117 B
1117b
TG30
TR30
3M MP2
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PDF
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TS-1117-06
Abstract: TG30 TR30
Text: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position
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Original
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TS-1117-06
RIA-2217-A
TS-1117-06
TG30
TR30
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • High-profile/high pin count • Ideal for parallel stacking applications • Vertical receptacle
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Original
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TS-1118-04
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • High-profile/high pin count • Ideal for parallel stacking applications • Vertical receptacle
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Original
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TS-1118-05
RIA-2217-A
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position
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Original
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TS-1117-05
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position
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Original
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TS-1117-C
RIA-2217B-E
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PDF
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MP2-SXXXG-51XX-XXXX
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for "pizza box" applications • Ideal for hot swapping applications
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Original
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TS-1124-04
RIA-2217-A
MP2-SXXXG-51XX-XXXX
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PDF
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3M MP2
Abstract: No abstract text available
Text: 3M MetPak 2-FB Shroud 2 mm Backplane, Rear Plug MP2 Series S Ideal for backplane plug-up/feed-through applications S Available in three stand-off heights Date Modified: May 30, 2003 TS-1130-01 Sheet 1 of 3 Physical Insulation Material: High Temp LCP
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Original
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TS-1130-01
E68080
3M MP2
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer
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Original
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TS-1122-C
RIA-2217B-E
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA)
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Original
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TS-1125-D
RIA-2217B-E
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • • • • • • 16 mm to 18.5 mm high-profile stacking Pin counts up to 300 Footprint compatible with standard Futurebus+ Ideal for hot swapping applications
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Original
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TS-1123-C
RIA-2217B-E
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force High-profile/high pin count Ideal for parallel stacking applications
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Original
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TS-1118-C
RIA-2217B-E
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PDF
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TG30
Abstract: TR30 TS-1122
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer
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Original
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TS-1122-B
RIA-2217B-E
TG30
TR30
TS-1122
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle • • • • • • • • • MP2 Series End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable
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Original
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TS-1115-D
RIA-2217B-E
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See Regulatory Information Appendix (RIA)
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Original
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TS-1125-04
RIA-2217-A
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PDF
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle MP2 Series • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable
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Original
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TS-1115-05
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PDF
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TG30
Abstract: TR30 ria 15 3M MP2
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • • • • • • 16 mm to 18.5 mm high-profile stacking Pin counts up to 300 Footprint compatible with standard Futurebus+ Ideal for hot swapping applications
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Original
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TS-1123-B
RIA-2217B-E
TG30
TR30
ria 15
3M MP2
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PDF
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MP2F
Abstract: 40af 91631 MP2-S1206-51M1-TFB0 h17a tba 2218 TGS0 til 701 HB125 til 31a
Text: 3M 3M Backplane and CompactFlash w Connectors MetPak™ 2 HM Sockets and Headers E 4 « q u i» * u | ^ 1 ü F l|.2 iH t t o ix u n U r . F l|. 3 ^R g .S F I ,. 4 & “ R g .6 1119: : » ir m u m h rru r n r» r a n ; U O iW X Female Sockel. Right Angle. PCB Press Fit Term inals. Shielded Ground
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OCR Scan
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CP2-SA110-G1-T6Â
CP2-SB110-G1-T6Â
CP2-SB125-G1-T6Â
CP2-HA11frfiE1-T6Â
HSM-M516TC-M-W
HSM-M516TC-40-W
HlEM-ft51
H7EM-ti516T.
618-0294l
-8216-Ot
MP2F
40af
91631
MP2-S1206-51M1-TFB0
h17a
tba 2218
TGS0
til 701
HB125
til 31a
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PDF
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