3P2M SCR Search Results

3P2M SCR Result Highlights (5)

Part	Manufacturer	Description
P104	Coilcraft Inc	Silicon Controlled Rectifier,
03P2M-AZ	Renesas Electronics Corporation	Thyristors for Phase Control, TO-92, /
03P2M-T-AZ	Renesas Electronics Corporation	Thyristors for Phase Control, TO-92, /Adhesive Tape
FSASF214E2	Amphenol Communications Solutions	Mini SAS, High Speed Input Output Connector, 1X2 CAGE ASSY 0 DEG NO SCR
CR08AS-12AET14#B10	Renesas Electronics Corporation	600V - 0.8A - Thyristor Low Power Use

3P2M SCR Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF
PPAP level submission requirement table Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage	Original	PDF
nec 3p4m Abstract: 3P4M nec 3p6m 3P4M scr nec 3p5m 3P2M 3P6M 3P1M nec 3p5m nec 3P1M Text: NEC GLA SS PASSIVATED 3A 4.7Arms M0LD SCR ELECTRON DEVICE 3P1 M,3P2M,3P4M,3P5M,3P6M The 3P1M~3P6M are P-gate all diffused mold type SCR granted average OUTLINE DRAWING (U nit : mm) on-state current 3 Amps (Tc = 87°C). Being applied glassivation technique	OCR Scan	PDF
NEC 3P4MH Abstract: nec 3p4m 3P4M 3P2M 3p4mh 3P1MH 3P4M scr 3P1M Text: NEC GLASS PASSIVATED 3A 4.7Arm s MOLD SCR ELECTRON DEVICE 3P1 M H ,3 P 2 M H ,3 P 4 M H The 3P1MH ~ 3P4MH are P-gate all diffused m old ty p e SCR granted average on-state current 3 Amps (T c = 87°C). O U T L IN E D R A W IN G (Unit : mm) Being applied glassivation	OCR Scan	PDF

Catalog Datasheet

MFG & Type

PDF

Document Tags

PPAP level submission requirement table

Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage

Original

PDF

nec 3p4m

Abstract: 3P4M nec 3p6m 3P4M scr nec 3p5m 3P2M 3P6M 3P1M nec 3p5m nec 3P1M
Text: NEC GLA SS PASSIVATED 3A 4.7Arms M0LD SCR ELECTRON DEVICE 3P1 M,3P2M,3P4M,3P5M,3P6M The 3P1M~3P6M are P-gate all diffused mold type SCR granted average OUTLINE DRAWING (U nit : mm) on-state current 3 Amps (Tc = 87°C). Being applied glassivation technique

OCR Scan

PDF

NEC 3P4MH

Abstract: nec 3p4m 3P4M 3P2M 3p4mh 3P1MH 3P4M scr 3P1M
Text: NEC GLASS PASSIVATED 3A 4.7Arm s MOLD SCR ELECTRON DEVICE 3P1 M H ,3 P 2 M H ,3 P 4 M H The 3P1MH ~ 3P4MH are P-gate all diffused m old ty p e SCR granted average on-state current 3 Amps (T c = 87°C). O U T L IN E D R A W IN G (Unit : mm) Being applied glassivation

OCR Scan

PDF